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Cleaning compositions and methods of use thereof 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C11D-007/32
  • C11D-007/22
  • C11D-007/26
  • C11D-007/50
출원번호 US-0630300 (2003-07-30)
발명자 / 주소
  • Lee,Wai Mun
출원인 / 주소
  • EKC Technology, Inc.
대리인 / 주소
    Morgan Lewis & Bockius LLP
인용정보 피인용 횟수 : 3  인용 특허 : 87

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (87)

  1. Pustilnik Cecil S. (Albuquerque NM) Shannon George E. (Albuquerque NM), A process for removing corrosive by-products from a circuit assembly.
  2. Carandang Carmen M. (Oaks PA) Koch Robert W. (Norristown PA), Activator-accelerator mixtures for alkaline paint stripper compositions.
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  4. Schwartzkopf George (Franklin Township ; Warren County NJ), Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened r.
  5. Lee Wai Mun, Alkanolamine semiconductor process residue removal composition and process.
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  7. Soderquist Cynthia A. (Bolingbrook IL) Lin Mei-Jan L. (Naperville IL), All-volatile multi-functional oxygen and carbon dioxide corrosion control treatment for steam systems.
  8. Murphy Donald P. (Madison Heights MI), Amine stripping composition and method.
  9. Beechko Nicholas (South Burlington VT), Anisotropic etching method and etchant.
  10. Gould Joseph C. (Norwood PA), Automotive cooling system cleaner.
  11. Cuisia ; Dionisio G. ; Hwa ; Chih M. ; Jacob ; Jose T. ; Salutsky ; Murr ell L., Boiler water treatment.
  12. Bakos Peter (Endicott NY) Bendz Gerald A. (Vestal NY) Darrow Russell E. (Newark Valley NY) Rivenburgh Dennis L. (Endicott NY), Cleaning composition and use thereof.
  13. Lee Wai M. (Fremont CA), Cleaning compositions for removing etching residue and method of using.
  14. Lee Wai Mun, Cleaning compositions for removing etching residue and method of using.
  15. Lee Wai Mun (Fremont CA), Cleaning compositions for removing etching residue with hydroxylamine, alkanolamine, and chelating agent.
  16. Sumansky L. Walter (South Park Township ; Allegheny County PA), Cleaning method for removing sulfur containing deposits from coke oven gas lines.
  17. Lee Wai Mun ; Pittman ; Jr. Charles U. ; Small Robert J., Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials.
  18. Obanawa Heiichiro (Kamakura JPX) Akiyama Minoru (Yokohama JPX), Composite porous material, process for production and separation of metallic element.
  19. Nemes John J. (Mississauga CAX) Thompson Harvey W. (Mississauga CAX) Waller John E. (Mississauga CAX), Composition and method for deoxygenation.
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  21. Arrington Stephen T. (Duncan OK), Composition and method for removing iron containing deposits from equipment constructed of dissimilar metals.
  22. Hodgens ; II Henry M. (Jupiter FL) Cellich William A. (Boynton Beach FL), Composition for cleaning a gas turbine engine.
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  24. Akiyama Keizi (Shizuoka JPX) Misu Hiroshi (Shizuoka JPX), Developer composition for PS plates for use in making lithographic printing plate and method of plate-making.
  25. Kawagishi ; Shigemitsu ; Arisato ; Yasunori, Electrolytic stripping bath for removing metal coatings from stainless steel base materials.
  26. Hoy Edgar F. (Broken Arrow OK), Enhanced cleaning procedure for copper alloy equipment.
  27. Muccitelli John A. (Feasterville PA), Hydroquinone and mu-amine compositions.
  28. Ciuba Stanley J. (Burnsville MN), Hydroquinone as an oxygen scavenger in an aqueous medium.
  29. O\Brien Thomas P. (Loveland OH) Benjamin Lawrence (Cincinnati OH), Liquid detergent composition.
  30. Natansohn Samuel (Sharon MA) Su Sophia R. (Wellesley MA), Liquid-liquid extraction process for the recovery of tungsten from low level sources.
  31. Bickford Harry R. (Ossining NY) Duke Peter J. (Endwell NY) Foster Elizabeth (Friendsville PA) Goldberg Martin J. (Mahopac NY) Markovich Voya R. (Endwell NY) Matthew Linda C. (Peekskill NY) McBride Do, Method for conditioning halogenated polymeric materials and structures fabricated therewith.
  32. Kerst Herman (Des Plaines IL), Method for deoxygenation of water.
  33. Berkenblit Melvin (Yorktown Heights NY) Reisman Arnold (Yorktown Heights NY), Method for etching silicon and a residue and oxidation resistant etchant therefor.
