$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Process for the transfer of a thin film 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/30
  • H01L-021/02
출원번호 US-0667707 (2003-09-22)
우선권정보 FR-97 16696(1997-12-30)
발명자 / 주소
  • Moriceau,Hubert
  • Bruel,Michel
  • Aspar,Bernard
  • Maleville,Christophe
출원인 / 주소
  • Commissariat a l'Energie Atomique
대리인 / 주소
    Brinks Hofer Gilson & Lione
인용정보 피인용 횟수 : 12  인용 특허 : 44

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (44)

  1. Rambosek Thomas W. (Woodbury MN), Brush segment for industrial brushes.
    상세보기
  2. Henley Francois J. ; Cheung Nathan W., Controlled cleaning process.
    상세보기
  3. Henley Francois J. ; Cheung Nathan, Controlled cleavage process using pressurized fluid.
    상세보기
  4. Kub Francis J. ; Hobart Karl D., Fabrication ultra-thin bonded semiconductor layers.
    상세보기
  5. Okonogi Kensuke,JPX, Laminated SOI substrate and producing method thereof.
    상세보기
  6. Fan John C. C. (Chestnut Hill MA) Dingle Brenda (Mansfield MA) Shastry Shambhu (Franklin MA) Spitzer Mark B. (Sharon MA) McClelland Robert W. (Norwell MA), Light emitting diode bars and arrays and method of making same.
    상세보기
  7. Inoue Satoshi,JPX ; Shimoda Tatsuya,JPX, Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device.
    상세보기
  8. Bruel Michel,FRX ; Aspar Bernard,FRX, Method for achieving a thin film of solid material and applications of this method.
    상세보기
  9. Lee Sahng Kyoo,KRX ; Park Sang Kyun,KRX, Method for fabricating semiconductor wafers.
    상세보기
  10. Aspar Bernard,FRX ; Bruel Michel,FRX, Method for making a thin film of solid material.
    상세보기
  11. Kub, Francis J.; Hobart, Karl D., Method for making electro-optical devices using a hydrogenion splitting technique.
    상세보기
  12. Kub, Francis J.; Hobart, Karl D., Method for making pyroelectric, electro-optical and decoupling capacitors using thin film transfer and hydrogen ion splitting techniques.
    상세보기
  13. Bruel Michel (Veurey FRX), Method for placing semiconductive plates on a support.
    상세보기
  14. Aspar, Bernard; Bruel, Michel, Method for producing a thin film comprising introduction of gaseous species.
    상세보기
  15. Sato Nobuhiko,JPX ; Yonehara Takao,JPX ; Sakaguchi Kiyofumi,JPX, Method for producing semiconductor substrate.
    상세보기
  16. Matsushita Takeshi,JPX ; Tayanaka Hiroshi,JPX, Method for separating a device-forming layer from a base body.
    상세보기
  17. Eisele Dieter (Lampertheim DEX) Pape Jrgen (Brstadt DEX) Hochhut Armin (Brstadt DEX), Method for the production of a disk-shaped silicon semiconductor component with negative beveling.
    상세보기
  18. Goesele Ulrich M. ; Tong Qin-Yi, Method for the transfer of thin layers monocrystalline material onto a desirable substrate.
    상세보기
  19. Goesele Ulrich M. ; Tong Q.-Y., Method for the transfer of thin layers of monocrystalline material to a desirable substrate.
    상세보기
  20. Moriceau, Hubert; Bruel, Michel; Aspar, Bernard; Maleville, Christophe, Method for transferring a thin film comprising a step of generating inclusions.
    상세보기
  21. Doyle Brian S., Method of delaminating a pre-fabricated transistor layer from a substrate for placement on another wafer.
    상세보기
  22. Doyle, Brian S., Method of delaminating a pre-fabricated transistor layer from a substrate for placement on another wafer.
    상세보기
  23. Aspar Bernard,FRX ; Biasse Beatrice,FRX ; Bruel Michel,FRX, Method of obtaining a thin film of semiconductor material.
    상세보기
  24. Aspar Bernard,FRX ; Bruel Michel,FRX ; Poumeyrol Thierry,FRX, Method of producing a thin layer of semiconductor material.
    상세보기
  25. Aspar Bernard,FRX ; Bruel Michel,FRX ; Poumeyrol Thierry,FRX, Method of producing a thin layer of semiconductor material.
    상세보기
  26. Bryan, Michael A.; Kai, James K., Nozzle for cleaving substrates.
    상세보기
  27. Henley Francois J. ; Cheung Nathan, Planarizing technique for multilayered substrates.
    상세보기
  28. Henley Francois J. ; Cheung Nathan W., Pressurized microbubble thin film separation process using a reusable substrate.
    상세보기
  29. Deines John L. (Pleasant Valley NY) Ku San-Mei (Poughkeepsie NY) Poponiak Michael R. (Newburgh NY) Tsang Paul J. (Poughkeepsie NY), Process for forming monocrystalline silicon carbide on silicon substrates.
    상세보기
  30. Sakaguchi Kiyofumi,JPX ; Yonehara Takao,JPX, Process for producing semiconductor article.
    상세보기
  31. Fukunaga Takeshi,JPX, Process for production of SOI substrate and process for production of semiconductor device.
    상세보기
  32. Egloff Richard, Process for production of thin layers of semiconductor material.
    상세보기
  33. Hanson David R. ; Huston ; III Hance H. ; Srikrishnan Kris V., Process for restoring rejected wafers in line for reuse as new.
    상세보기
  34. Bruel Michel (Veurey FRX), Process for the production of thin semiconductor material films.
    상세보기
  35. Bruel Michel,FRX ; Di Cioccio Lea,FRX, Process for the separation of at least two elements of a structure in contact with one another by ion implantation.
    상세보기
  36. Biasse Beatrice,FRX ; Bruel Michel,FRX ; Zussy Marc,FRX, Process for transferring a thin film from an initial substrate onto a final substrate.
    상세보기
  37. Yamagata Kenji (Kawasaki JPX) Yonehara Takao (Atsugi JPX), Process of fabricating a semiconductor substrate.
    상세보기
  38. Yamauchi, Shoichi; Ohshima, Hisayoshi; Matsui, Masaki; Onoda, Kunihiro; Ooka, Tadao; Yamanaka, Akitoshi; Izumi, Toshifumi, Semiconductor substrate and method of manufacturing the same.
    상세보기
  39. Abe, Takao; Matsuura, Takashi; Murota, Junichi, Semiconductor wafer and method for producing the same.
    상세보기
  40. Cheung Nathan W. ; Sands Timothy D. ; Wong William S., Separation of thin films from transparent substrates by selective optical processing.
    상세보기
  41. Xiang-Zheng Tu (Department of Electrical Engineering ; University of Pennsylvania ; 200 S. 33rd St. Philadelphia PA 19104-6390) Yun-Yan Li (14 Beihehutong Congcheuggu Beijing CNX), Silicon diaphragm piezoresistive pressure sensor and fabrication method of the same.
    상세보기
  42. Henley Francois J. ; Cheung Nathan W., Silicon-on-silicon hybrid wafer assembly.
    상세보기
  43. Bernard Aspar FR; Michel Bruel FR; Eric Jalaguier FR, Structure comprising a thin layer of material made up of conductive zones and insulating zones and a method of manufacturing such a structure.
    상세보기
  44. Robert W. Bower, Transposed split of ion cut materials.
    상세보기

