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Surface mount heat sink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0960160 (2004-10-06)
발명자 / 주소
  • Simon,Glenn C.
  • Schumacher,Derek S.
  • Rubenstein,Brandon A.
출원인 / 주소
  • Hewlett Packard Development Company, L.P.
인용정보 피인용 횟수 : 31  인용 특허 : 27

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (27)

  1. Ziemkowski Ted B, Apparatus and method for adapting surface mount solder pad for heat sink function.
  2. Clemens Donald L. ; Mellinger Mark ; Kuzmin Gary, Apparatus and method for direct attachment of heat sink to surface mount.
  3. Barrett Joseph C., Apparatus for dissipating heat from a conductive layer in a circuit board.
  4. Taylor Billy K. (Columbia SC), Apparatus for using an active circuit board as a heat sink.
  5. Tiziani Roberto,ITX ; Rossi Roberto,ITX ; Villa Claudio Maria,ITX, Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink.
  6. Ionel Jitaru, Component transformer.
  7. Barcley, Tina P., Densely packed electronic assemblage with heat removing element.
  8. Fortune G. Clark (Farmington Hills MI), Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and cha.
  9. MacQuarrie Stephen W. ; Stutzman Randall J. ; Zalesinski Jerzy M., Enhanced heat-dissipating printed circuit board package.
  10. Steen ; Jr. Carl A. (Park Ridge IL) Widmayer Robert B. (Palatine IL), Heat sink clip for surface-mount integrated circuit.
  11. Malaurie Claude (Ermont FRX) Bertet Jol (Sartrouville FRX), Heat sink device or surface mount type component mounted on a printed circuit board.
  12. Edwards Steven Fields ; Clemens Donald Lynn ; Kuzmin Gary, Heat sink for direct attachment to surface mount electronic device packages.
  13. Kuzmin Gary F. ; Clemens Donald Lynn, Heat sink mounting assembly for surface mount electronic device packages.
  14. Hsu,Shih Ping; Wong,Lin Yin, Heat sink structure with embedded electronic components for semiconductor package.
  15. Wieloch Christopher J. (Brookfield WI), Insulated surface mount circuit board construction.
  16. William A. Hagerup, Low temperature co-fired ceramic substrate structure having a capacitor and thermally conductive via.
  17. Ashdown, Glynn Russell, Method for surface mounted power transistor with heat sink.
  18. Larry J. Mowatt ; David Walter, Multi-chip integrated circuit module.
  19. Wang, Meng Jen, Multichip package.
  20. Kenji Koya JP, Multilayer printed wiring board provided with injection hole for thermally conductive filler.
  21. Ootani Mitsuaki,JPX, Multilayered electronic part and electronic circuit module including therein the multilayered electronic part.
  22. Nakamura,Satoshi, Printed wiring board having heat radiating means and method of manufacturing the same.
  23. Andros Frank E. ; Gaynes Michael A. ; Shaukatullah Hussain ; Storr Wayne R., Structure for removably attaching a heat sink to surface mount packages.
  24. McGaha Jerry A. (Gainsville GA) Zeik Andrew C. (Duluth GA), Surface mount heat sink.
  25. Christopher J. Scafidi, Surface mounted conduction heat sink.
  26. Scafidi Christopher J., Surface mounted conduction heat sink.
  27. Scafidi, Christopher J., Surface mounted conduction heat sink.

이 특허를 인용한 특허 (31)

