$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Process for production of SOI substrate and process for production of semiconductor device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-029/76
  • H01L-029/66
  • H01L-029/94
  • H01L-031/62
  • H01L-031/113
  • H01L-031/101
  • H01L-031/119
  • H01L-031/115
출원번호 US-0075687 (2005-03-10)
우선권정보 JP-10-214125(1998-07-29)
발명자 / 주소
  • Fukunaga,Takeshi
출원인 / 주소
  • Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
    Nixon Peabody LLP
인용정보 피인용 횟수 : 102  인용 특허 : 29

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (29)

  1. Kazuaki Ohmi JP; Kiyofumi Sakaguchi JP; Kazutaka Yanagita JP, Composite member its separation method and preparation method of semiconductor substrate by utilization thereof.
  2. Yamamoto Mitsuyoshi,JPX ; Kawasaki Ikuya,JPX ; Inayoshi Hideo,JPX ; Narita Susumu,JPX ; Kubo Masaharu,JPX, Data processor and single-chip microcomputer with changing clock frequency and operating voltage.
  3. Sakaguchi Kiyofumi,JPX ; Yonehara Takao,JPX, Fabrication process for a semiconductor substrate.
  4. Blake Terence G. W. (Dallas TX) Lu Hsindao (Dallas TX), High performance silicon-on-insulator transistor with body node to source node connection.
  5. Miyazawa Yoshihiro (Kanagawa JPX) Minami Eric (Tokyo JPX) Matsushita Takeshi (Kanagawa JPX), MIS semiconductor device formed by utilizing SOI substrate having a semiconductor thin film formed on a substrate throug.
  6. Klein Dean A., Memory controller with buffered CAS/RAS external synchronization capability for reducing the effects of clock-to-signal skew.
  7. Sato Nobuhiko,JPX, Method and apparatus for heat-treating an SOI substrate and method of preparing an SOI substrate by using the same.
  8. Hwang Jeong-Mo (Plano TX), Method for forming a silicon on insulator device.
  9. Hsu Ching-Hsiang (Hsin Chu TWX) Wong Shyh-Chyi (Taichang TWX) Liang Mong-Song (Hsinchu TWX) Chung Steve S. (Hsinchu TWX), Method of making a body contact for a MOSFET device fabricated in an SOI layer.
  10. Houston Theodore W. (Richardson TX), Method of making extended body contact for semiconductor over insulator transistor.
  11. Aspar Bernard,FRX ; Bruel Michel,FRX ; Poumeyrol Thierry,FRX, Method of producing a thin layer of semiconductor material.
  12. Hamajima Tomohiro,JPX ; Kikuchi Hiroaki,JPX, Method of producing bonded substrate with silicon-on-insulator structure.
  13. Nishida Shoji,JPX ; Yonehara Takao,JPX ; Sakaguchi Kiyofumi,JPX ; Iwane Masaaki,JPX, Process for producing solar cell, process for producing thin-film semiconductor, process for separating thin-film semiconductor, and process for forming semiconductor.
  14. Fukunaga Takeshi,JPX, Process for production of SOI substrate and process for production of semiconductor device.
  15. Fukunaga, Takeshi, Process for production of SOI substrate and process for production of semiconductor device.
  16. Bruel Michel,FRX, Process for the manufacture of thin films of semiconductor material.
  17. Bruel Michel (Veurey FRX), Process for the production of thin semiconductor material films.
  18. Shunpei Yamazaki JP; Takeshi Fukunaga JP, Semiconductor device.
  19. Yamazaki Shunpei,JPX ; Fukunaga Takeshi,JPX, Semiconductor device.
  20. Yamazaki, Shunpei; Fukunaga, Takeshi, Semiconductor device.
  21. Yamaguchi Yasuo (Hyogo JPX) Ajika Natsuo (Hyogo JPX) Yamano Tsuyoshi (Hyogo JPX), Semiconductor device and a method of manufacturing thereof.
