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특허 상세정보

Hermetically sealed micro-device package with window

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-021/00   
미국특허분류(USC) 438/106; 438/116
출원번호 US-0880166 (2004-06-29)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Howison & Arnott, L.L.P.
인용정보 피인용 횟수 : 11  인용 특허 : 36
초록이 없습니다.
대표청구항이 없습니다

이 특허에 인용된 특허 (36)

  1. Tatoh Nobuyoshi,JPX. Air-tightly sealed container for photosemiconductor, and photosemiconductor module. USP1999085945721.
  2. Kim, Tae Jun; Song, Yoo Sun. Chip on board package for optical mice and lens cover for the same. USP2003116653724.
  3. Halvorson ; Jr. Harold ; Juhlin Gary S. ; Lewis David M. ; Davies James H.,CAX ; Benoit Richard A. ; Luchetti Robert J. ; Greenberg Peter C.. Clear wall panel system. USP2000116141925.
  4. Benson David K. (Golden CO) Potter Thomas F. (Denver CO). Compact vacuum insulation. USP1992105157893.
  5. Benson David K. (Golden CO) Potter Thomas F. (Denver CO). Compact vacuum insulation. USP1993015175975.
  6. Thomas Gerhard,DEX ; Wutz Karl,DEX ; Fabry Ehrenfried,DEX. Component mounting device for an electrical controller. USP1999075920463.
  7. Meissner Helmuth E.. Composite optical and electro-optical devices. USP1998125846638.
  8. Kock Hendrikus G. (Eindhoven NLX). Coupler comprising a light source and lens. USP1982104355323.
  9. Hauser, Christian; Winderl, Johann; Pohl, Jens. Device for packaging electronic components. USP2003026521988.
  10. Sautner Karl Heinz,DEX ; Kerspe Jobst,DEX. Double-wall insulated container. USP2001016168040.
  11. Ban, Naoto; Namba, Masaaki; Hasebe, Akio; Wada, Yuji; Kohno, Ryuji; Seito, Akira; Motoyama, Yasuhiro. Fabrication method of semiconductor integrated circuit device and its testing apparatus. USP2004026696849.
  12. Thomas, Sunil. Flip-chip assembly of protected micromechanical devices. USP2003126656768.
  13. Alkhimov Anatoly P. (ulitsa Vyazemskogo 2 ; kv. 72 Novosibirsk SUX) Papyrin Anatoly N. (ulitsa Vyazemskogo 2 ; kv. 72 Novosibirsk SUX) Kosarev Vladimir F. (Novosibirsk SUX) Nesterovich Nikolai I. (No. Gas-dynamic spraying method for applying a coating. USP1994045302414.
  14. Martin, John R.; Harney, Kieran H.. Hermetic seals for large optical packages and the like. USP2003106639313.
  15. Wright John O. (Warren PA). Hermetically sealed chip carrier with ultra violet transparent cover. USP1992055115299.
  16. Stark, David H.. Hermetically sealed micro-device package using cold-gas dynamic spray material deposition. USP2004046723379.
  17. Stark, David H.. Hermetically sealed micro-device package with window. USP2003096627814.
  18. Stark, David H.. Hermetically sealed micro-device package with window. USP2004076759590.
  19. Lin, Shin-Shuoh; Wu, Ji-Jun. High flow carafe. USP2004056736295.
  20. Lamberts, Christoph. Holding rail for holding glass profile elements. USP2003126668500.
  21. Van Steenkiste Thomas H. ; Smith John R. ; Teets Richard E. ; Moleski Jerome J. ; Gorkiewicz Daniel W.. Kinetic spray coating method and apparatus. USP2000106139913.
  22. Sengupta Kabul S. ; Sklenicka Carl E. ; Thompson Deborah L. ; Arellano Raul A. ; Nagai Naoyuki,JPX ; Takehashi Nobuyuki,JPX ; Nomoto Kouichiro,JPX. Mass reflowable windowed package. USP2001026191359.
  23. Yang Thomas (Hsin-Chu TWX). Method for manufacturing a hybrid circuit charge-coupled device image sensor. USP1995065423119.
  24. Giachino Joseph M. (Farmington Hills MI) Haeberle Russell J. (Canton MI) Crow Joseph W. (Livonia MI). Method for manufacturing variable capacitance pressure transducers. USP1981044261086.
  25. Kurtz Anthony D. (Englewood NJ). Methods of fabricating low pressure silicon transducers. USP1977044016644.
  26. O'Boyle John. Micro-electronic assembly including a flip-chip mounted micro-device and method. USP1999015856914.
  27. Glenn Thomas P.. Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device. USP1999095949655.
  28. Peterson, Kenneth A.; Watson, Robert D.. Multilayered microelectronic device package with an integral window. USP2003036538312.
  29. Tower Steven A. ; Mravic Brian. Optical component package with a hermetic seal. USP2000026020628.
  30. Furuyama Hideto,JPX. Optical semiconductor module and method for manufacturing the same. USP1998025719979.
  31. Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.. Packaging of electro-microfluidic devices. USP2003046548895.
  32. Baret, Guy. Process for the manufacture of components on glass substrates that have to be sealed, such as flat display screens of the plasma-panel type. USP2003036537121.
  33. Yoneda Yoshiyuki (Kawasaki JPX) Tsuji Kazuto (Kawasaki JPX). Semiconductor device in a resin package housed in a frame having high thermal conductivity. USP1997045625222.
  34. Komeda Masakatsu (Kashihara JPX) Fujiyama Mamoru (Nara JPX). Stainless steel thermos bottle. USP1984014427123.
  35. Mehra Madhav (Rochester NY) Jackson Todd (Pittsford NY). Static control overlayers on opto-electronic devices. USP1992065118924.
  36. Berger, Jr., Allen. Window assembly for opening closures. USP2004076763638.

이 특허를 인용한 특허 피인용횟수: 11

  1. Mott, Lawrence; Bettger, Kenneth; Brown, Elliot. Asymmetrical flexible edge seal for vacuum insulating glass. USP2012108283023.
  2. Stark, David H.; Honor, Patrick Michael. Edge seal assemblies for hermetic insulating glass units and vacuum insulating glass units. USP2017019546513.
  3. Bettger, Kenneth J.; Stark, David H.. Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units. USP2013088512830.
  4. Bettger, Kenneth J.; Stark, David H.. Flexible edge seal for vacuum insulating glazing units. USP2012128329267.
  5. Stark, David H. Insulated glazing units. USP2010117832177.
  6. Stark, David H.. Insulating glass unit having multi-height internal standoffs and visible decoration. USP2011087989040.
  7. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael. Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit. USP20181110119327.
  8. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael. Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit. USP2016059328512.
  9. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John. Multi-pane glass unit having seal with adhesive and gas-restrictive coating layer. USP2017019540863.
  10. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John. Multi-pane glass unit having seal with adhesive and hermetic coating layer. USP2015028950162.
  11. Stark, David H.. Wafer-level hermetic micro-device packages. USP2009047517712.