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Semiconductor device and manufacturing method thereof 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/30
  • H01L-021/02
  • H01L-021/84
  • H01L-021/70
출원번호 US-0694803 (2003-10-29)
우선권정보 JP-2002-316397(2002-10-30)
발명자 / 주소
  • Yamazaki,Shunpei
  • Takayama,Toru
  • Maruyama,Junya
  • Ohno,Yumiko
출원인 / 주소
  • Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
    Robinson Intellectual Property Law Office, P.C.
인용정보 피인용 횟수 : 76  인용 특허 : 54

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (54)

  1. Itoh Kenji,JPX, Apparatus and method for forming film.
  2. Itoh Kenji,JPX, Apparatus and method for forming film.
  3. Hembree, David R., Chip on board and heat sink attachment methods.
  4. Spitzer Mark B. (Sharon MA) Salerno Jack P. (Waban MA) Dingle Brenda (Mansfield MA) Jacobsen Jeffrey (Hollister CA), Color filter system for display panels.
  5. Yamazaki Shunpei,JPX ; Takemura Yasuhiko,JPX ; Nakajima Setsuo,JPX ; Arai Yasuyuki,JPX, Display device and method of fabricating involving peeling circuits from one substrate and mounting on other.
  6. Takemura Yasuhiko,JPX, Electro-optical device.
  7. Affinito John D., Environmental barrier material for organic light emitting device and method of making.
  8. Shimoda, Tatsuya; Inoue, Satoshi; Miyazawa, Wakao, Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device and liquid crystal display device produced by the same.
  9. Shimoda, Tatsuya; Inoue, Satoshi; Miyazawa, Wakao, Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same.
  10. Spitzer Mark B. ; Gale Ronald P. ; Jacobsen Jeffrey, Head mounted liquid crystal display system.
  11. Vu Duv-Pach (Taunton MA) Dingle Brenda (Mansfield MA) Cheong Ngwe (Boston MA), High density electronic circuit modules.
  12. Zavracky Paul M. (Norwood MA) Fan John C. C. (Chestnut Hill MA) McClelland Robert (Norwell MA) Jacobsen Jeffrey (Hollister CA) Dingle Brenda (Mansfield MA), Liquid crystal display having essentially single crystal transistors pixels and driving circuits.
  13. Shunpei Yamazaki JP; Jun Koyama JP, Liquid crystal electrooptical device.
  14. Inoue Satoshi,JPX ; Shimoda Tatsuya,JPX, Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device.
  15. Inoue, Satoshi; Shimoda, Tatsuya, Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device.
  16. Jacobsen Jeffrey ; Fan John C. C. ; Salerno Jack P., Matrix display systems.
  17. Francois J. Henley ; Nathan W. Cheung, Method and device for controlled cleaving process.
  18. Henley, Francois J.; Cheung, Nathan W., Method and device for controlled cleaving process.
  19. Nishi Takeshi,JPX ; Teramoto Satoshi,JPX, Method and system for fabricating an electrooptical device.
  20. Nishi Takeshi,JPX ; Teramoto Satoshi,JPX, Method and system for fabricating liquid crystal cells having winding means.
  21. Francois J. Henley ; Sien G. Kang ; Igor J. Malik, Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customer.
  22. Henley Francois J. ; Cheung Nathan W., Method for controlled cleaving process.
  23. Spitzer Mark B. (Sharon MA) Salerno Jack P. (Waban MA) Jacobsen Jeffrey (Hollister CA) Dingle Brenda (Mansfield MA) Vu Duy-Phach (Taunton MA) Zavracky Paul M. (Norwood MA), Method for manufacturing a semiconductor device using a circuit transfer film.
  24. Asmussen Bodo,DEX ; Hille Thomas,DEX ; Schumann Klaus,DEX ; Steinborn Peter,DEX, Method for producing transdermal patches (TTS).
  25. Utsunomiya, Sumio, Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance.
  26. Ohtani Hisashi,JPX ; Takemura Yasuhiko,JPX ; Miyanaga Akiharu,JPX ; Yamazaki Shunpei,JPX, Method of crystallizing a silicon film.
  27. Brian S. Doyle, Method of delaminating a thin film using non-thermal techniques.
  28. Faris, Sadeg M., Method of fabricating vertical integrated circuits.
  29. Fukada Takeshi (Kanagawa JPX) Sakama Mitsunori (Kanagawa JPX) Teramoto Satoshi (Kanagawa JPX), Method of heat-treating a glass substrate.
  30. Yamazaki Shunpei,JPX ; Arai Yasuyuki,JPX ; Teramoto Satoshi,JPX, Method of manufacturing a semiconductor device using a metal which promotes crystallization of silicon and substrate bo.
  31. Shunpei Yamazaki JP; Yasuyuki Arai JP; Satoshi Teramoto JP, Method of manufacturing flexible display with transfer from auxiliary substrate.
  32. Mizutani, Masaki; Tanikawa, Isao; Nakagawa, Katsumi; Shoji, Tatsumi; Ukiyo, Noritaka; Iwasaki, Yukiko, Method of producing semiconductor thin film and method of producing solar cell using same.