  22. Konuma Toshimitsu,JPX ; Sugawara Akira,JPX ; Uehara Yukiko,JPX ; Zhang Hongyong,JPX ; Suzuki Atsunori,JPX ; Ohnuma Hideto,JPX ; Yamaguchi Naoaki,JPX ; Suzawa Hideomi,JPX ; Uochi Hideki,JPX ; Takemura, Semiconductor device and method for manufacturing the same.
  23. Konuma, Toshimitsu; Sugawara, Akira; Uehara, Yukiko; Zhang, Hongyong; Suzuki, Atsunori; Ohnuma, Hideto; Yamaguchi, Naoaki; Suzawa, Hideomi; Uochi, Hideki; Takemura, Yasuhiko, Semiconductor device and method for manufacturing the same.
  24. Hongyong Zhang JP; Akira Takenouchi JP; Hideomi Suzawa JP, Semiconductor integrated circuit and method for forming the same.
  25. Hongyong Zhang JP; Akira Takenouchi JP; Hideomi Suzawa JP, Semiconductor integrated circuit and method for forming the same.
  26. Noda Hiromasa,JPX ; Aoki Masakazu,JPX ; Idei Youji,JPX ; Kajigaya Kazuhiko,JPX ; Nagashima Osamu,JPX ; Itoh Kiyoo,JPX ; Horiguchi Masashi,JPX ; Sakata Takeshi,JPX, Semiconductor integrated circuit device and method of activating the same.
  27. Yonehara Takao (Atsugi JPX), Semiconductor member and process for preparing semiconductor member.
  28. Matloubian Mishel (Dallas TX), Sidewall channel stop process.
  29. Srikrishnan Kris V., Smart-cut process for the production of thin semiconductor material films.

이 특허를 인용한 특허 (102)

  1. Yamazaki, Shunpei, Display device, method for manufacturing display device, and SOI substrate.
  2. Yamazaki, Shunpei, Display device, method for manufacturing display device, and SOI substrate.
  3. Yamazaki, Shunpei, Heat treatment apparatus and method for manufacturing SOI substrate using the heat treatment apparatus.
  4. Ohnuma, Hideto, Manufacturing method of SOI substrate.
  5. Ohnuma, Hideto; Kakehata, Tetsuya; Shimomura, Akihisa; Sasagawa, Shinya; Kurata, Motomu, Manufacturing method of SOI substrate.
  6. Sekiguchi, Keiichi; Hanaoka, Kazuya; Ito, Daigo, Manufacturing method of SOI substrate.
  7. Miyairi, Hidekazu; Shimomura, Akihisa; Mizoi, Tatsuya; Higa, Eiji; Nagano, Yoji, Manufacturing method of SOI substrate and manufacturing method of semiconductor device.
  8. Miyairi, Hidekazu; Shimomura, Akihisa; Mizoi, Tatsuya; Higa, Eiji; Nagano, Yoji, Manufacturing method of SOI substrate and manufacturing method of semiconductor device.
  9. Miyairi, Hidekazu; Shimomura, Akihisa; Mizoi, Tatsuya; Higa, Eiji; Nagano, Yoji, Manufacturing method of SOI substrate and manufacturing method of semiconductor device.
  10. Shimomura, Akihisa; Miyairi, Hidekazu; Sato, Yurika, Manufacturing method of SOI substrate and manufacturing method of semiconductor device.
  11. Godo, Hiromichi, Manufacturing method of a semiconductor device including a single crystal semiconductor film, and a semiconductor film including impurity.
  12. Murakami, Satoshi; Godo, Hiromichi; Isobe, Atsuo, Manufacturing method of a semiconductor substrate using a damaged region.
  13. Yamazaki, Shunpei; Shichi, Takeshi; Suzuki, Naoki, Manufacturing method of semiconductor device.
  14. Yamazaki, Shunpei; Shichi, Takeshi; Suzuki, Naoki, Manufacturing method of semiconductor device.
  15. Ohnuma, Hideto; Yamazaki, Shunpei, Manufacturing method of semiconductor device, semiconductor device, and electronic device.
