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Electronic control enclosure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0968438 (2004-10-19)
발명자 / 주소
  • Caines,Arturo
  • Kostic,Bratislav
  • Rachwalski,Thaddeus
출원인 / 주소
  • Cinch Connectors, Inc.
대리인 / 주소
    Leydig, Voit & Meyer, Ltd
인용정보 피인용 횟수 : 19  인용 특허 : 45

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (45)

  1. Thomas John C. ; Paulson John D. ; Jacobson Jon T., Apparatus and method for removably positioning optical fiber to circuit board component in enclosure.
  2. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Cartridge for electronic devices.
  3. Jakob Gert (Stuttgart DT) Goetzke Siegfried (Hemmingen DT), Compact electronic control and power unit structure.
  4. Kolberg Gerhard (Buehl DEX) Koelmel Juergen (Rastatt DEX) Fabry Thomas (Neckartenzlingen DEX) Kusserow Peter (Sonnenbuehl DEX), Control device.
  5. Bosler Alan J. (Bedford IN) Nash Larry E. (Washington IN), Cooling apparatus for electronic modules.
  6. Moribe Makoto,JPX ; Goto Hironobu,JPX ; Yoshida Kazuki,JPX, Cooling arrangement comprising for a heat source a heat sink movable on an external sink.
  7. Lipschutz Lewis D. (Poughkeepsie NY) Meagher Ralph E. (Vicksburg MI) Presti Frank P. (Wappingers Falls NY), Cooling element for solder bonded semiconductor devices.
  8. Wessely Herrmann (Munich DEX), Device for cooling a plurality of integrated modules combined on a rigid printed circuitboard to form logic cards.
  9. Tracy Mark S., Docking station with thermoelectric heat dissipation system for docked portable computer.
  10. Cocconi Alan G. (725 S. Scottdale Ave. Glendora CA 91740), Electrical component assembly with heat sink.
  11. Fassel Reinhard,DEX ; Zoebl Hartmut,DEX, Electrical device having a printed-circuit board and method for assembling the device.
  12. Jakob Gert,DEX ; Zimmermann Joachim,DEX ; Horn Friedrich,DEX ; Rummel Hans,DEX ; Sutter Thomas,DEX ; Karr Dieter,DEX ; Schupp Karl,DEX ; Neuhaus Dieter,DEX ; Hussmann Dieter,DEX ; Jares Peter,DEX, Electrical device, in particular a switching and control unit for motor vehicles.
  13. Klinger Herbert (Nuermberg DEX) Thomas Gerhard (Fuerth DEX) Petrzik Martin (Nuermberg DEX), Electrical switching and control device, in particular for motor vehicles.
  14. Pavlovic Slobodan, Electronic component heat sink assembly.
  15. Casperson Paul G. (Columbus IN) Durbin Michael (Columbus IN), Electronic component heat sink attachment using a canted coil spring.
  16. Buzzelli Dennis K. (Old Bethpage NY), Electronic module locking mechanism.
  17. Wentland ; Jr. William A. (Bristol CT) Hansen Alan M. (Higganum CT) Rosati Ramon W. (Simsbury CT), Enclosure for an electronic circuit module.
  18. Kallis Adrian G. (Fargo ND) Needham Charles D. (Fargo ND) Brekkestran Kevin L. (Fargo ND) Batcheller Barry D. (West Fargo ND), Engine variable transmission control system.
  19. Brekkestran Kevin L. (Fargo ND) Batcheller Barry D. (West Fargo ND) Kallis Adrian G. (Fargo ND) Needham Charles D. (Fargo ND), Expandable, mobile, modular microcomputer system for an off-road vehicle.
  20. Ikushima, Yoshihiro; Ohkubo, Yutaka; Yoshikawa, Hidetoshi, Fastening mechanism.
  21. Frenkel Ferdinand (Augsburg DEX) Prussas Herbert (Reichertshausen DEX) Rapp Lothar (Munich DEX), Heat dissipating housing for an electronic component.
  22. Benenati, Salvatore, Heat exchanging electronic module housing.
  23. Wekell William O. (Renton WA), Heat sink and transistor retaining assembly.
  24. Galich Michael G. (Park Ridge IL) Johnson Dale G. (Lake Zurich IL), Heat sink assembly.
  25. Markow Paul A. ; Shock Karl W. ; Chupp Bradley S. ; Morenilla Luis J. ; Holmes Frank R. ; Burcham Stephen W., Heat sink assembly for electrical components.
  26. Moses ; Jr. John A. (Carol Springs FL) Budano ; II Joseph A. (Plantation FL), Heat sink clip assembly.
  27. Bailey Terry G. (Huntsville AL) Betterton Joseph T. (Arab AL) Choat Robert T. (Madison AL) Oden Gerald K. (Huntsville AL), Heat sink load spring assembly.
  28. Tinder David V. (Dearborn MI), Heat sink mounting arrangement for a semiconductor.
  29. Bailey Terry G. (Huntsville AL) Chupp Bradley S. (Madison AL), Heat sink spring and wedge assembly.
  30. Jakob Gert (Stuttgart DEX) Schupp Karl (Pforzheim DEX) Hussmann Dieter (Steinheim DEX) Jessberger Thomas (Eberdingen/Hochdorf DEX) Karr Dieter (Tiefenbronn DEX), Housing for an electronic circuit with improved heat dissipation means.
  31. Morrison Robert A. (Long Beach CA), Hydraulic thermal clamp for electronic modules.
  32. Kenji Kinoshita JP; Hideki Ishihara JP; Akira Kurimoto JP; Haruki Matsuzaki JP; Ryoichi Yamamoto JP; Akihiro Yoshida JP; Ryouta Nakamura JP; Toshiki Kobayashi JP; Hajime Katsuro JP, Installation structure of printed-circuit board for electronic control unit.
  33. Storti, William J.; Sibley, Keith; Ovadia, Shlomo; Kimball, Steven; Falvo, Barry, Method and apparatus for managing thermal energy emissions.
  34. Barcley, Tina P., Method of transporting heat from a heat dissipating electrical assemblage.
  35. Kosak Wolfgang (Moeglingen DEX) Bentz Willy (Sachsenheim DEX) Ernst Waldemar (Vaihingen/Enz. DEX) Karr Dieter (Tiefenbronn DEX) Hermanutz Paul (Gomaringen DEX), Multi-board electrical control device.
  36. Clausen Scott A. (Coldwater OH) Kallis Adrian G. (Fargo ND), Powershift transmission control system with turbo boost monitor.
  37. Officer Todd M. ; Clausen Scott A. ; Kallis Adrian G., Powershift transmission system with torque-mapped shifts.
  38. Goodrich Melville A. (Brookline MA), Printed circuit module retainer.
  39. Kallis Adrian G. (Fargo ND) Needham Charles D. (Fargo ND) Brekkestran Kevin L. (Fargo ND) Batcheller Barry D. (West Fargo ND), Pseudo-gear transmission control system and method.
  40. Brauer Eric A. (Indianapolis IN), Self clamping heat sink assembly.
  41. Penn Paul E. (Indianapolis IN), Solid state device package mounting apparatus.
  42. Hutchison, Michael C., Solid state light with solar shielded heatsink.
  43. Roth Gregory A. (Dearborn MI), Spring clip for a heat sink apparatus.
  44. Mikolajczak Christopher (Troy MI), Spring panel heat sink for electrical components.
  45. Rodriguez, Edward T.; Fuchs, Gary R., Thermal distribution system.

