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Heat exchange apparatus with parallel flow 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0882433 (2004-06-30)
발명자 / 주소
  • Teneketges,Nicholas J.
  • Kwok,Tarzen
출원인 / 주소
  • Teradyne, Inc.
인용정보 피인용 횟수 : 65  인용 특허 : 15

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (15)

  1. Lopez Roger (Louisville CO), Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor.
    상세보기
  2. Pfister, Dennis M.; Byrd, Charles M.; Davidson, Howard L., Distributed graphitic foam heat exchanger system.
    상세보기
  3. Go Hiroshi (Zama JPX) Zushi Shizuo (Hadano JPX) Miyamoto Mitsuo (Hadano JPX), Electronic apparatus cooling system.
    상세보기
  4. Kondo, Yoshihiro; Ohashi, Shigeo; Minamitani, Rintaro; Naganawa, Takashi; Yoshitomi, Yuji; Nakanishi, Masato; Sasaki, Yasuhiko; Nakagawa, Tsuyoshi; Suzuki, Osamu; Matsushita, Shinji; Yamada, Yasunori, Electronic equipment.
    상세보기
  5. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Loparco, John J.; McClafferty, William D.; Porter, Donald W., Evaporator with air cooling backup.
    상세보기
  6. Alexander Arthur Ray ; Porter ; deceased Warren W., Focused air cooling employing a dedicated chiller.
    상세보기
  7. Messina Gaetano P. (Hopewell Junction NY), Integral cooling system for electric components.
    상세보기
  8. Trudeau Paul ; Forbes Gerald L., Integrated test cell cooling system.
    상세보기
  9. Bartilson Bradley W., Large area, multi-device heat pipe for stacked MCM-based systems.
    상세보기
  10. Gutfeldt Theodor A. ; Clausen Bryan L. ; Patel Sarosh M., Liquid cooling apparatus for use with electronic equipment.
    상세보기
  11. Bernhardt Anthony F. (Berkeley CA), Microchannel cooling of face down bonded chips.
    상세보기
  12. Memory, Stephen B.; Ganaway, Fredrick E.; Rogers, C. James; DeVuono, Anthony C.; Phillips, Alfred; Zuo, Zhijun, Modular cooling system and thermal bus for high power electronics cabinets.
    상세보기
  13. Love David G. (Pleasanton CA), Module test card.
    상세보기
  14. Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use.
    상세보기
  15. Khrustalev, Dmitry; Zuo, Jon, Thermal bus for cabinets housing high power electronics equipment.
    상세보기

이 특허를 인용한 특허 (65)