  33. Hamamoto Satoshi (Itami JPX) DeGuchi Mikio (Itami JPX), Method of producing thin-film solar cell.
  34. Inoue, Satoshi; Shimoda, Tatsuya, Method of separating thin film device, method of transferring thin film device, thin film device, active matrix substrate and liquid crystal display device.
  35. Inoue, Satoshi; Shimoda, Tatsuya, Method of separating thin-film device, method of transferring thin-film device, thin-film device, active matrix substrate, and liquid crystal display device.
  36. McCormack, Mark Thomas; Roman, James; Zhang, Lei; Beilin, Solomon I., Methods for detaching a layer from a substrate.
  37. Lei Zhang ; Solomon Beilin ; Som S. Swamy ; James J. Roman, Methods for fabricating flexible circuit structures.
  38. McCormack, Mark Thomas; Roman, James; Zhang, Lei; Beilin, Solomon I., Methods for fabricating flexible circuit structures.
  39. Kubota Yuichi,JPX ; Nishi Kazuo,JPX, Photovoltaic device.
  40. Ambros Peter (Leutershausen DEX) Budig Walter (Wulfershausen DEX) Westermeir Gisela (Hohenroth DEX), Process for preparing printed circuits.
  41. Sakaguchi Kiyofumi,JPX ; Yonehara Takao,JPX ; Nishida Shoji,JPX ; Yamagata Kenji,JPX, Process for producing semiconductor article.
  42. Iwasaki, Yukiko; Nishida, Shoji; Sakaguchi, Kiyofumi; Ukiyo, Noritaka, Process for producing semiconductor member, process for producing solar cell, and anodizing apparatus.
  43. Iketani, Koji; Tani, Takayuki; Shibuya, Takao; Hyodo, Haruo, Semiconductor device manufacturing method.
  44. Yamazaki, Shunpei, Semiconductor device with light emitting elements and an adhesive layer holding color filters.
  45. Kohno Yasutaka (Itami JPX), Semiconductor device with reduced stress on gate electrode.
  46. Tatsuya Shimoda JP; Satoshi Inoue JP; Wakao Miyazawa JP, Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method.
  47. Iwane, Masaaki; Nakagawa, Katsumi; Iwakami, Makoto; Nishida, Shoji; Ukiyo, Noritaka; Iwasaki, Yukiko; Mizutani, Masaki, Separation method of semiconductor layer and production method of solar cell.
  48. Zavracky Paul M. (Norwood MA) Fan John C. C. (Chestnut Hill MA) McClelland Robert (Norwell MA) Jacobsen Jeffrey (Hollister CA) Dingle Brenda (Norton MA) Spitzer Mark B. (Sharon MA), Single crystal silicon arrayed devices for display panels.
  49. Gordon Lee Graff ; Mark Edward Gross ; Ming Kun Shi ; Michael Gene Hall ; Peter Maclyn Martin ; Eric Sidney Mast, Smoothing and barrier layers on high Tg substrates.
  50. Sakaguchi Kiyofumi,JPX ; Sato Nobuhiko,JPX, Substrate and production method thereof.
  51. Inoue, Satoshi; Shimoda, Tatsuya; Miyazawa, Wakao, Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus.
  52. Hayashi, Hisao, Thin film semiconductor device and manufacturing method thereof.
  53. Chu, Jack Oon; Grill, Alfred; Herman, Jr., Dean A.; Saenger, Katherine L., Transferable device-containing layer for silicon-on-insulator applications.
  54. Yamazaki Shunpei,JPX ; Takemura Yasuhiko,JPX ; Nakajima Setsuo,JPX ; Arai Yasuyuki,JPX, Using a temporary substrate to attach components to a display substrate when fabricating a passive type display device.

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  2. Yamazaki, Shunpei; Murakami, Masakazu; Takayama, Toru; Maruyama, Junya, Flexible display panel having curvature that matches curved surface of vehicle part.
  3. Nakamura, Daiki; Ikeda, Hisao, Flexible touch panel including a bonding layer.
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  5. Aoki, Tomoyuki; Tsurume, Takuya, Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device.
  6. Aoki, Tomoyuki; Tsurume, Takuya, Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device.
  7. Aoki, Tomoyuki; Tsurume, Takuya, Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device.
  8. Yamazaki, Shunpei; Nakamura, Daiki; Ikeda, Hisao, Light-emitting device.
  9. Yamazaki, Shunpei; Nakamura, Daiki; Ikeda, Hisao, Light-emitting device.
  10. Seo, Satoshi; Hatano, Kaoru, Light-emitting device and electronic device using the same.
  11. Eguchi, Shingo; Oikawa, Yoshiaki; Okazaki, Kenichi; Maruyama, Hotaka, Light-emitting device and manufacturing method thereof.
  12. Eguchi, Shingo; Oikawa, Yoshiaki; Okazaki, Kenichi; Maruyama, Hotaka, Light-emitting device and manufacturing method thereof.
