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Provided are a glass for a window which glass is suitably fitted to a semiconductor package made of a plastic and a glass window for the semiconductor package which glass window has various functions, the glass (1) being for use as a window material for a semiconductor package made of a plastic and

Provided are a glass for a window which glass is suitably fitted to a semiconductor package made of a plastic and a glass window for the semiconductor package which glass window has various functions, the glass (1) being for use as a window material for a semiconductor package made of a plastic and having an average linear expansion coefficient of 120×10-7/° C. to 180×10-7/° C. at a temperature of 100 to 300° C., or (2) the glass having the above average linear expansion coefficient and having a U content of 5 ppb or less and a Th content of 5 ppb or less, and the glass window (a) being formed of the above glass for a window, (b) having the function of a lens and the above average linear expansion coefficient, or being formed of a glass (c) having the above average linear expansion coefficient and having a U content of 5 ppb or less and a Th content of 5 ppb or less and containing Cu and phosphorus oxide, the glass window being capable of exhibiting a transmittance of 50% at a wavelength of 630 nm or less in terms of a spectral transmittance at a wavelength of 400 to 700 nm when the glass has a thickness of 0.5 mm.

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The invention claimed is: 1. A glass for a window of a semiconductor package, which is for use as a window material for a semiconductor package made of a plastic and has an average linear expansion coefficient of 120×10-7/° C. to 180×10-7/° C. at a temperature of 100 to 300° C. and contains Cu and

The invention claimed is: 1. A glass for a window of a semiconductor package, which is for use as a window material for a semiconductor package made of a plastic and has an average linear expansion coefficient of 120×10-7/° C. to 180×10-7/° C. at a temperature of 100 to 300° C. and contains Cu and phosphorus oxide in which a wavelength which exhibits a transmittance of 50% is 630 nm or less in terms of a spectral transmittance at a wavelength of 400 to 700 nm when the glass has a thickness of 0.5 mm. 2. A glass for a window of a semiconductor package, having an average linear expansion coefficient of 120×10-7/° C. to 180×10-7/° C. at a temperature of 100 to 300° C. and having a U content of 5 ppb or less and a Th content of 5 ppb or less. 3. A glass window for a semiconductor package, having a lens function and having an average linear expansion coefficient of 120×10-7/° C. to 180×10-7/° C. at a temperature of 100 to 300° C. and contains Cu and phosphorus oxide in which a wavelength which exhibits a transmittance of 50% is 630 nm or less in terms of a spectral transmittance at a wavelength of 400 to 700 nm when the glass has a thickness of 0.5 mm. 4. A glass window for a semiconductor package, which is formed of a glass having an average linear expansion coefficient of 120×10-7/° C. to 180×10-7/° C. at a temperature of 100 to 300° C., having a U content of 5 ppb or less and a Th content of 5 ppb or less and containing Cu and phosphorus oxide, in which a wavelength which exhibits a transmittance of 50% is 630 nm or less in terms of a spectral transmittance at a wavelength of 400 to 700 nm when the glass window has a thickness of 0.5 mm. 5. A glass for a window of a semiconductor package, which is for use as a window material for a semiconductor package made of a plastic and has an average linear expansion coefficient of 120×10-7/° C. to 180×107/° C. at a temperature of 100 to 300° C. and, the glass contains, by cationic %, 23 to 41% of P5+, 4 to 16% of Al3+, 11 to 40% of Li+, 3 to 13% of Na+, 12to 53% of R2+(R2+stands for Mg2+, Ca2+ , Sr2+, Ba2+or Zn2+) and 2.6 to 4.7% of Cu2+ and contains F- and O2- as anionic components. 6. A process for the production of a glass window for a semiconductor package, which comprises precision-press-molding a lens-shaped window material glass made of a glass having an average linear expansion coefficient of 120×10-7/° C. to 180×10-7/° C. at a temperature of 100 to 300° C. and contains Cu and phosphorus oxide in which a wavelength which exhibits a transmittance of 50% is 630 nm or less in terms of a spectral transmittance at a wavelength of 400 to 700 nm when the glass has a thickness of 0.5 mm. 7. A glass window for a semiconductor package, which is made of the glass recited in claim 1, 2 or 5. 8. A semiconductor package comprising the glass window for a semiconductor package recited in claim 7, a semiconductor device and a package encasing the semiconductor device, the glass window having an attaching portion made of a plastic material. 9. A semiconductor package as recited in claim 8, wherein the semiconductor device is an image-sensing device. 10. A glass window for a semiconductor package, having a lens function and having an average linear expansion coefficient of 120×10-7/° C. to 180×10-7/° C. at a temperature of 100 to 300° C. and contains Cu and phosphorus oxide in which a wavelength which exhibits a transmittance of 50% is 630 nm or less in terms of a spectral transmittance at a wavelength of 400 to 700 nm when the glass has a thickness of 0.5 mm wherein the glass contains, by cationic %, 23 to 41% of P 5+, 4 to 16% of Al3+, 11 to 40 of Li+, 3 to 13% of Na+, 12 to 53% of R2+(R2+stands for Mg2+ , Ca2+, Sr2+, Ba2+or Zn2+) and 2. 6 to 4.7% of Cu2+ and contains F- and O2- as anionic components. 11. A process for the production of a glass window for a semiconductor package, which comprises precision-press-molding a lens-shaped window material glass made of a glass having an average linear expansion coefficient of 120×10-7/° C. to 180×10-7/° C. at a temperature of 100 to 300° C. and contains Cu and phosphorus oxide in which a wavelength which exhibits a transmittance of 50% is 630 nm or less in terms of a spectral transmittance at a wavelength of 400 to 700 nm when the glass has a thickness of 0.5 mm wherein the glass contains, by cationic %, 23 to 41% of P 5+, 4 to 16% of Al3+, 11 to 40% of Li30 , 3 to 13% of Na+, 12 to 53% of R2+(R2+ stands for Mg 2+, Ca2+, Sr2+, Ba2+or Zn2+) and 2.6 to 4.7% of Cu2+ and contains F- and O2- as anionic components. 12. The glass window for a semiconductor package as recited in claim 7, which is a precision press-molded product.