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Composite patterning devices for soft lithography 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B29C-067/00
  • B29C-035/08
출원번호 US-0115954 (2005-04-27)
발명자 / 주소
  • Rogers,John A.
  • Menard,Etienne
출원인 / 주소
  • The Board of Trustees of the University of Illinois
대리인 / 주소
    Greenlee, Winner and Sullivan, P.C.
인용정보 피인용 횟수 : 223  인용 특허 : 45

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (45)

  1. Smith John Stephen ; Yeh Hsi-Jen J. ; Hadley Mark A. ; Verma Ashish K., Apparatus for fabricating self-assembling microstructures.
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  2. Craig, Gordon S. W.; Snyder, Eric Jonathan; Tu, Jay Kuang-Jieh, Apparatus relating to block configurations and fluidic self-assembly processes.
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  3. Jacobsen, Jeffrey Jay; Smith, John Stephen; Hadley, Mark A., Apparatuses and methods for flexible displays.
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  4. Jacobsen, Jeffrey Jay; Smith, John Stephen; Hadley, Mark A., Apparatuses and methods for forming electronic assemblies.
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  5. Jacobsen, Jeffrey Jay; Stewart, Roger Green, Apparatuses and methods for forming electronic assemblies.
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  6. Jacobsen Jeffrey Jay ; Gengel Glenn Wilhelm ; Smith John Stephen, Apparatuses and methods used in forming assemblies.
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  7. Nozawa, Ryoichi; Kimura, Mutsumi; Inoue, Satoshi, Disposing method for semiconductor elements.
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  8. Hadley, Mark Alfred; Eisenhardt, Randolph Wilfred, Double-metal background driven displays.
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  9. Hermanns, Anno; Eisenhardt, Randolph W.; Gengel, Glenn W., Electrical contacts for flexible displays.
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  10. Credelle, Thomas Lloyd; Gengel, Glenn; Stewart, Roger Green; Joseph, William Hill, Electronic devices with small functional elements supported on a carrier.
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  11. Smith John Stephen, Functionally symmetric integrated circuit die.
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  12. Gauzner, Gennady; Wago, Koichi; Kuo, David Shiao-Min, Heat-transfer-stamp process for thermal imprint lithography.
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  13. Deeman, Neil; Gauzner, Gennady, Imprint lithography utilizing room temperature embossing.
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  14. Gengel, Glenn Wilhelm, Integrated circuit packages assembled utilizing fluidic self-assembly.
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  15. Glenn Wilhelm Gengel, Integrated circuit packages assembled utilizing fluidic self-assembly.
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  16. Vicentini, Frederic J.; Credelle, Thomas L., Interconnect structure for electronic devices.
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  17. Smith John Stephen ; Yeh Hsi-Jen J., Method and apparatus for fabricating self-assembling microstructures.
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  18. Smith, John Stephen, Method and apparatus for fabricating self-assembling microstructures.
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  19. Schatz, Kenneth David, Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs.
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  20. Credelle, Thomas L.; Alvarado, Omar; Craig, Gordon S. W.; Hadley, Mark A.; Schatz, Kenneth D., Method and apparatus for transferring blocks.
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  21. Smith John S. (Berkeley CA) Yeh Hsi-Jen J. (Covina CA), Method for fabricating self-assembling microstructures.
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  22. Smith John Stephen ; Yeh Hsi-Jen J., Method for fabricating self-assembling microstructures.
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  23. Rogers, John A., Method for preventing distortions in a flexibly transferred feature pattern.
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  24. Smith, John Stephen; Hadley, Mark A.; Craig, Gordon S. W.; Lowe, Frank, Methods and apparatus for fluidic self assembly.
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  25. Smith, John Stephen; Hadley, Mark A.; Craig, Gordon S. W.; Nealey, Paul F., Methods and apparatuses for improved flow in performing fluidic self assembly.
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  26. Smith, John Stephen; Hadley, Mark A.; Tu, Jay, Methods for creating elements of predetermined shape and apparatus using these elements.
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  27. John Stephen Smith ; Mark A. Hadley ; Jay Tu, Methods for creating elements of predetermined shape and apparatuses using these elements.
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  28. Jacobsen Jeffrey Jay ; Gengel Glenn Wilhelm ; Craig Gordon S. W., Methods for fabricating a multiple modular assembly.