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  35. Shimizu, Toshihide; Kaneko, Ichiro; Shimakura, Yoshiteru, Method for preventing deposition of polymer scale and a coating agent therefor.
  36. Morris Richard L. (Duncanville TX) Paul James M. (DeSoto TX), Method for removing alkaline sulfate scale.
  37. Lee Wai M. (Fremont CA), Method for removing etching residue using a hydroxylamine-containing composition.
  38. Fox Derek J. (Racine WI), Method for spray cleaning painted surfaces.
  39. Austin Larry W. (Hinesburg VT) Linde Harold G. (Richmond VT), Method of anisotropically etching silicon wafers and wafer etching solution.
  40. Berkenblit Melvin (Yorktown Heights NY) Green Dennis C. (Peekskill NY) Kaufman Frank B. (New York NY) Reisman Arnold (Yorktown Heights NY), Method of controlling silicon wafer etching rates-utilizing a diazine catalyzed etchant.
  41. Cheng Shirley (Hopewell Junction NY) Araps Constance J. (Wappingers Falls NY) Arnold Allen J. (LaGrangeville NY) Coffin Jeffrey T. (Wappingers Falls NY) Nguyen Luu T. (Peekskill NY), Method of inhibiting corrosion in an electronic package.
  42. Lee Wai Mun ; Pittman ; Jr. Charles U. ; Small Robert J., Method of removing etching residue.
  43. Harder Scott R. (Naperville IL) Soderquist Cynthia A. (Bolingbrook IL) Pierce Claudia C. (Lisle IL), Method of retarding corrosion of metal surfaces in contact with boiler water systems which corrosion is caused by dissol.
  44. Lee Wai M. (Milpitas CA), Method of stripping resists from substrates using hydroxylamine and alkanolamine.
  45. Muccitelli, John A., Method of utilizing improved stability oxygen scavenger compositions.
  46. Martin Larry D. (Duncan OK), Methods and compositions for removing deposits containing iron sulfide from surfaces comprising basic aqueous solutions.
  47. Honda Kenji ; Molin Richard M. ; Hansen Gale L., Non-corrosive stripping and cleaning composition.
  48. Vander Mey John E. (Stirling NJ), Organic sulfonic acid stripping composition and method with nitrile and fluoride metal corrosion inhibitor system.
  49. Vander Mey John E. (Stirling NJ), Phenol-free and chlorinated hydrocarbon-free photoresist stripper comprising surfactant and hydrotropic aromatic sulfoni.
  50. Vander Mey John E. (Stirling NJ), Phenol-free photoresist stripper.
  51. Case Nelson S. (Rochester NY) Wyatt Danny L. (Rochester NY), Photographic color developer compositions.
  52. Twist Peter J. (Great Missenden GB2) Bailey Joseph (Bushey Heath GB2) Briggs Stuart P. (London GB2) Mijovic Miroslav V. (Watford GB2) Southby David T. (Rayners Lane GB2), Photographic color developer compositions.
  53. Vincent Sheridan E. (Rochester NY) Purol Michael D. (Rochester NY), Photographic color developer compositions.
  54. Sabongi Gebran J. (St. Paul MN), Photographic tanning developer formulation.
  55. Dean Alicia (11 Robin Hill Poughkeepsie NY 12603) Fitzsimmons John A. (51 Skyview Dr. Poughkeepsie NY 12603) Havas Janos (Larchmont Dr. Hopewell Junction NY 12533) McCormick Barry C. (12 Patricia Rd., Photoresist stripper.
  56. Haq Noor (20291 Saratoga-Los Gatos Road Saratoga CA 95070), Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydro.
  57. Lee Wai M. (Milpitas CA), Photoresist stripping composition and method.
  58. Tanabe Masahito,JPX ; Wakiya Kazumasa,JPX ; Kobayashi Masakazu,JPX ; Nakayama Toshimasa,JPX, Photoresist stripping liquid compositions and a method of stripping photoresists using the same.
  59. Fang Treliant (Lawrenceville NJ), Photoresist stripping method.
  60. Toro Salvador (Forest Hills NY), Process for preparing nonconductive substrates.
  61. Bendz ; Diana Jean ; Bendz ; Gerald Andrei, Process for stripping resist layers from substrates.
  62. Wojtech Bernhard (Bad Soden am Taunus DEX) Niederstaetter Walter (Eltville DEX) Thamm Horst-Dieter (Eschborn DEX), Process for the preparation of novolak resins with low metal ion content.