이 특허를 인용한 특허 (12)

  1. Mitani, Kiyoshi, Manufacturing method of bonded wafer.
    상세보기
  2. Henley,Francois J.; Kirk,Harry R., Manufacturing strained silicon substrates using a backing material.
    상세보기
  3. Bruel, Michel, Method and device for fabricating a layer in semiconductor material.
    상세보기
  4. Faure, Bruce; Di Cioccio, Lea, Method of fabricating an epitaxially grown layer.
    상세보기
  5. Meunier-Beillard, Philippe; Hijzen, Erwin; Donkers, Johannes J. T. M., Method of manufacturing a bipolar transistor semiconductor device and semiconductor devices obtained thereby.
    상세보기
  6. Ohnuma, Hideto; Iikubo, Yoichi; Yamazaki, Shunpei, Method of manufacturing semiconductor device.
    상세보기
  7. Letertre, Fabrice, Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods.
    상세보기
  8. Letertre, Fabrice, Methods of fabricating semiconductor structures and devices with strained semiconductor material.
    상세보기
  9. Arena, Chantal, Methods of fabricating semiconductor structures or devices using layers of semiconductor material having selected or controlled lattice parameters.
    상세보기
  10. Arena, Chantal, Methods of fabricating semiconductor structures or devices using layers of semiconductor material having selected or controlled lattice parameters.
    상세보기
  11. Sinha, Nishant; Sandhu, Gurtej S.; Smythe, John, Semiconductor material manufacture.
    상세보기
  12. Letertre, Fabrice, Semiconductor structures and devices including semiconductor material on a non-glassy bonding layer.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로