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  29. Jacobsen Jeffrey Jay ; Hadley Mark A. ; Craig Gordon S. W., Methods for forming assemblies.
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  30. John Stephen Smith ; Mark A. Hadley ; Gordon S. W. Craig ; Frank Lowe, Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings.
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  31. Jacobsen, Jeffrey Jay; Hadley, Mark A.; Smith, John Stephen, Methods for transferring elements from a template to a substrate.
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  32. Duan, Xiangfeng; Daniels, Hugh; Niu, Chunming; Sahi, Vijendra; Hamilton, James; Romano, Linda T., Methods of positioning and/or orienting nanostructures.
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  33. Gan Feng Yuan,CAX ; Shih Ishiang,CAX, Methods to fabricate thin film transistors and circuits.
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  34. Kondo, Takayuki; Shimoda, Tatsuya, Mountable microstructure and optical transmission apparatus.
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  35. Credelle, Thomas Lloyd; Gengel, Glenn; Stewart, Roger Green; Joseph, William Hill, Multi-feature-size electronic structures.
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  36. Chou Stephen Y., Nanoimprint lithography.
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  37. Scher, Erik; Buretea, Mihai A.; Chow, Calvin; Empedocles, Stephen; Meisel, Andreas; Parce, J. Wallace, Nanostructure and nanocomposite based compositions and photovoltaic devices.
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  38. Whiteford, Jeffery A.; Buretea, Mihai A.; Scher, Erik, Organic species that facilitate charge transfer to or from nanostructures.
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  39. Smith, John Stephen, Pixel integrated circuit.
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  40. Bernkopf, Jan, Split-fabrication for light emitting display structures.
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  41. Biebuyck Hans Andre,CHX ; Michel Bruno,CHX, Stamp for a lithographic process.
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  42. Carlton Grant Willson ; Matthew Earl Colburn, Step and flash imprint lithography.
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  43. John Stephen Smith, Testing integrated circuit dice.
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  44. Hadley, Mark A.; Chiang, Ann; Craig, Gordon S. W.; Jacobsen, Jeffrey Jay; Smith, John Stephen; Tu, Jay; Stewart, Roger Green, Web fabrication of devices.
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  45. Jeffrey Jay Jacobsen ; Glenn Wilhelm Gengel ; Mark A. Hadley ; Gordon S. W. Craig ; John Stephen Smith, Web process interconnect in electronic assemblies.
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  4. Millward, Dan B.; Westmoreland, Donald; Sandhu, Gurtej, Alternating self-assembling morphologies of diblock copolymers controlled by variations in surfaces.
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  5. Bower, Christopher; Meitl, Matthew; Gomez, David; Bonafede, Salvatore; Kneeburg, David, Apparatus and methods for micro-transfer-printing.
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  9. Stone, Kate, Apparatus for and method of fabricating an electronic device by transfer of material onto a substrate.
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  14. Cok, Ronald S.; Rotzoll, Robert R.; Bower, Christopher, Bit-plane pulse width modulated digital display system.
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  16. Ghaffari, Roozbeh; Callsen, Gilman; Arora, William J.; Schlatka, Benjamin, Catheter balloon having stretchable integrated circuitry and sensor array.
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  25. Millward, Dan B., Crosslinkable graft polymer non-preferentially wetted by polystyrene and polyethylene oxide.
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  28. Cao, Gary X.; Chen, George; Ward, Brandon L.; Wheeler, Nancy J.; Wong, Alan, Device having etched feature with shrinkage carryover.
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  40. Millward, Dan B., Extensions of self-assembled structures to increased dimensions via a “bootstrap” self-templating method.
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  41. Arora, William J.; Ghaffari, Roozbeh, Extremely stretchable electronics.
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  79. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
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  80. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
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  81. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
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  82. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
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  83. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Methods and devices for fabricating and assembling printable semiconductor elements.
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  85. Rolland, Jason P.; Maynor, Benjamin; Henn, Robert Lyon, Methods and materials for fabricating laminate nanomolds and nanoparticles therefrom.
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  86. Rolland, Jason P.; Maynor, Benjamin; Henn, Robert Lyon, Methods and materials for fabricating laminate nanomolds and nanoparticles therefrom.
