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Longitudinally cooled electronic assembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0735467 (2003-12-12)
발명자 / 주소
  • Patel,Chandrakant D
출원인 / 주소
  • Hewlett Packard Development Company, LP.
인용정보 피인용 횟수 : 28  인용 특허 : 41

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (41)

  1. Tajima Tsuneaki (Tokyo JPX) Matsuo Yohichi (Tokyo JPX), Air cooling equipment for electronic systems.
  2. Beitelmal, Abdlmonem H; Patel, Chandrakant D., Air jet cooling arrangement for electronic systems.
  3. Patel Chandrakant D. ; Wagner Guy ; Beitelmal Abdlmonem H. ; Chavez Gustavo A., Apparatus and method for air-cooling an electronic assembly.
  4. Goldberg Norman (Dresher PA), Apparatus for cooling integrated circuit chips.
  5. Tisdale Michael J. (Claverdon GBX) Beck Susan A. (Willenhall GBX), Biologically active material characterized by catabolic activity generally associated with cachexia-inducing tumors, pre.
  6. Lin Mike (No. 56 ; Lane 55 Dong-Rong Rd. ; Sei-Rong Village Da-Lei Hsiang ; Tai-Chung Hsien TWX), CPU heat dissipating device.
  7. Wong, Henry, Cabinet for cooling electronic modules.
  8. Mayer David W., Cable management solution for rack-mounted computers.
  9. Baker, David A.; Bross, Kevin W., Chassis cooling system.
  10. David W. Mayer ; Porter Rodgers Arbogast, Computer enclosure rack mounting system.
  11. Spinazzola, R. Stephen; Peltz, Dennis L., Computer room air flow method and apparatus.
  12. Searby, Tom J, Configurable computer enclosure.
  13. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  14. Kondou Yoshihiro (Ibaraki JPX) Matsushima Hitoshi (Ryugasaki JPX) Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Komatsu Toshihiro (Ibaraki JPX) Ohba Takao (Hadano JPX) Yamagiwa Akira (Ha, Cooling apparatus of electronic equipment.
  15. Takemae Motohiro (Fujisawa JPX) Okada Tsuguo (Yokohama JPX) Yamamoto Haruhiko (Yokohama JPX), Cooling method control system for electronic apparatus.
  16. Moizer, William J., Cooling of electronic equipment enclosed within a security cabinet.
  17. Suzuki Masahiro (Kawasaki JPX) Fujisaki Akihiko (Kawasaki JPX) Ishimine Junichi (Kawasaki JPX), Cooling structure for integrated circuit element modules, electronic device and heat sink block.
  18. Bishop, Jerry; Nesler, Clay, Cooling system for electronic equipment cabinets.
  19. LaGrotta James T. ; LaGrotta Richard T., Direct air cooling of outdoor electronic cabinets.
  20. Gagnon Kevin M. (1668 Larwood Rd. Lemon Grove CA 91945) Goulter Victor H. (485 Molimo Dr. San Francisco CA 94127-1655), Dual filtered airflow systems for cooling computer components, with optimally placed air vents and switchboard control p.
  21. Yoshikawa Minoru,JPX, Electronic device cooling system having guides for guiding a flow of the air evenly.
  22. Sugiyama Akira,JPX ; Hoshino Tsutomu,JPX ; Yoshida Shinichi,JPX ; Joeng Tan Tjang,JPX, Electronic equipment.
  23. Higgins ; III. Leo M. (Middleboro MA), Heat sink apparatus.
  24. Giovanni Coglitore ; Nikolai Gallo ; Jack Randall, High density computer equipment storage system.
  25. Mira Ali (San Jose CA), High performance spiral heat sink.
  26. Kimura Hideyuki (Tsuchiura JPX) Takahashi Tsuyoshi (Odawara JPX) Suzuki Tomio (Hiratsuka JPX) Ohdaira Toshio (Odawara JPX) Uefune Kouki (Minamiashigara JPX) Nishimura Yuji (Odawara JPX), Magnetic disk storage system.
  27. Chu, Richard C.; Ellsworth, Jr., Michael J.; Furey, Edward; Schmidt, Roger R.; Simons, Robert E., Method and apparatus for combined air and liquid cooling of stacked electronics components.
  28. Modica, Steve, Method and rack for exchanging air with modular bricks in a computer system.
  29. Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Method and system for cooling electronics racks using pre-cooled air.
  30. Patel, Chandrakant D.; Beitelmal, Abdlmonem H.; Bash, Cullen E., Method, apparatus, and system for cooling electronic components.
  31. Bash, Cullen E.; Beitelmal, Abdlmonem H.; Patel, Chandrakant D., Modular sprayjet cooling system.
  32. Cullen E. Bash ; Abdlmonem H Beitelmal ; Ratnesh Sharma, Multi-load refrigeration system with multiple parallel evaporators.
  33. Cullen E. Bash ; Abdlmonem H Beitelmal ; Ratnesh Sharma, Multi-load refrigeration system with multiple parallel evaporators.
  34. Beitelmal, Abdlmonem H.; Bash, Cullen E.; Patel, Chandrakant D., Multi-load thermal regulating system having electronic valve control.
  35. Beitelmal, Abdlmonem H.; Bash, Cullen E.; Patel, Chandrakant D., Multi-load thermal regulating system with multiple serial evaporators.
  36. Bash, Cullen E.; Patel, Chandrakant D.; Beitelmal, Abdimonem; Sharma, Ratnesh K., Pressure control of cooling fluid within a plenum using automatically adjustable vents.
  37. Kaminski, Joseph W.; Hintz, Robert M., Rack assembly that does not require tools for coupling chassis to slide.
  38. Basara Michael (Milan NC ITX) Kneale Collan B. (Ashville NC) Lucente Samuel A. (Stamford CT) Natoli John (Woodstock NY), Rack based packaging system for computers with cable, cooling and power management module.
  39. Kammersqard Dana W. (Vista CA) Colson ; Jr. Angus R. (Jamul CA) Cook Steven B. (Vista CA), Rackmount for computer and mass storage enclosure.
  40. Patel, Chandrakant D.; Bash, Cullen E.; Beitelmal, Abdlmonem H., Smart cooling of data centers.
  41. Wray Donald L. (Lauderdale FL), Ventilation system for modular electronic housing.