  16. Tanaka, Koichiro, Manufacturing method of semiconductor substrate.
  17. Yamazaki, Shunpei, Manufacturing method of semiconductor substrate and manufacturing method of semiconductor device.
  18. Ohnuma, Hideto, Manufacturing methods of semiconductor substrate, thin film transistor and semiconductor device.
  19. Ikeda, Hisao; Ibe, Takahiro; Koezuka, Junichi; Kato, Kaoru, Memory device and semiconductor device.
  20. Komatsu, Yoshihiro; Moriwaka, Tomoaki; Takahashi, Kojiro, Method for forming SOI substrate and apparatus for forming the same.
  21. Ohnuma, Hideto; Shingu, Takashi; Kakehata, Tetsuya; Kuriki, Kazutaka; Yamazaki, Shunpei, Method for manufacturing SOI substrate.
  22. Ohnuma, Hideto; Yamazaki, Shunpei, Method for manufacturing SOI substrate.
  23. Shimomura, Akihisa; Tokunaga, Hajime, Method for manufacturing SOI substrate.
  24. Suzawa, Hideomi; Sasagawa, Shinya; Shimomura, Akihisa; Momo, Junpei; Kurata, Motomu; Muraoka, Taiga; Nei, Kosei, Method for manufacturing SOI substrate.
  25. Suzawa, Hideomi; Sasagawa, Shinya; Shimomura, Akihisa; Momo, Junpei; Kurata, Motomu; Muraoka, Taiga; Nei, Kosei, Method for manufacturing SOI substrate.
  26. Yamazaki, Shunpei, Method for manufacturing SOI substrate.
  27. Yamazaki, Shunpei; Ohnuma, Hideto, Method for manufacturing SOI substrate and method for manufacturing semiconductor device.
  28. Yamazaki, Shunpei; Ohnuma, Hideto; Iikubo, Yoichi; Yamamoto, Yoshiaki; Makino, Kenichiro, Method for manufacturing SOI substrate and semiconductor device.
  29. Ohnuma, Hideto; Yamazaki, Shunpei, Method for manufacturing SOI substrate using cluster ion.
  30. Shimomura, Akihisa; Tsukamoto, Naoki, Method for manufacturing a semiconductor substrate by laser irradiation.
  31. Ikeda, Hisao; Ibe, Takahiro; Koezuka, Junichi; Kato, Kaoru, Method for manufacturing memory device.
  32. Kato, Sho; Isaka, Fumito; Kakehata, Tetsuya; Godo, Hiromichi; Shimomura, Akihisa, Method for manufacturing semiconductor device.
  33. Kato, Sho; Isaka, Fumito; Kakehata, Tetsuya; Godo, Hiromichi; Shimomura, Akihisa, Method for manufacturing semiconductor device.
  34. Yamazaki, Shunpei; Momo, Junpei; Isaka, Fumito; Higa, Eiji; Koyama, Masaki; Shimomura, Akihisa, Method for manufacturing semiconductor device.
