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High density connector and method of manufacture 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-004/02
출원번호 US-0953631 (2001-09-14)
발명자 / 주소
  • Lemke,Timothy A.
  • Houtz,Timothy W.
출원인 / 주소
  • FCI Americas Technology, Inc.
인용정보 피인용 횟수 : 12  인용 특허 : 150

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (150)

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  6. Summers Donald J. (Shiremanstown PA) Correll ; Jr. Robert S. (Harrisburg PA) Dellinger Donald E. (Hellan PA), Board to board matable assembly.
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  31. Dinkel Jeffrey Allen (Greensboro NC) Orstad Richard E. (Greensboro NC) Trull Michael Paul (Winston-Salem NC), Electrical connector having a pivot lock.
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  32. Korsunsky Iosif (Harrisburg PA) Grabbe Dimitry G. (Middletown PA), Electrical connector having terminals which cooperate with an edge of a circuit board.
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  33. Fry Rupert J. (Des Plaines IL) Luthy John S. (Naperville IL), Electrical connector with improved terminal latching means.
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  34. Kachlic Jerry D. (Singapore IL SGX) Berg B. Alan (Mount Prospect IL), Electrical connector with solder mask.
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  35. Grappe Ren (Paris FRX), Electrical connectors, particularly connectors fluid-tight on immersion in a liquid.
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  36. Rush Derek A. (London GB2), Electrical contact elements, connectors and assemblies.
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  37. Marsh Edward K. (Orlando FL), Electrical contact for electrical connector assembly.
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  38. Ney Reuben E. (Mount Joy PA) Markle Kenneth E. (York PA) Zelko William E. (Dauphin PA), Electrical contact with recessed wire connecting portion.
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  39. Sanders Stuart E. (Brandon MS) Bauer Fred P. (Mendenhall MS), Electrical half connector with contact-centering vanes.
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  40. Pawlikowski Joseph M. (Lancaster PA), Electrical interconnection device.
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  41. Anastasio Paul J. (Camp Hill PA) English James M. (Annville PA) Farrar John C. (Harrisburg PA) Goel Ram P. (Camp Hill PA) Janoss Bernard J. (Harrisburg PA) Collins Christopher J. (Fremont CA) Childer, Electrical overstress protection apparatus and method.
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  42. Carter Richard (Swindon GB2) Collett Derrick (Swindon GB2), Electrically conductive polymer composition.
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  43. Nguyen Hung N. (Bensalem PA), Electronic device interconnection techniques.
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  44. Hoebener Karl G. (Georgetown TX) Hubacher Eric M. (Austin TX) Partridge Julian P. (Austin TX), Fine pitch solder deposits on printed circuit board process and product.
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  45. Sochor Jerzy R. (164 Rockview Irvine CA 92715), Flat receptacle contact for extremely high density mounting.
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  46. Porter Marvin (San Antonio TX), Fuel converter for gasoline powered lanterns.
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  47. Pattanaik Surya, Head transducer to suspension lead termination by solder ball place/reflow.
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  48. Roath Alan L. (Madison OH) Bacnik James A. (Mentor OH) Venaleck John T. (Madison OH) Venaleck Howard J. (Painesville OH), Hermaphroditic interconnect system.
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  49. Krumme John F. (Del Mar CA) Perry Michael (Mountain View CA) Yasumura Gary (Santa Clara CA) Selvin Gerald J. (Huntington Beach CA), High density and high signal integrity connector.
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  50. Perry Michael (Mountain View CA) Yasumura Gary (Santa Clara CA), High density and high signal integrity connector.
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  51. Perry Michael (Mountain View CA) Yasumura Gary (Santa Clara CA), High density and high signal integrity connector.
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  52. Lemke Timothy A. ; Houtz Timothy W., High density connector.
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  53. Olson Stanley W., High density connector having a ball type of contact surface.
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  54. Lopergolo Emanuele Frank ; Goldmann Lewis Sigmund ; Sullivan Joseph Michael ; Tompkins ; Jr. Charles Russell, High density electrical interconnect apparatus and method.
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  55. Bross Arthur (Poughkeepsie NY) Walsh Thomas J. (Poughkeepsie NY), High density electronic connector and method of assembly.
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  56. Olsson, Billy E., High density zero insertion force connector.
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  57. Dohnishi Kiyoyuki (Kyoto JPX), High voltage connector.
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  58. Inoue Shuji (Ibaragi JPX) Ozawa Kazuhisa (Saitama JPX), IC socket permitting checking connected state between IC socket and printed wiring board.
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  59. Ellis ; Roger M. ; Allgaier ; Werner M., Integrally formed connector.
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  60. Variot Patrick (San Jose CA) Chia Chok J. (Campbell CA) Trabucco Robert T. (Los Altos CA), Integrated circuit having a coplanar solder ball contact array.
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  61. Brown Harry W. (Big Bend WI) Heider Erich E. (West Allis WI), Integrated wire termination system with reflow bonded retainer.
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  62. Behun John R. (Poughkeepsie NY) Call Anson J. (Poughkeepsie NY) Cappo Francis F. (Wappingers Falls NY) Cole Marie S. (Wappingers Falls NY) Hoebener Karl G. (Georgetown TX) Klingel Bruno T. (Hopewell , Interconnection structure and test method.