  1. Fitzpatrick, James; Rafati, Amirhossein, Bandwidth optimization in a non-volatile memory system.
  2. Ellis, Robert W.; Herman, Lace J.; Southerland, Bobby Ray, Data hardening in a storage system.
  3. Scaramuzzo, John; Rub, Bernardo; Ellis, Robert W.; Fitzpatrick, James, Data management in a storage system.
  4. Higgins, James M.; Ellis, Robert W.; Dancho, Mark; Fitzpatrick, James, Data management with modular erase in a data storage system.
  5. Fitzpatrick, James; Dancho, Mark; Higgins, James M.; Ellis, Robert W.; Rub, Bernardo, Data storage system with dynamic erase block grouping mechanism and method of operation thereof.
  6. Fitzpatrick, James; Dancho, Mark; Higgins, James M.; Ellis, Robert W.; Rub, Bernardo, Data storage system with dynamic erase block grouping mechanism and method of operation thereof.
  7. Fitzpatrick, James; Dancho, Mark; Higgins, James M.; Ellis, Robert W., Data storage system with dynamic read threshold mechanism and method of operation thereof.
  8. Ellis, Robert W., Data storage system with non-volatile memory and method of operation thereof.
  9. Higgins, James M.; Virgin, Theron W., Data storage system with stale data mechanism and method of operation thereof.
  10. Dean, David Lee; Bennett, Dennis; Ellis, Robert W., Electronic assembly with thermal channel and method of manufacture thereof.
  11. Dean, David Lee; Ellis, Robert W., Electronic system with heat extraction and method of manufacture thereof.
  12. Fitzpatrick, James; Dancho, Mark; Higgins, James M.; Kresse, James M., Electronic system with storage drive life estimation mechanism and method of operation thereof.
  13. Ellis, Robert W.; Fitzpatrick, James; Higgins, James, Electronic system with storage management mechanism and method of operation thereof.
  14. Ellis, Robert W.; Herman, Lace J., Electronic system with system modification control mechanism and method of operation thereof.
  15. Lei, Zhen; Ba, Qinzhen; Duan, Zongxian; Yu, HuiHui, Fixation of heat sink on SFP/XFP cage.
  16. Maglica, Anthony; West, Stacey H.; Radloff, Robert P., LED module.
  17. Fitzpatrick, James; Rafati, Amirhossein, Method and system for improving data integrity in non-volatile storage.
  18. Fitzpatrick, James; Rub, Bernardo; Higgins, James; Jones, Ryan; Ellis, Robert W., Non-volatile memory management system with load leveling and method of operation thereof.
  19. Higgins, James; Fitzpatrick, James; Dancho, Mark, Non-volatile memory management system with time measure mechanism and method of operation thereof.
  20. Jones, Ryan; Ellis, Robert W.; Taylor, Joseph, Storage control system with change logging mechanism and method of operation thereof.
  21. Ellis, Robert W., Storage control system with data management mechanism and method of operation thereof.
  22. Ellis, Robert W.; Fitzpatrick, James; Dancho, Mark; Martin, Michelle, Storage control system with data management mechanism and method of operation thereof.
  23. Schmier, Jacob; Dancho, Mark; Higgins, James M; Jones, Ryan; Ellis, Robert W, Storage control system with data management mechanism and method of operation thereof.
  24. Ellis, Robert W.; Jones, Ryan, Storage control system with data management mechanism of parity and method of operation thereof.
  25. Jones, Ryan; Ellis, Robert W., Storage control system with erase block mechanism and method of operation thereof.
  26. Ellis, Robert W.; Virgin, Theron Wayne; Creasman, Scott, Storage control system with power down mechanism and method of operation thereof.
  27. Ellis, Robert W.; DelPapa, Kenneth B.; Lucas, Gregg S.; Jones, Ryan, Storage control system with power throttling mechanism and method of operation thereof.
  28. Fitzpatrick, James; Higgins, James M.; Rub, Bernardo; Jones, Ryan; Ellis, Robert W.; Dancho, Mark; Park, Sheunghee, Storage control system with power-off time estimation mechanism and method of operation thereof.
  29. Fitzpatrick, James; Rub, Bernardo; Dancho, Mark; Higgins, James; Jones, Ryan, Storage control system with write amplification control mechanism and method of operation thereof.
  30. Ellis, Robert W.; DelPapa, Kenneth B.; Lucas, Gregg S., Storage system with data transfer rate adjustment for power throttling.
  31. Dean, David Lee; Ellis, Robert W.; Harrow, Scott, Test system with localized heating and method of manufacture thereof.
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