  35. Kakehata, Tetsuya; Kuriki, Kazutaka, Method for manufacturing semiconductor substrate.
  36. Moriwaka, Tomoaki, Method for manufacturing semiconductor substrate.
  37. Nei, Kosei; Shimomura, Akihisa, Method for manufacturing semiconductor substrate.
  38. Yamazaki, Shunpei, Method for manufacturing semiconductor substrate.
  39. Yamazaki, Shunpei; Miyanaga, Akiharu; Inada, Ko; Iwaki, Yuji, Method for manufacturing semiconductor wafer.
  40. Yamazaki, Shunpei; Miyanaga, Akiharu; Inada, Ko; Iwaki, Yuji, Method for manufacturing semiconductor wafer.
  41. Yamazaki, Shunpei, Method for manufacturing substrate of semiconductor device.
  42. Hanaoka, Kazuya; Kimura, Shunsuke, Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing SOI substrate.
  43. Imahayashi, Ryota; Ohnuma, Hideto, Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing SOI substrate.
  44. Yamazaki, Shunpei; Ohtani, Hisashi, Method of fabricating a semiconductor device.
  45. Yamazaki, Shunpei; Ohtani, Hisashi, Method of fabricating a semiconductor device.
  46. Yamazaki, Shunpei; Ohtani, Hisashi, Method of fabricating a semiconductor device.
  47. Yamazaki, Shunpei; Ohtani, Hisashi, Method of fabricating a semiconductor device.
  48. Yamazaki, Shunpei; Ohtani, Hisashi, Method of fabricating a semiconductor device.
  49. Yamazaki, Shunpei; Ohtani, Hisashi, Method of fabricating a semiconductor device.
  50. Yamazaki,Shunpei; Ohtani,Hisashi, Method of fabricating a semiconductor device.
  51. Yamazaki,Shunpei; Ohtani,Hisashi, Method of fabricating a semiconductor device.
  52. Yamazaki,Shunpei; Ohtani,Hisashi, Method of fabricating a semiconductor device.
  53. Hanaoka, Kazuya; Tsuya, Hideki; Nagai, Masaharu, Method of manufacturing SOI substrate.
  54. Hanaoka, Kazuya; Tsuya, Hideki; Nagai, Masaharu, Method of manufacturing SOI substrate.
  55. Yamazaki, Shunpei; Higa, Eiji; Nagano, Yoji; Mizoi, Tatsuya; Shimomura, Akihisa, Method of manufacturing SOI substrate.
  56. Yamazaki, Shunpei; Higa, Eiji; Nagano, Yoji; Mizoi, Tatsuya; Shimomura, Akihisa, Method of manufacturing SOI substrate.
  57. Yamazaki, Shunpei; Ohnuma, Hideto, Method of manufacturing SOI substrate and method of manufacturing semiconductor device.
  58. Yamazaki, Shunpei, Method of manufacturing a semiconductor device.
  59. Yamazaki, Shunpei, Method of manufacturing a semiconductor device.
  60. Yamazaki, Shunpei, Method of manufacturing a semiconductor device.
  61. Yamazaki, Shunpei, Method of manufacturing a semiconductor device.
  62. Yamazaki, Shunpei, Method of manufacturing a semiconductor device.
  63. Yamazaki, Shunpei, Method of manufacturing a semiconductor device having a gate electrode formed over a silicon oxide insulating layer.
  64. Yamazaki, Shunpei, Method of manufacturing a semiconductor device including thermal oxidation to form an insulating film.
  65. Ohnuma, Hideto; Iikubo, Yoichi; Yamazaki, Shunpei, Method of manufacturing semiconductor device.
  66. Shimomura, Akihisa; Miyairi, Hidekazu, Method of manufacturing semiconductor device.
  67. Yamazaki, Shunpei, Method of manufacturing semiconductor device having island-like single crystal semiconductor layer.
  68. Yamazaki, Shunpei; Ohtani, Hisashi; Koyama, Jun; Fukunaga, Takeshi, Nonvolatile memory and electronic apparatus.
  69. Kato, Sho; Hiura, Yoshikazu; Shimomura, Akihisa; Ohtsuki, Takashi; Toriumi, Satoshi; Arai, Yasuyuki, Photoelectric conversion device and manufacturing method thereof.
  70. Kato, Sho; Hiura, Yoshikazu; Shimomura, Akihisa; Ohtsuki, Takashi; Toriumi, Satoshi; Arai, Yasuyuki, Photoelectric conversion device and manufacturing method thereof.
  71. Fukunaga, Takeshi, Process for production of SOI substrate and process for production of semiconductor device.
  72. Fukunaga, Takeshi, Process for production of SOI substrate and process for production of semiconductor device including the selective forming of porous layer.