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  87. Rolland, Jason P.; Maynor, Benjamin; Henn, Robert Lyon, Methods and materials for fabricating laminate nanomolds and nanoparticles therefrom.
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  88. Rolland, Jason P.; Maynor, Benjamin; Henn, Robert Lyon, Methods and materials for fabricating laminate nanomolds and nanoparticles therefrom.
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  89. Rolland, Jason P.; Maynor, Benjamin; Henn, Robert Lyon, Methods and materials for fabricating laminate nanomolds and nanoparticles therefrom.
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  90. DeSimone, Joseph M.; Rolland, Jason P.; Maynor, Benjamin W.; Euliss, Larkin E.; Rothrock, Ginger Denison; Dennis, Ansley E.; Samulski, Edward T.; Samulski, R. Jude, Methods for fabricating isolated micro- and nano-structures using soft or imprint lithography.
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  91. DeSimone, Joseph M.; Rolland, Jason P.; Maynor, Benjamin W.; Euliss, Larken E.; Rothrock, Ginger Denison; Dennis, Ansley E.; Samulski, Edward T.; Samulski, R. Jude, Methods for fabricating isolated micro- or nano-structures using soft or imprint lithography.
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  92. DeSimone, Joseph M.; Rolland, Jason P.; Maynor, Benjamin W.; Euliss, Larken E.; Rothrock, Ginger Denison; Dennis, Ansley E.; Samulski, Edward T.; Samulski, R. Jude, Methods for fabricating isolated micro- or nano-structures using soft or imprint lithography.
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  93. DeSimone, Joseph M.; Rolland, Jason P.; Maynor, Benjamin W.; Euliss, Larken E.; Rothrock, Ginger Denison; Dennis, Ansley E; Samulski, Edward T.; Samulski, R. Jude, Methods for fabricating isolated micro-and nano-structures using soft or imprint lithography.
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  94. Leon, Francisco; Lemmi, Francesco; Miller, Jeffrey; Dutton, David; Stumbo, David P., Methods for formation of substrate elements.
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  134. Rogers, John A., Optical component array having adjustable curvature.
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  136. Rogers, John; Nuzzo, Ralph; Meitl, Matthew; Menard, Etienne; Baca, Alfred J.; Motala, Michael; Ahn, Jong-Hyun; Park, Sang-II; Yu, Chang-Jae; Ko, Heung-Cho; Stoykovich, Mark; Yoon, Jongseung, Optical systems fabricated by printing-based assembly.
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  137. Rogers, John; Nuzzo, Ralph; Meitl, Matthew; Menard, Etienne; Baca, Alfred J.; Motala, Michael; Ahn, Jong-Hyun; Park, Sang-Il; Yu, Chang-Jae; Ko, Heung Cho; Stoykovich, Mark; Yoon, Jongseung, Optical systems fabricated by printing-based assembly.
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  139. Rogers, John; Nuzzo, Ralph; Meitl, Matthew; Menard, Etienne; Baca, Alfred; Motala, Michael; Ahn, Jong-Hyun; Park, Sang-Il; Yu, Chang-Jae; Ko, Heung Cho; Stoykovich, Mark; Yoon, Jongseung, Optical systems fabricated by printing-based assembly.
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  140. Cok, Ronald S.; Rotzoll, Robert R.; Bower, Christopher; Meitl, Matthew, Parallel redundant chiplet system for controlling display pixels.
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  143. Weiss, Sharon M.; Ryckman, Judson D.; Jiao, Yang, Porous nanomaterials having three-dimensional patterning.
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  146. Bower, Christopher; Menard, Etienne; Meitl, Matthew; Carr, Joseph, Printable device wafers with sacrificial layers.
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  152. Bower, Christopher; Meitl, Matthew; Gomez, David; Prevatte, Jr., Carl; Bonafede, Salvatore, Printable inorganic semiconductor structures.
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  153. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao; Ko, Heung Cho; Mack, Shawn, Printable semiconductor structures and related methods of making and assembling.
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  154. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao; Ko, Heung Cho; Mack, Shawn, Printable semiconductor structures and related methods of making and assembling.
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  155. Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao; Ko, Heung Cho; Mack, Shawn, Printable semiconductor structures and related methods of making and assembling.