  63. Tanabe Masahito,JPX ; Wakiya Kazumasa,JPX ; Kobayashi Masakazu,JPX ; Nakayama Toshimasa,JPX, Process for treating a lithographic substrate and a rinse solution for the treatment.
  64. Beck Leslie M. ; Raney David A., Process for treating an aluminum can using a mobility enhancer.
  65. Lee Wai Mun, Process using hydroxylamine-gallic acid composition.
  66. Shih Kwang K. (Yorktown Heights NY), Pyrocatechol-amine-water solution for the determination of defects.
  67. Harriman Lester W. (Angleton TX) Muehlberg Paul E. (Jackson TX) Teumac Fred N. (Charlotte SC), Removal of copper containing incrustations from ferrous surfaces.
  68. Tanabe Masahito,JPX ; Wakiya Kazumasa,JPX ; Kobayashi Masakazu,JPX ; Nakayama Toshimasa,JPX, Remover solution composition for resist and method for removing resist using the same.
  69. Sato Hiromitsu (Chigasaki JPX) Tazawa Kenji (Samukawa JPX) Aoyama Toshimi (Fujisawa JPX), Remover solution for photoresist.
  70. Lesinski Chester A. (Bay City MI), Scale removal, ferrous metal passivation and compositions therefor.
  71. Bastenbeck, Edwin W., Selective nickel stripping compositions and method of stripping.
  72. Merrem Hans-Joachim (Seeheim-Jugenheim DEX) Schmitt Axel (Walluf DEX), Solvents for photoresist removal.
  73. Sizensky Joseph J. (Seekonk MA), Stripping composition and method of using the same.
  74. Ward ; Jr. Irl E. (Easton PA) Hallquist Lisa G. (Easton PA) Hurley Thomas J. (Easton PA), Stripping compositions and methods of stripping resists.
  75. Ward ; Jr. Irl E. (Easton PA) Hallquist Lisa G. (Easton PA) Hurley Thomas J. (Easton PA), Stripping compositions and methods of stripping resists.
  76. Ward Irl E. (Easton PA) Hallquist Lisa G. (Easton PA) Hurley Thomas J. (Easton PA), Stripping compositions and methods of stripping resists.
  77. Ward Irl E. (Easton PA) Hallquist Lisa G. (Easton PA) Hurley Thomas J. (Easton PA), Stripping compositions and methods of stripping resists.
  78. Lee Wai M. (Milpitas CA), Stripping compositions comprising hydroxylamine and alkanolamine.
  79. Ward Irl E. (Hatfield PA), Stripping compositions containing an alkylamide and an alkanolamine and use thereof.
  80. Ward Irl E. (Bethlehem PA), Stripping with aqueous composition containing hydroxylamine and an alkanolamine.
  81. Tanabe Masahito,JPX ; Wakiya Kazumasa,JPX ; Kobayashi Masakazu,JPX ; Nakayama Toshimasa,JPX, Substrate treatment method.
  82. Hayashida Ichiro (Kawagoe JPX) Kakizawa Masahiko (Kawagoe JPX) Umekita Kenichi (Kawagoe JPX) Nawa Hiroyoshi (Kawagoe JPX) Muraoka Hisashi (Yokohama JPX), Surface treating cleaning method.
  83. Muraoka Hisashi (Yokohama JPX) Asano Masafumi (Yokosuka JPX) Ohashi Taizo (Kanagawa JPX) Shimazaki Yuzo (Tokyo JPX), Surface-treating agent adapted for intermediate products of a semiconductor device.
  84. Lee Wai M. (Milpitas CA), Triamine positive photoresist stripping composition and post-ion implantation baking.
  85. Lee Wai M. (Milpitas CA), Triamine positive photoresist stripping composition and prebaking process.
  86. Zupanovich John D. (Pittsburgh PA) Neil Lois J. (Sewickley PA) Sepelak Dennis J. (McMurray PA), Trihydroxybenzene boiler corrosion inhibitor compositions and method.
  87. Cogan George W. (Menlo Park CA) Christel Lee A. (Menlo Park CA) Merchant J. Thomas (Los Gatos CA) Gibbons James F. (Palo Alto CA), Ultra-thin solar cell and method.

이 특허를 인용한 특허 (3)

  1. Wu, Aiping; Lee, Yi-Chia; Liu, Wen Dar; Rao, Machukar Bhaskara; Banerjee, Gautam, Cleaning formulations and method of using the cleaning formulations.
  2. Lee, Wai Mun, Composition and method for treating semiconductor substrate surface.
  3. Lee, Wai Mun, Composition and method for treating semiconductor substrate surface.
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