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Chip on board and heat sink attachment methods 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/44
  • H01L-021/02
출원번호 US-0624332 (2003-07-22)
발명자 / 주소
  • Hembree,David R.
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    TraskBritt
인용정보 피인용 횟수 : 2  인용 특허 : 133

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (133)

  1. Toy Hilton T. ; Edwards David L. ; Shih Da-Yuan ; Giri Ajay P., Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same.
    상세보기
  2. Mertol Atila, Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages.
    상세보기
  3. Eichelberger Charles W. (Schenectady NY), Apparatus and method for positioning an integrated circuit chip within a multichip module.
    상세보기
  4. Liang Louis H. (Los Altos CA), Apparatus and method for thermally coupling a heat sink to a lead frame.
    상세보기
  5. Messina Gaetano P. (Hopewell Junction NY) Brewster Robert A. (Poughkeepsie NY) Kara Theodore J. (Poughkeepsie NY) Song Seaho (Highland NY), Apparatus for cooling integrated circuit chips.
    상세보기
  6. Liang Louis H. (Los Altos CA), Apparatus for thermally coupling a heat sink to a lead frame.
    상세보기
  7. Akram, Salman; Wark, James M., Assembly and methods for packaged die on pcb with heat sink encapsulant.
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  8. Bernier William Emmett ; Gaynes Michael Anthony ; Memis Irving ; Shaukatuallah Hussain, Attaching heat sinks directly to flip chips and ceramic chip carriers.
    상세보기
  9. Bernier William Emmett ; Gaynes Michael Anthony ; Memis Irving ; Shaukatuallah Hussain, Attaching heat sinks directly to flip chips and ceramic chip carriers.
    상세보기
  10. Hembree David R., Attachment method for heat sinks and devices involving removal of misplaced encapsulant.
    상세보기
  11. Lamson Michael A. (Westminster TX) Heinen Katherine G. (Dallas TX), Balanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layer.
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  12. Buckley ; III Frederick (San Jose CA) Blomgren James S. (San Jose CA), Bi-planar multi-chip module.
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  13. Shimizu Nobutaka (Kawasaki JPX) Tsujimura Takehisa (Kawasaki JPX) Sugimoto Masahiro (Yokosuka JPX) Harada Shigeki (Musashino JPX), Ceramic package type semiconductor device and method of assembling the same.
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  14. Frey Brenda D. (Binghamton NY) Joseph Charles A. (Candor NY) Olshefski Francis J. (Endicott NY) Wilson James W. (Vestal NY), Chip carrier with protective coating for circuitized surface.
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  15. Hembree, David R., Chip on board and heat sink attachment methods.
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  16. Hembree David R., Chip on board with heat sink attachment.
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  17. Swei Gwo (Northborough MA), Coated particles and method for making same.
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  18. Carey David H. (Austin TX) Whalen Barry H. (Austin TX), Compact adapter package providing peripheral to area translation for an integrated circuit chip.
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  19. Koopman ; Nicholas George ; Totta ; Paul Anthony, Conduction-cooled circuit package.
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  20. Feinberg Jay H. (Deerfield IL) Roberts William N. (Niles IL), Conformable pad with thermally conductive additive for heat dissipation.
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  21. Mertol Atila, Conformal diamond coating for thermal improvement of electronic packages.
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  22. Lee Sang S. (Sunnyvale CA) Fujimoto George (Santa Clara CA), Design for encapsulation of thermally enhanced integrated circuits.
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  23. Desai Kishor V. ; Patel Sunil A. ; McCormick John P., Die clip assembly for semiconductor package.
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  25. Farnworth Warren M. (Nampa ID) Smith Rockwell D. (Boise ID) Moden Walter L. (Boise ID), Dissimilar adhesive die attach for semiconductor devices.
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  26. Michael H. Bunyan, Double-side thermally conductive adhesive tape for plastic-packaged electronic components.
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  27. Okuaki Hiroshi (Tokyo JPX), EPROM device.
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  28. Geist Henry E. (Scottsdale AZ) Segerson Eugene E. (Tempe AZ), Electrically isolated heatsink for single-in-line package.
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  29. Ikemizu Morihiko,JPX ; Oie Nobuaki,JPX ; Iwasaki Ken,JPX, Electronic device and semiconductor package.
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  30. Gold Glenn E. (Coconut Creek FL) Suppelsa Anthony B. (Coral Springs FL) Suppelsa Anthony J. (Coral Springs FL), Encapsulated electronic component having a heat diffusing layer.