이 특허를 인용한 특허 (19)

  1. Nagai, Ryuichi; Sugiyama, Takahiro; Yamanouchi, Yuchi, Circuit unit accommodation box.
  2. Azuma, Tomoyo; Wakabayashi, Hiroyuki; Takenaka, Teruo; Enomoto, Hitoshi, Control apparatus.
  3. Katsuro, Hajime, Electric control device and manufacturing method thereof.
  4. Kim, Jongkwan; Oh, Heeseok; Han, Sangwhi, Electric power steering apparatus for automobile.
  5. Dekoski, Kurt; Langolf, David; Jennings, David, Electrical connector with terminal holder.
  6. Oyster, Gottlieb, Electrical enclosure.
  7. Igari, Yasuyuki; Kida, Shinobu; Watanabe, Tatsuya; Okabe, Takao, Electronic circuit unit.
  8. Yang, Sun Jae; Lee, Dong Gi; Song, Seung Mok; Choo, Yeon Chul, Electronic control apparatus for vehicle using coupling member and method for manufacturing the same.
  9. Yang, Sun Jae; Shin, Chang Guen; Lee, Ju Hyung; Lee, Jun Ho, Electronic control apparatus for vehicle using coupling member and method for manufacturing the same.
  10. Noritsune,Hiroyuki; Nobe,Hisanori, Electronic device.
  11. Goemmel,Frank; Hammer,Roland, Heat sink.
  12. Fischer, Ulrich; Pfeffer, Roland; Willer, Bernd; Hsu, Charles, Junction box to protect individual solar panels from overheating.
  13. Mossberg, Thomas W.; Greiner, Christoph M.; Iazikov, Dmitri, Laterally-confined holographic spectral filters.
  14. Maschke, Matthias; Schneeweiss, Hartmut; Ulmer, Anja, Layout of power semiconductor contacts on a cooling surface.
  15. Smyth, Desmond Mark Robertson; Baer, Stanley Arthur, Mechanical steering linkage for battery powered mower with zero turning radius.
  16. MacKinnon, Stuart Craig; Lankin, Robert Gordon; Wiseman, Jason Cornelius; Derbecker, Christopher Keith, Methods of controlling a lawn mower having electric drive and blade motors.
  17. Bryan, Lyle Stanley; Thrush, Roger Lee; Irlbeck, Robert Daniel; Worthington, Donald Robert, Module assembly having heat transfer plate.
  18. Paulsen, Mark Thomas, Network interface device enclosure.
  19. Walker, Kevin; Harlan, Tod M.; Oyster, Gottlieb; Potteiger, Nathan, Printed circuit board enclosure assembly.
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