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  156. Rogers, John A.; Kim, Tae Ho; Choi, Won Mook; Kim, Dae Hyeong; Meitl, Matthew; Menard, Etienne; Carlisle, John, Printable, flexible and stretchable diamond for thermal management.
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  157. Rogers, John A.; Nuzzo, Ralph; Kim, Hoon-sik; Brueckner, Eric; Park, Sang Il; Kim, Rak Hwan, Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays.
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  158. Rogers, John A.; Nuzzo, Ralph; Kim, Hoon-sik; Brueckner, Eric; Park, Sang Il; Kim, Rak Hwan, Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays.
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  159. Bower, Christopher; Meitl, Matthew; Cok, Ronald S., Printed capacitors.
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  160. Menard, Etienne, Printing semiconductor elements by shear-assisted elastomeric stamp transfer.
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  161. Menard, Etienne; Rogers, John A.; Kim, Seok; Carlson, Andrew, Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion.
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  162. Rogers, John A.; Hwang, SukWon; Huang, Xian, Processing techniques for silicon-based transient devices.
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  163. Lichtensteiger, Lukas; Pfeffer, Christian, Production of free-standing solid state layers by thermal processing of substrates with a polymer.
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  164. Ghaffari, Roozbeh; Schlatka, Benjamin; Callsen, Gilman; de Graff, Bassel, Protective cases with integrated electronics.
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  165. Rogers, John A.; Wilson, William L.; Jin, Sung Hun; Dunham, Simon N.; Xie, Xu; Islam, Ahmad; Du, Frank; Huang, Yonggang; Song, Jizhou, Purification of carbon nanotubes via selective heating.
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  166. Bower, Christopher; Meitl, Matthew; Cok, Ronald S., Redistribution layer for substrate contacts.
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  167. Millward, Dan B.; Marsh, Eugene P., Registered structure formation via the application of directed thermal energy to diblock copolymer films.
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  168. Rogers, John A.; Nuzzo, Ralph G.; Meitl, Matthew; Ko, Heung Cho; Yoon, Jongseung; Menard, Etienne; Baca, Alfred J., Release strategies for making transferable semiconductor structures, devices and device components.
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  169. Rogers, John A.; Nuzzo, Ralph G.; Meitl, Matthew; Ko, Heung Cho; Yoon, Jongseung; Menard, Etienne; Baca, Alfred J., Release strategies for making transferable semiconductor structures, devices and device components.
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  170. Stumbo, David P.; Pan, Yaoling; Grigoropoulos, Costas P.; Misra, Nipun, Selective processing of semiconductor nanowires by polarized visible radiation.
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  172. Rotzoll, Robert R., Self-compensating circuit for faulty display pixels.
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  175. Rogers, John A.; Fan, Jonathan; Yeo, Woon-Hong; Su, Yewang; Huang, Yonggang; Zhang, Yihui, Self-similar and fractal design for stretchable electronics.
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  176. Rogers, John A.; Fan, Jonathan; Yeo, Woon-Hong; Su, Yewang; Huang, Yonggang; Zhang, Yihui, Self-similar and fractal design for stretchable electronics.
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  177. Millward, Dan B.; Quick, Timothy A.; Greeley, J. Neil, Semiconductor device structures including metal oxide structures.
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  178. Millward, Dan B.; Quick, Timothy A.; Greeley, J. Neil, Semiconductor structures including polymer material permeated with metal oxide.
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  179. Cok, Ronald S., Serial row-select matrix-addressed system.
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  180. Bower, Christopher; Rotzoll, Robert R.; Meitl, Matthew; Cok, Ronald S., Small-aperture-ratio display with electrical component.
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  181. Kerr, Roger S.; Tredwell, Timothy J.; Baek, Seung-Ho, Solvent softening to allow die placement.
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  182. Meitl, Matthew; Bower, Christopher; Cok, Ronald S., Stamp with structured posts.
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  183. Ishii, Satoshi; Ogino, Masahiko; Shizawa, Noritake; Mori, Kyoichi; Miyauchi, Akihiro, Stamper for transferring fine pattern and method for manufacturing thereof.
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  184. Millward, Dan B.; Sandhu, Gurtej S., Stamps and methods of forming a pattern on a substrate.