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  31. Mitchell, Craig S., Encapsulation of microelectronic assemblies.
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  32. Toy Hilton T. ; Pompeo Frank L., Enhanced protection of semiconductors with dual surface seal.
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  33. Shinohara Makoto (Crystal Lake IL) Miyashiro James J. (Woodstock IL), Epoxy resinous molding compositions having low coefficient of thermal expansion and high thermal conductivity.
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  34. Ugon Michel (Plaisir FRX), Flat package for integrated circuit devices.
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  35. Edwards David Linn ; Iruvanti Sushumna ; Messina Gaetano Paolo ; Sherif Raed A., Flat plate cooling using a thermal paste retainer.
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  37. Hembree David R. ; Gochnour Derek, Flexible semiconductor interconnect fabricated by backslide thinning.
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  38. Chiu Anthony M. (Richardson TX), Folded bus bar leadframe and method of making.
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  39. Mertol Atila, Grid array device package including advanced heat transfer mechanisms.
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  40. Chia Chok J. ; Lim Seng-Sooi ; Alagaratnam Maniam, Grooved semiconductor die for flip-chip heat sink attachment.
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  41. Patel Chandrakant (Fremont CA), Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate.
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  42. Rostoker Michael D. (San Jose CA) Schneider Mark (San Jose CA) Fulcher Edwin (Palo Alto CA), Heat sink for semiconductor device assembly.
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  43. Spaight ; Ronald Neil, Heat transfer mechanism for integrated circuit package.
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  44. Berndlmaier Erich (Wappingers Falls NY) Clark Bernard T. (Poughquag NY) Dorler Jack A. (Wappingers Falls NY), Heat transfer structure for integrated circuit package.
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  45. Mertol Atila, High performance heat spreader for flip chip packages.
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  46. Combs Edward G. (Foster City CA), High power dissipation plastic encapsulated package for integrated circuit die.
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  47. Brown Candice H. (San Jose CA) Fatemi Homi (Cupertino CA), High thermal conductivity/low alpha emission molding compound containing high purity semiconductor filler and integrated.
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  48. Kim Gu S. (Suwon KRX) Kim Jong G. (Seoul KRX) Ahn Seung H. (Suwon KRX) Park Jae M. (Seoul KRX), High thermal emissive semiconductor device package.
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  49. Patil Sadanand (San Jose CA) Murphy Adrian (San Jose CA) Newman Keith (Sunnyvale CA), Integral dam and heat sink for semiconductor device assembly.
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  50. Johnson Eric Arthur ; Kosteva Stephen John ; MacQuarrie Stephen Wesley, Integral design features for heatsink attach for electronic packages.
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  51. Kierse Oliver J. (Clare County IEX), Integrated circuit package with improved heat dissipation.
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  52. Akram Salman, Integrated heat sink.
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  53. Akram Salman, Integrated heat sink.
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  54. Fick Herbert J. (Northfield MN), Interfacing of heat sinks with electrical devices, and the like.
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  55. Murphy Edmond J. (Bethlehem PA), Leadframe-based optical assembly.
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  56. Juskey Frank J. (Coral Springs FL) Suppelsa Anthony B. (Coral Springs FL) Dorinski Dale W. (Coral Springs FL), Light erasable multichip module.
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  57. Dawson ; deceased Peter F. (late of Portola Valley CA by Shirley B. Dawson ; executrix ) Leibovitz Jacques (San Jose CA) Nagesh Voddarahalli K. (Cupertino CA), Low cost, high thermal performance package for flip chips with low mechanical stress on chip.
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  58. Chiu Chia-Pin ; Sharaf Nadir ; Solbrekken Gary ; Cooks Correy D., Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments.
    상세보기
  59. MacDonald ; Jr. James D. ; Marcinkiewicz Walter M. ; Gupta Rahul, Method and apparatus for packaging a microelectronic device with an elastomer gel.
    상세보기
  60. Akram Salman, Method and apparatus for packaging flip chip bare die on printed circuit boards.
    상세보기
  61. Farnworth Warren M. (Nampa ID) Shrock Ed A. (Boise ID) Clifford Scott (Boise ID) King Jerrold L. (Boise ID) Moden Walter (Boise ID), Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer.