  13. Hirakata, Yoshiharu, Light-emitting device and method for fabricating the same.
  14. Hirakata, Yoshiharu, Light-emitting device and method for fabricating the same.
  15. Chida, Akihiro; Aoyama, Tomoya, Light-emitting device and method for manufacturing light-emitting device.
  16. Sakuishi, Tatsuya; Uchida, Yutaka; Adachi, Hiroki; Eguchi, Saki; Yanaka, Junpei; Kumakura, Kayo; Yasumoto, Seiji; Yokoyama, Kohei; Chida, Akihiro, Light-emitting device and peeling method.
  17. Sakuishi, Tatsuya; Uchida, Yutaka; Adachi, Hiroki; Eguchi, Saki; Yanaka, Junpei; Kumakura, Kayo; Yasumoto, Seiji; Yokoyama, Kohei; Chida, Akihiro, Light-emitting device with flexible substrates.
  18. Morisue, Masafumi; Watanabe, Ryosuke; Maruyama, Junya; Yamada, Daiki, Manufacturing method of semiconductor device.
  19. Yamada, Daiki; Dozen, Yoshitaka, Manufacturing method of semiconductor device.
  20. Yamada, Daiki; Dozen, Yoshitaka, Manufacturing method of semiconductor device.
  21. Ogita, Kaori; Tamura, Tomoko, Manufacturing method of semiconductor device including peeling step.
  22. Yamazaki, Shunpei; Murakami, Masakazu; Takayama, Toru; Maruyama, Junya, Method for fabricating a semiconductor device by bonding a layer to a support with curvature.
  23. Yamazaki, Shunpei; Murakami, Masakazu; Takayama, Toru; Maruyama, Junya, Method for fabricating a semiconductor device by bonding a layer to a support with curvature.
  24. Ohno, Masakatsu; Takeshima, Koichi, Method for forming separation starting point and separation method.
  25. Yamazaki, Shunpei; Hirose, Atsushi; Ono, Koji; Maruyama, Hotaka, Method for manufacturing a semiconductor device.
  26. Moon, JiHyung; Jeong, HwanHee; Choi, KwangKi; Song, JuneO; Lee, SangYoul, Method for manufacturing light emitting device having an active layer formed over a Ga-face.
  27. Chida, Akihiro; Hatano, Kaoru; Aoyama, Tomoya; Komatsu, Ryu; Kataniwa, Masatoshi, Method for manufacturing light-emitting device.
  28. Chida, Akihiro; Hatano, Kaoru; Aoyama, Tomoya; Komatsu, Ryu; Kataniwa, Masatoshi, Method for manufacturing light-emitting device.
  29. Chida, Akihiro; Hatano, Kaoru; Aoyama, Tomoya; Komatsu, Ryu; Kataniwa, Masatoshi, Method for manufacturing light-emitting device.
  30. Hirakata, Yoshiharu; Yamazaki, Shunpei, Method for manufacturing light-emitting device.
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  32. Eguchi, Shingo; Monma, Yohei; Tani, Atsuhiro; Hirosue, Misako; Hashimoto, Kenichi; Hosaka, Yasuharu, Method for manufacturing semiconductor device.
  33. Tsurume,Takuya; Dairiki,Koji, Method for manufacturing thin film integrated circuit.
  34. Mountain,David Jerome, Method of fabricating and integrating high quality decoupling capacitors.
  35. Watanabe, Ryoichi, Method of fabricating high density printed circuit board.
  36. Lee, Jong Lam; Kim, Soo Young, Method of manufacturing a flexible device and method of manufacturing a flexible display.
  37. Yamashita, Akio; Fukumoto, Yumiko; Goto, Yuugo, Method of manufacturing optical film.
  38. Yamashita, Akio; Fukumoto, Yumiko; Goto, Yuugo, Method of manufacturing optical film.
  39. Yamashita, Akio; Ohno, Yumiko; Goto, Yuugo, Method of manufacturing optical film.
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  43. Takayama, Toru; Maruyama, Junya; Yamazaki, Shunpei, Method of peeling thin film device and method of manufacturing semiconductor device using peeled thin film device.
  44. Kim, Tae-Woong; An, Sung-Guk; Kim, Hyung-Sik; Koo, Hyung-Woo; Jin, Dong-Gun; Seo, Sang-Joon, Organic light-emitting display device and method of manufacturing the same.
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  50. Takayama, Toru; Maruyama, Junya; Yamazaki, Shunpei, Peeling method and method of manufacturing semiconductor device.
  51. Takayama, Toru; Maruyama, Junya; Yamazaki, Shunpei, Peeling method and method of manufacturing semiconductor device.
  52. Takayama, Toru; Maruyama, Junya; Yamazaki, Shunpei, Peeling method and method of manufacturing semiconductor device.
  53. Yamazaki, Shunpei; Suzuki, Kunihiko, Peeling method and peeling apparatus.
  54. Sakuishi, Tatsuya; Uchida, Yutaka; Adachi, Hiroki; Eguchi, Saki; Yanaka, Junpei; Kumakura, Kayo; Yasumoto, Seiji; Yokoyama, Kohei; Chida, Akihiro, Peeling method using separating peeling layer and layer to be peeled.
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