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A method of making a resonant frequency tag which resonates at a predetermined frequency. The method involves providing a first conductive pattern having an inductive element and a first land and a second conductive pattern having a second land and a third land which are joined together by a link. T

A method of making a resonant frequency tag which resonates at a predetermined frequency. The method involves providing a first conductive pattern having an inductive element and a first land and a second conductive pattern having a second land and a third land which are joined together by a link. The second conductive pattern is overlaid the first conductive pattern such that the second land is positioned over the first land. The third land is in electrical communication with the inductive element of the first conductive pattern. The formed resonant frequency tag is energized to determine if the tag resonates at the predetermined frequency. If the tag resonates properly, the third land is electrically coupled to the inductive element. If it does not, the second conductive pattern is adjusted so that overlapping portions of the first and second lands are changed, altering the capacitance to adjust the resonant tag frequency.

대표청구항 ▼

We claim: 1. A method of making a resonant frequency tag which resonates at a desired frequency, the method comprising the steps of: (a) forming a first conductive pattern comprising an inductive element and a first land, the first land having a first end connected to one end of the inductive eleme

We claim: 1. A method of making a resonant frequency tag which resonates at a desired frequency, the method comprising the steps of: (a) forming a first conductive pattern comprising an inductive element and a first land, the first land having a first end connected to one end of the inductive element, and a second end spaced a predetermined distance from the first end; (b) separately forming a second conductive pattern comprising a second land and a link element, the second land having a predetermined width; (c) placing the second conductive pattern proximate to the first conductive pattern at a first predetermined location so that the second land overlies at least a portion of the first land with a dielectric therebetween to establish the plates of a capacitive element with a predetermined capacitance which with the inductive element forms a resonant circuit; (d) measuring a resonant frequency of the resonant circuit and comparing the measured frequency with the desired frequency; and (e) if the resonant frequency does not match the desired frequency within a selected tolerance, moving the second conductive pattern so that the second land moves along a length of the first land to thereby change the capacitance of the capacitive element, whereas if the resonant frequency does match the desired frequency, securing the second conductive pattern to the first conductive pattern. 2. The method of claim 1 further comprising the steps of: (f) repeating steps (d) and (e) until a match occurs; and (g) securing the second conductive pattern to the first conductive pattern. 3. The method as recited in claim 2, wherein the first land has a width which decreases when moving along the length from one end to the other end. 4. The method as recited in claim 3, wherein the second land is generally rectangular and has a length which exceeds the greatest width of the first land. 5. The method as recited in claim 2, wherein the second conductive pattern is secured to the first conductive pattern by one of an adhesive and hot pressing. 6. The method as recited in claim 5, wherein the second conductive pattern is secured to the first conductive pattern by applying pressure, the amount of applied pressure being varied to control the resonant frequency of the tag. 7. The method as recited in claim 2, wherein the second conductive pattern, once formed, is initially held on a carrier sheet. 8. The method as recited in claim 2, wherein the second conductive pattern includes the dielectric layer which is placed between the second land and the first land prior to securing the second conductive pattern to the first conductive pattern. 9. The method as recited in claim 2, wherein the link element comprises a first section connected to the second land and a second section, the first and second sections of the link element being spaced apart by a gap of a predetermined minimum width further comprising an integrated circuit including at least a first lead electrically connected to the first section of the link element and a second lead electrically connected to the second section of the link element. 10. The method as recited in claim 9, wherein the integrated circuit is secured to one of the first and second section of the link element. 11. The method as recited in claim 1, wherein the first land has a width which decreases when moving along the length from one end to the other end. 12. The method as recited in claim 11, wherein the second land is generally rectangular and has a length which exceeds the greatest width of the first land. 13. The method as recited in claim 1, wherein the second conductive pattern is secured to the first conductive pattern by one of an adhesive and hot pressing. 14. The method as recited in claim 13, wherein the second conductive pattern is secured to the first conductive pattern by applying pressure, the amount of applied pressure being varied to control the resonant frequency of the tag. 15. The method as recited in claim 1, wherein the second conductive pattern, once formed, is initially held on a carrier sheet. 16. The method as recited in claim 1, wherein the second conductive pattern includes a the dielectric layer which is placed between the second land and the first land prior to securing the second conductive pattern to the first conductive pattern. 17. The method as recited in claim 1, wherein the link element comprises a first section connected to the second land and a second section, the first and second sections of the link element being spaced apart by a gap of a predetermined minimum width further comprising an integrated circuit including at least a first lead electrically connected to the first section of the link element and a second lead electrically connected to the second section of the link element. 18. The method as recited in claim 17, wherein the integrated circuit is secured to one of the first and second section of the link element.