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  185. Rogers, John A.; Huang, Yonggang; Ko, Heung Cho; Stoykovich, Mark; Choi, Won Mook; Song, Jizhou; Ahn, Jong Hyun; Kim, Dae Hyeong, Stretchable and foldable electronic devices.
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  186. Rogers, John A; Huang, Yonggang; Ko, Heung Cho; Stoykovich, Mark; Choi, Won Mook; Song, Jizhou; Ahn, Jong Hyun; Kim, Dae Hyeong, Stretchable and foldable electronic devices.
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  187. Rogers, John A; Huang, Yonggang; Ko, Heung Cho; Stoykovich, Mark; Choi, Won Mook; Song, Jizhou; Ahn, Jong Hyun; Kim, Dae Hyeong, Stretchable and foldable electronic devices.
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  188. Rogers, John A.; Khang, Dahl Young; Sun, Yugang, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
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  189. Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
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  190. Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
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  193. Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
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  194. Rogers, John A.; Khang, Dahl Young; Menard, Etienne, Stretchable semiconductor elements and stretchable electrical circuits.
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  195. Bower, Christopher; Menard, Etienne; Meitl, Matthew, Structures and methods for testing printable integrated circuits.
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  196. Millward, Dan B., Sub-10 NM line features via rapid graphoepitaxial self-assembly of amphiphilic monolayers.
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  199. Mau, Albert; Dai, Li-ming; Huang, Shaoming, Substrate-supported aligned carbon nanotube films.
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  201. Crosby, Alfred J.; Chan, Edwin P., Surface buckling method and articles formed thereby.
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  205. Bower, Christopher; Meitl, Matthew, Systems and methods for preparing GaN and related materials for micro assembly.
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  206. Bower, Christopher; Meitl, Matthew, Systems and methods for preparing GaN and related materials for micro assembly.
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  207. De Graff, Bassel; Ghaffari, Roozbeh; Arora, William J., Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy.
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  208. de Graff, Bassel; Ghaffari, Roozbeh; Arora, William J., Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy.
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  209. Ghaffari, Roozbeh; de Graff, Bassel; Callsen, Gilman; Arora, William J.; Schlatka, Benjamin; Kuznetsov, Eugene, Systems, methods, and devices using stretchable or flexible electronics for medical applications.
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  211. Millward, Dan B.; Quick, Timothy, Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference.
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  212. Millward, Dan B.; Quick, Timothy A., Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference.
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  213. Kerr, Roger S.; Tredwell, Timothy J.; Baek, Seung-Ho, Thermal barrier layer for integrated circuit manufacture.
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  214. Rogers, John A.; Kim, Hoon-Sik; Huang, Yonggang, Thermally managed LED arrays assembled by printing.
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  215. Rogers, John A.; Omenetto, Fiorenzo G.; Hwang, Suk-Won; Tao, Hu; Kim, Dae-Hyeong; Kaplan, David, Transient devices designed to undergo programmable transformations.
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  216. Rogers, John A.; Kang, Seung-Kyun; Hwang, SukWon; Cheng, Jianjun; Zhang, Yanfeng; Ying, Hanze, Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates.
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  217. Rogers, John A.; Kang, Seung-Kyun; Hwang, SukWon; Cheng, Jianjun; Zhang, Yanfeng; Ying, Hanze, Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates.
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  218. Cok, Ronald S.; Rotzoll, Robert R., Two-terminal store-and-control circuit.
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  219. Menard, Etienne, Vacuum coupled tool apparatus for dry transfer printing semiconductor elements.
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  220. Rogers, John A.; Kim, Rak-Hwan; Kim, Dae-Hyeong; Kaplan, David L.; Omenetto, Fiorenzo G., Waterproof stretchable optoelectronics.
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  221. Rotzoll, Robert R.; Bower, Christopher Andrew; Cok, Ronald S., Wirelessly powered display and system.
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  222. Crosby, Alfred J.; Chan, Edwin P.; Hayward, Ryan C., Wrinkled adhesive surfaces and methods for the preparation thereof.
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  223. Saha, Sourabh Kumar; Culpepper, Martin Luther, Wrinkled surfaces with tunable hierarchy and methods for the preparation thereof.
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