  73. Ohnuma, Hideto; Hanaoka, Kazuya, Reprocessing method of semiconductor substrate, manufacturing method of reprocessed semiconductor substrate, and manufacturing method of SOI substrate.
  74. Kakehata, Tetsuya; Ohnuma, Hideto; Yamamoto, Yoshiaki; Makino, Kenichiro, SOI substrate and manufacturing method thereof.
  75. Kakehata, Tetsuya; Ohnuma, Hideto; Yamamoto, Yoshiaki; Makino, Kenichiro, SOI substrate and manufacturing method thereof.
  76. Kakehata, Tetsuya; Ohnuma, Hideto; Yamamoto, Yoshiaki; Makino, Kenichiro, SOI substrate and manufacturing method thereof.
  77. Yamazaki, Shunpei; Ohnuma, Hideto, SOI substrate and method for manufacturing SOI substrate.
  78. Yamazaki, Shunpei; Togawa, Maki; Arai, Yasuyuki, SOI substrate and method for manufacturing SOI substrate.
  79. Yamazaki, Shunpei; Togawa, Maki; Arai, Yasuyuki, SOI substrate and method for manufacturing SOI substrate.
  80. Ohnuma, Hideto; Kakehata, Tetsuya; Iikubo, Yoichi, SOI substrate, method for manufacturing the same, and semiconductor device.
  81. Ohnuma, Hideto; Kakehata, Tetsuya; Iikubo, Yoichi, SOI substrate, method for manufacturing the same, and semiconductor device.
  82. Ohnuma, Hideto; Kakehata, Tetsuya; Iikubo, Yoichi, SOI substrate, method for manufacturing the same, and semiconductor device.
  83. Yamazaki, Shunpei, Semiconductor device.
  84. Kimura, Hajime; Umezaki, Atsushi, Semiconductor device and display device.
  85. Isobe, Atsuo, Semiconductor device and method for manufacturing the same.
  86. Isobe, Atsuo, Semiconductor device and method for manufacturing the same.
  87. Isobe, Atsuo, Semiconductor device and method for manufacturing the same.
  88. Ohnuma, Hideto; Nomura, Noritsugu, Semiconductor device and method for manufacturing the same.
  89. Yamazaki, Shunpei; Koezuka, Junichi; Kakehata, Tetsuya, Semiconductor device and method for manufacturing the same.
  90. Yamazaki, Shunpei; Ohtani, Hisashi; Koyama, Jun; Fukunaga, Takeshi, Semiconductor device having buried oxide film.
  91. Kimura, Hajime, Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer.
  92. Kimura, Hajime, Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer.
  93. Kakehata, Tetsuya, Semiconductor device, electronic device and method for manufacturing semiconductor device.
  94. Yamazaki, Shunpei; Miyairi, Hidekazu, Semiconductor device, semiconductor display device, and manufacturing method of semiconductor device.
  95. Kakehata, Tetsuya, Semiconductor substrate and method for manufacturing the same.
  96. Kakehata, Tetsuya, Semiconductor substrate and method for manufacturing the same.
  97. Koyama, Masaki; Isaka, Fumito; Shimomura, Akihisa; Momo, Junpei, Semiconductor substrate and method for manufacturing the same, and method for manufacturing semiconductor device.
  98. Koyama, Masaki; Isaka, Fumito; Shimomura, Akihisa; Momo, Junpei, Semiconductor substrate and method for manufacturing the same, and method for manufacturing semiconductor device.
  99. Kakehata, Tetsuya; Kuriki, Kazutaka, Semiconductor substrate, method for manufacturing semiconductor substrate, semiconductor device, and electronic device.
  100. Yamazaki, Shunpei, Semiconductor substrate, semiconductor device and manufacturing method thereof.
  101. Kakehata, Tetsuya; Kuriki, Kazutaka, Substrate for manufacturing semiconductor device and manufacturing method thereof.
  102. Kakehata, Tetsuya; Kuriki, Kazutaka, Substrate for manufacturing semiconductor device and manufacturing method thereof.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로