이 특허를 인용한 특허 (28)

  1. Mumper, Robert Walters, Air cooling system for an electronics rack.
  2. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system.
  3. Shearman, Simon John Edward; Mayenburg, Anthony, Chassis arrangement systems and methods for dual depth cards and dual depth faraday cages.
  4. Miyahira,Frank, Computer equipment temperature control system and methods for operating the same.
  5. Keisling, Earl; Costakis, John; McDonneli, Gerald, Cooling systems for electrical equipment.
  6. Chang, Yao-Ting, Data center.
  7. Chang, Yao-Ting, Data center.
  8. Gravina, Matteo B., Data center cooling system having electrical power generation.
  9. Gravina, Matteo B., Data center cooling system having electrical power generation.
  10. Fujiya,Hiromitsu; Kimura,Hideki, Electronic apparatus.
  11. Hasse, Dirk; Bittner, Dirk, Enclosure element.
  12. Mayenburg, Anthony J.; Shearman, Simon J. E.; Bishop, Michael; Tabatchnik, Michael; Cosman, Lloyd, High density networking shelf and system.
  13. Mayenburg, Anthony J.; Shearman, Simon J. E.; Bishop, Michael; Tabatchnik, Michael; Cosman, Lloyd, High density networking shelf and system.
  14. Shearman, Simon John Edward; Mayenburg, Anthony John; Currie, Thomas Charles, High density switching platform with interbay connections arrangement.
  15. Leija,Javier; Lucero,Christopher D.; Gonzales,Christopher A., Liquid cooling system including hot-swappable components.
  16. Keisling, Earl; Costakis, John; McDonnell, Gerald, Modular IT rack cooling assemblies and methods for assembling same.
  17. Graczyk, Frank J.; Ramey, Samuel C.; Fleming, James N.; Herbst, Paul M.; McGrath, Michael J.; Wentworth, Joseph D.; Eaton, Alva B., Passive cooling systems for network cabinet.
  18. Hodes, Marc; Lyons, Alan Michael; Scofield, William Harold, Recirculating gas rack cooling architecture.
  19. Vanderveen, Anthony Siebe; Kilkenny, Daniel Kiernan, Side-exhaust cooling system for rack mounted equipment.
  20. VanDerVeen, Anthony Siebe; Kilkenny, Daniel Kiernan, Side-exhaust cooling system with extensible duct for rack mounted equipment.
  21. VanDerVeen, Anthony Siebe; Kilkenny, Daniel Kiernan, Side-exhaust cooling system with extensible duct for rack mounted equipment.
  22. Keisling, Earl; Costakis, John; McDonnell, Gerald, Space-saving high-density modular data pod systems and energy-efficient cooling systems.
  23. Keisling, Earl; Costakis, John; McDonnell, Gerald, Space-saving high-density modular data pod systems and energy-efficient cooling systems.
  24. Keisling, Earl; Costakis, John; McDonnell, Gerald, Space-saving high-density modular data pod systems and energy-efficient cooling systems.
  25. Keisling, Earl; Costakis, John; McDonnell, Gerald, Space-saving high-density modular data pod systems and energy-efficient cooling systems.
  26. Keisling, Earl; Costakis, John; McDonnell, Gerald, Space-saving high-density modular data systems and energy-efficient cooling systems.
  27. Fleming, James N.; Goldsberry, Timothy; Shurhay, Mark; Hibner, Max W., Thermal ducting system.
  28. Gravina, Matteo B., Thermal energy accumulator for power generation and high performance computing center.
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