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Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/16
  • H05H-007/20
  • H05H-007/14
출원번호 US-0972879 (2004-10-25)
발명자 / 주소
  • Rockenfeller,Uwe
출원인 / 주소
  • Rocky Research
대리인 / 주소
    Knobbe Martens Olson & Bear LLP
인용정보 피인용 횟수 : 51  인용 특허 : 21

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (21)

  1. Berenholz Jack (Lexington MA) Bowman John K. (Brighton MA), Air cooled heat exchanger for multi-chip assemblies.
  2. Chao Shun-Lung (Plano TX) McEwin ; Jr. Louis W. (Plano TX), Apparatus and method for cooling electronic devices.
  3. Heitzig Claus-Peter (Germering DEX), Apparatus for the cooling of electronic assemblies or components.
  4. John R. Sterner, Apparatus to enhance cooling of electronic device.
  5. Breeze Gerald D. (West Midlands GB2) Elliott Donald C. (Warwick GB2), Assemblies of electrical or electronic apparatus.
  6. Wickelmaier Peter,DEX ; Orey Suavi,DEX ; Enrhart Peter,DEX, Component holder with circulating air cooling of electrical components.
  7. Yamamoto Haruhiko (Yokohama JPX) Suzuki Masahiro (Inagi JPX) Udagawa Yoshiaki (Tokyo JPX) Nakata Mitsuhiko (Kawasaki JPX) Katsuyama Koji (Yokohama JPX) Ono Izumi (Hachioji JPX) Kikuchi Shunichi (Yoko, Cooling system for an electronic circuit device.
  8. Yamamoto Haruhiko (Yokohama JPX) Sakai Masaaki (Tokyo JPX) Udagawa Yoshiaki (Tokyo JPX) Katsuyama Kouji (Yokohama JPX) Nakata Mitsuhiko (Kawasaki JPX), Cooling system for electronic circuit device.
  9. Ekrot Alexander C. ; Shero James P., Electronic apparatus having removable processor/heat pipe cooling device modules therein.
  10. Chu Richard C. ; Chrysler Gregory M., Evaporator for use in an extended air cooling system for electronic components.
  11. Choo Kok Fah,SGX ; Liu Chang Yu,SGX ; Wong Yew Wah,SGX ; Chan Weng Kong,SGX ; Tou Kwok Woon,SGX, Heat sink.
  12. Faneuf, Barrett M.; Berry, William E.; Holalkere, Ven R.; De Lorenzo, David S., High capacity air-cooling systems for electronic apparatus and associated methods.
  13. Davidson Howard L. (San Carlos CA) Ettehadieh Ehsan (Albany CA) Schulte John (Mountain View CA), Optimized integral heat pipe and electronic circuit module arrangement.
  14. Toedtman Thomas (Lake Forest CA) Welch Randall S. (Lake Forest CA), Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices.
  15. Cosley, Michael R.; Fischer, Richard L.; Thiesen, Jack H.; Willen, Gary S., Small scale chip cooler assembly.
  16. DiPaolo, Frank E., Spiral copper tube and aluminum fin thermosyphon heat exchanger.
  17. Paradis, Gabriel, System for cooling computer components housed within a computer casing.
  18. Garner, Scott D., Thermal management system and method for electronics system.
  19. Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (Mechanicsburg PA), Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability.
  20. Hamburgen William R. (Palo Alto CA) Fitch John S. (Newark CA) Jouppi Norman P. (Palo Alto CA), Thermosiphon for cooling a high power die.
  21. Reyzin, Ilya; Bhatti, Mohinder Singh; Ghosh, Debashis; Joshi, Shrikant Mukund, Thermosiphon for electronics cooling with high performance boiling and condensing surfaces.