  1. Straznicky, Ivan; Power Fardy, Richard Jude, Adjustable height liquid cooler in liquid flow through plate.
    상세보기
  2. Doll, Wade J.; Kelley, Douglas P., Air conditioning systems for computer systems and associated methods.
    상세보기
  3. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.
    상세보기
  4. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
    상세보기
  5. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E.; Singh, Prabjit, Apparatus and method for facilitating servicing of a liquid-cooled electronics rack.
    상세보기
  6. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madusudan K.; Simons, Robert E.; Singh, Prabjit, Apparatus and method for facilitating servicing of a liquid-cooled electronics rack.
    상세보기
  7. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
    상세보기
  8. Samaniego,Paul; Campbell,Levi; Ellsworth, Jr.,Michael; Domitrovits,Michael; Kelley,Paul; Mahaney, Jr.,Howard, Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability.
    상세보기
  9. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
    상세보기
  10. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
    상세보기
  11. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Kemink, Randall G.; Schmidt, Roger R.; Simons, Robert E., Conductive heat transport cooling system and method for a multi-component electronics system.
    상세보기
  12. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled.
    상세보기
  13. Campbell,Levi A.; Chu,Richard C.; Ellsworth,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled.
    상세보기
  14. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled.
    상세보기
  15. Sonnabend,Werner; Ousmane,Mouhamadou; Braun,Wilfried; Schaffer,Kurt, Cooling arrangement.
    상세보기
  16. Bodenweber, Paul F.; Marston, Kenneth C.; Sikka, Kamal K.; Toy, Hilton T.; Werner, Randall J.; Zitz, Jeffrey A., Cooling structure for electronic boards.
    상세보기
  17. Bodenweber, Paul F.; Marston, Kenneth C.; Sikka, Kamal K.; Toy, Hilton T.; Werner, Randall J.; Zitz, Jeffrey A., Cooling structure for electronic boards.
    상세보기
  18. Rasmussen, Neil; Bean, John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
    상세보기
  19. Rasmussen, Neil; Bean, Jr., John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
    상세보기
  20. Ross, Peter George; Striffler, Matthew David; Gillooly, Alan Donald, Cooling system for data center rack.
    상세보기
  21. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
    상세보기
  22. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
    상세보기
  23. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
    상세보기
  24. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
    상세보기
  25. Belady, Christian L.; Murakami, Vance; Pereira, Robert Allen, Cooling systems and methods.
    상세보기
  26. Aoki, Nobumitsu; Nishiyama, Takeshi; Urai, Takashi; Suzuki, Masumi; Aoki, Michimasa; Wei, Jie; Tawa, Fumihiro; Uzuka, Yoshinori, Cooling unit and electronic equipment.
    상세보기
  27. Silvennoinen, Mika; Vartiainen, Mika, Electric drive.
    상세보기
  28. Walz,Andrew A.; Tegart,Donald A., Electrical module and support therefor with integrated cooling.
    상세보기
  29. Koontz, Christopher R.; Chu, Charles; Flores, Gilbert A., Flexible electronic package integrated heat exchanger with cold plate and risers.
    상세보기
  30. Shedd, Timothy A.; Lindeman, Brett A., Flexible two-phase cooling system.
    상세보기
  31. Straznicky, Ivan; Ratliff, William Edward, Fluid cooled enclosure for circuit module apparatus and methods of cooling a conduction cooled circuit module.
    상세보기
  32. Shedd, Timothy A.; Meives, Mark S., Fluid distribution unit for two-phase cooling system.
    상세보기
  33. Sorhuus, Anders Kenneth; Bjarno, Odd Edgar, Gas cleaning unit and method for cleaning gas.
    상세보기
  34. Neudorfer, Julius, High efficiency heat removal system for rack mounted computer equipment.
    상세보기
  35. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
    상세보기
  36. Wexler, Peter, In-row air containment and cooling system and method.
    상세보기
  37. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
    상세보기
  38. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
    상세보기
  39. Campbell, Levi A.; Chu, Richard C.; Crippen, Martin J.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Kamath, Vinod; Matteson, Jason A.; Schmidt, Roger R.; Simons, Robert E., Liquid cooling apparatus and method for facilitating cooling of an electronics system.
    상세보기
  40. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Liquid-based cooling system for cooling a multi-component electronics system.
    상세보기
  41. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Liquid-based cooling system for cooling a multi-component electronics system.
    상세보기
  42. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
    상세보기
  43. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
    상세보기
  44. Tutunoglu, Ozan, Method and apparatus for cooling.
    상세보기
  45. Tutunoglu, Ozan; Bean, Jr., John H., Method and apparatus for cooling.
    상세보기
  46. Tutunoglu, Ozan; Lingrey, David James, Method and apparatus for cooling.
    상세보기
  47. Tutunoglu, Ozan; Bean, Jr., John H., Method of operating a cooling system having one or more cooling units.
    상세보기
  48. Campbell, Levi A.; Colbert, John L.; Ellsworth, Jr., Michael J.; Sinha, Arvind K., Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates.
    상세보기
  49. Belady, Christian L; Murakami, Vance; Pereira, Robert Allen, Methods for cooling computers and electronics.
    상세보기
  50. Shedd, Timothy A.; Lindeman, Brett A.; Buchanan, Robert A., Microprocessor assembly adapted for fluid cooling.
    상세보기
  51. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
    상세보기
  52. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
    상세보기
  53. Doll, Wade J., Multi-stage air movers for cooling computer systems and for other uses.
    상세보기
  54. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
    상세보기
  55. Rohr, Daniel J., Optically detected liquid depth information in a climate control unit.
    상세보기
  56. Hodes, Marc; Lyons, Alan Michael; Scofield, William Harold, Recirculating gas rack cooling architecture.
    상세보기
  57. Chen, Chien-An; Chen, Yi-Ling, Separable liquid-cooling heat-dissipation module.
    상세보기
  58. Chen, Chien-An; Shih, Wei-Ta, Server cabinet coolant distribution system.
    상세보기
  59. Shrivastava, Saurabh K.; VanGilder, James W., System and method for arranging equipment in a data center.
    상세보기
  60. Rasmussen, Neil; VanGilder, James W.; Zhang, Xuanhang, System and method for assessing and managing data center airflow and energy usage.
    상세보기
  61. VanGilder, James William, System and method for prediction of temperature values in an electronics system.
    상세보기
  62. Healey, Christopher M.; Zhang, Xuanhang, System and method for sequential placement of cooling resources within data center layouts.
    상세보기
  63. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
    상세보기
  64. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
    상세보기
  65. Caradonna, Michael; Pavlik, Matthew, Test system having liquid containment chambers over connectors.
    상세보기

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