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  63. Sadigh-Behzadi Amir-Akbar (Van Nuys CA), Jumper cable having clips for solder connections.
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  64. Swamy Deepak (Austin TX) Pecone Victor (Austin TX), Leadless high density connector.
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  65. Keglewitsch Josef (Addison IL) Vladic Daniel P. (Berwyn IL), Low cost electrical connector.
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  66. Englert ; Jr. Michael W. (Middletown PA) Summers Donald J. (Shiremanstown PA), Low profile board to board connector.
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  69. Melton Cynthia M. (Bolingbrook IL) Cholewczynski Kenneth (Streamwood IL) Moore Kevin D. (Schaumburg IL) Raleigh Carl (Cary IL), Low temperature method for forming solder bump interconnections to a plated circuit trace.
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  70. van der Weide Egbert J. (GW 0lst NLX), Machine designed to lift a flexible, flat workpiece off a support surface.
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  71. Furusawa Keisuke (Yokohama JPX) Orimo Takao (Machida JPX) Suzuki Takuya (Kawasaki JPX), Manufacturing method for a supermicro-connector.
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  72. Fukasawa Hideyuki (Hadano JPX) Kobayashi Mamoru (Hadano JPX) Wanami Masahiro (Hadano JPX), Method and apparatus for aligning solder balls.
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  73. Denton Ronald D. (Spring TX), Method and apparatus for assembling ball grid array components on printed circuit boards by reflowing before placement.
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  74. Hayes Donald J. (Plano TX) Boldman Michael T. (Garland TX) Wallace David B. (Dallas TX), Method and apparatus for dispensing spherical-shaped quantities of liquid solder.
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  75. McGill Scott D. (Tucson AZ), Method and apparatus for filling a ball grid array.
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  76. Chiu George W. (Palo Alto CA), Method and apparatus for forming solder balls and solder columns.
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  77. Kirby Thomas P. (Lake Worth FL) Greenwood Jonathon G. (Lake Worth FL) Juchniewicz Edward (Delray Beach FL) Neiconi Ovidiu (Boynton Beach FL), Method and apparatus for solder sphere placement using an air knife.
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  78. Johary Ajay (Rochester MN), Method and transfer plate for applying solder to component leads.
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  134. Seidler Jack (Flushing NY), Solder-bearing lead.
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  137. Updegraff Stephen W. (Mechanicsburg PA), Solderable palladium-nickel coatings and method of making said coatings.
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  138. Apap Joseph A. (Endicott NY) Brown Mark A. (Whitney Point NY) Emerick Alan J. (Warren Center PA) Miller Thomas L. (Vestal NY) Murray James R. (Owego NY) Sissenstein ; Jr. David W. (Endwell NY), Substrate soldering in a reducing atmosphere.
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  140. McCoy Michael J. (Lyndhurst OH) Hartman John E. (Painesville OH) Wesbster John L. (Painesville OH), Surface mount compatible connector system with solder strip and mounting connector to PCB.
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  141. Weiss Michael L. (Coral Springs FL), Surface mount interposer.
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  142. Taylor Attalee S., Surface mount socket for an electronic package, and contact for use therewith.
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  143. Degani Yinon (Highland Park NJ) Dudderar Thomas D. (Chatham NJ) Woods ; Jr. William L. (Keithville LA), Surface mount solder assembly of leadless integrated circuit packages to substrates.
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  144. Schmedding George R. (Hummelstown PA), Surface mountable electrical connector.
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  145. Watanabe Hideki,JPX ; Imai Tsutomu,JPX ; Yamaguchi Takeshi,JPX ; Netsu Tositada,JPX ; Kasai Kenichi,JPX ; Imahashi Fumio,JPX ; Ezaki Satoru,JPX ; Shirai Mitugu,JPX, Surface mounting structure.
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  146. Murphy Paul ; Cummings James C. ; Cota Alejandro McConegly,MXX ; Nelligan ; Jr. Joseph W. ; O'Sullivan Michael ; Pellegrino Thomas P., System for terminating the shield of a high speed cable.
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  147. Ignasiak Martin C. (Mentor OH) Swierczek Remi D. (Concord OH), Through-board electrical component header having integral solder mask.
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  148. Banakis Emanuel G. (Naperville IL) Landgraf Glenn A. (Naperville IL) Penley Michael J. (Crystal Lake IL) Petrie Robert M. (Glen Ellyn IL), Universal contact pin electrical connector.
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  149. Sinclair William Y., Universal production ball grid array socket.
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  150. Lytle Thomas G. (Danbury CT), Vertical edge card connectors.
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  3. Buck, Jonathan E.; Sercu, Stefaan Hendrik Jozef; De Geest, Jan; Minich, Steven E.; Gray, Mark R.; Kolivoski, Christopher J.; Johnescu, Douglas M.; Stoner, Stuart C.; Raistrick, Alan, Cross talk reduction for high speed electrical connectors.
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  7. Mongold,John A., Elevated height electrical connector.
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  8. Lemke, Timothy A.; Houtz, Timothy W., High density connector and method of manufacture.
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  10. Regnier, Kent E.; Casher, Patrick R.; Long, Jerry A., Resonance modifying connector.
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