이 특허를 인용한 특허 (51)

  1. Lewis, II, Richard Evans; Proulx, Joseph Charles, Air directing device.
  2. MacDonald, Mark; McEuen, Shawn S., Apparatus, system and method for concealed venting thermal solution.
  3. Dunn, William; Diaz, Marcos; Azevedo, Kyle, Back to back electronic display assembly.
  4. Reber, David, Computer with door-mounted electronics.
  5. Reber, David; Garel, Michael, Computer with high intensity screen.
  6. Reber, David; Garel, Michael, Computer with high intensity screen.
  7. Reber, David; Garel, Michael, Computer with removable cartridge.
  8. Dunn, William, Constricted convection cooling system for an electronic display.
  9. Moscovitch, Jerry; Yap, Luther V. Diaz; Wilk, Raymond, Display enclosure.
  10. Perry, Michael C.; Moscovitch, Jerry; Yap, Luther V. Diaz; Wilk, Raymond, Display enclosure.
  11. Perry, Michael C.; Moscovitch, Jerry; Yap, Luther V. Diaz; Wilk, Raymond, Display enclosure.
  12. Seo, Byung Hee, Display enclosure for use with audio/visual devices or the like.
  13. Beauchamp, William Norris; Dittus, Karl Klaus; Scott, III, Whitcomb Randolph; Xu, Jean Jidong, Duct system for high power adapter cards.
  14. Krietzman, William, Ducted exhaust equipment enclosure.
  15. Krietzman, William; Lewis, II, Richard Evans; Vanlith, Dennis W., Ducted exhaust equipment enclosure.
  16. Krietzman, William; Lewis, II, Richard Evans; Vanlith, Dennis W., Ducted exhaust equipment enclosure.
  17. Krietzman, William; Lewis, II, Richard Evans; Vanlith, Dennis W., Ducted exhaust equipment enclosure.
  18. Krietzman, William; Lewis, II, Richard Evans; Vanlith, Dennis W., Ducted exhaust equipment enclosure.
  19. Krietzman, William; Lewis, II, Richard Evans; Vanlith, Dennis W., Ducted exhaust equipment enclosure.
  20. Lev, Jeffrey A.; Jeansonne, Jeffrey Kevin; Fry, Walter G., Electronic device thermal management system and method.
  21. Dunn, William; Le, Don; Bedell, Ware, Electronic display assembly having thermal cooling plate and optional convective air cooling loop.
  22. Campagna, Michael A.; McKeague, Jack; Molberger, Adam, Enclosed television with improved cable cover sealing mechanism.
  23. Campagna, Michael A.; McKeague, Jack; Molberger, Adam, Enclosed television with improved enclosure sealing arrangement.
  24. Campagna, Michael A.; McKeague, Jack; Molberger, Adam, Enclosed television with improved enclosure sealing arrangement.
  25. Moscovitch, Jerry; Yap, Luther V. Diaz, Enclosure for audio/visual devices or the like.
  26. Dunn, William; Bedell, Ware; Hubbard, Tim, Expanded heat sink for electronic displays.
  27. Bahali, Sumanta K.; Kamath, Vinod; Foster, Sr., Jimmy G., Fan speed control of rack devices where sum of device airflows is greater than maximum airflow of rack.
  28. Dunn, William; O'Connor, Kevin, Figure eight closed loop cooling system for electronic display.
  29. Vitito, Christopher J., Headrest mounted vehicle entertainment system with an integrated cooling system.
  30. Dunn, William; Hubbard, Tim, Heat exchanger for an electronic display.
  31. Dunn, William R., Heat exchanger for back to back electronics displays.
  32. Dunn, William; Diaz, Marcos; Azevedo, Kyle, Hybrid rear cover and mounting bracket for electronic display.
  33. Behrens, Edward; Vanlith, Dennis W., Magnetic filler panel for use in airflow control system in electronic equipment enclosure.
  34. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  35. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  36. Lewis, II, Richard Evans, Selectively routing air within an electronic equipment enclosure.
  37. Reber, David, System for mounting a display to a computer.
  38. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  39. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  40. Mahalingam, Raghavendran; Glezer, Ari, Thermal management system for distributed heat sources.
  41. Bhopte, Siddharth; Dummer, Daniel J.; Jadhav, Virendra; Delano, Andrew Douglas, Thermal venting device with pressurized plenum.
  42. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  43. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  44. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  45. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced, inlet air cooling for an electronics rack.
  46. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced, inlet air-cooled thermal conductors.
  47. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced, inlet air-cooled thermal conductors.
  48. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  49. Lewis, II, Richard Evans; VanLith, Dennis W., Vertical exhaust duct.
  50. Lewis, II, Richard Evans; Vanlith, Dennis W., Vertical exhaust duct.
  51. Lewis, II, Richard Evans; Vanlith, Dennis W., Vertical exhaust duct for electronic equipment enclosure.
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