    상세보기
  62. Culnane Thomas Moran (Lanesboro PA) Gaynes Michael Anthony (Vestal NY) Seto Ping Kwong (Endicott NY) Shaukatullah Hussain (Endwell NY), Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy.
    상세보기
  63. Frank Louis Pompeo ; Alain A. Caron CA; Jeffrey Thomas Coffin ; Jeffrey Allen Zitz, Method for direct attachment of a chip to a cooling member.
    상세보기
  64. Hashemi Seyed H. (Austin TX) Olla Michael A. (Austin TX) Dolbear Thomas P. (Austin TX) Nelson Richard D. (Austin TX), Method for encapsulating an integrated circuit using a removable heatsink support block.
    상세보기
  65. Baker Jay D. (Dearborn MI) Pham Cuong V. (Northville MI) Belke ; Jr. Robert E. (West Bloomfield MI), Method for fabricating an undercoated chip electrically interconnected to a substrate.
    상세보기
  66. Lamson Michael A. (Westminster TX) Heinen Katherine G. (Dallas TX), Method for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leads.
    상세보기
  67. Bigler Charles G. (Austin TX) Casto James J. (Austin TX) McShane Michael B. (Austin TX) Afshar David D. (Austin TX), Method for making a lead-on-chip semiconductor device having peripheral bond pads.
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  68. Fujii Hiroyuki (Osaka JPX) Tateno Kenichi (Shiga JPX) Nishikawa Mikio (Kyoto JPX), Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor.
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  69. Mancke Ralph Gustavus (Bethlehem PA) Soos Nicholas Alec (Macungie PA), Method for removal of elastomeric silicone coatings from integrated circuits.
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  70. Heiss ; Jr. John Herbert (Bethlehem PA) Schoen Joel Mark (Freehold NJ), Method for selective encapsulation.
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  71. Rostoker Michael D. (San Jose CA) Dell\Oca Conrad (Palo Alto CA), Method of die burn-in.
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  72. Karavakis Konstantine (Coram NY) Distefano Thomas H. (Monte Sereno CA) Smith ; Jr. John W. (Austin TX) Mitchell Craig (San Jose CA), Method of encapsulating die and chip carrier.
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  73. Kovac Zlata (Los Gatos CA) Mitchell Craig (Santa Clara CA) Distefano Thomas H. (Monte Sereno CA) Smith John W. (Palo Alto CA), Method of fabricating compliant interface for semiconductor chip.
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  74. Lee Sang S. (Sunnyvale CA), Method of forming molded plastic packages with integrated heat sinks.
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  75. Ishida Yoshihiro (Tokorozawa JPX) Komatsu Katsuji (Kawagoe JPX) Mimura Seiichi (Kawagoe JPX) Takenouchi Kikuo (Higashimurayama JPX) Yabe Isao (Tokorozawa JPX) Ichikawa Shingo (Sayama JPX) Shimada Yos, Method of making a resin encapsulated pin grid array with integral heatsink.
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  76. Juskey Frank J. (Coral Springs FL) Bernardoni Lonnie L. (Coral Springs FL) Freyman Bruce J. (Plantation FL) Suppelsa Anthony B. (Coral Springs FL), Method of making a transfer molded semiconductor device.
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  77. Lee Hee G. (Seoul KRX), Method of making integrated circuit package containing inner leads with knurled surfaces.
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  78. DiStefano Thomas H. ; Smith John W. ; Mitchell Craig, Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures.
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  79. Smith Kenneth R. (Aloha OR) Johnston Kent H. (Beaverton OR) LaRue George S. (Beaverton OR) Mueller Robert A. (Portland OR) Tabor Steven A. (Aptos CA), Method of packaging integrated circuit chips, and integrated circuit package.
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  80. Ootsuki Hideaki (Amagasaki JPX) Takada Mitsuyuki (Amagasaki JPX) Kokogawa Toru (Amagasaki JPX) Takasago Hayato (Amagasaki JPX), Method of packaging semiconductor device.
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  81. Yoshida Isamu (Yokohama JPX) Saeki Junichi (Yokohama JPX) Tsunoda Shigeharu (Fujisawa JPX) Nishi Kunihiko (Kokubunji JPX) Anjoh Ichiro (Koganei JPX) Imura Kenichi (Koganei JPX) Yasuhara Toshihiro (Ko, Method of uniformly encapsulating semiconductor a device in resin.
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  82. Tsukagoshi Isao (Shimodate JPX) Yamaguchi Yutaka (Yuki JPX) Nakajima Atsuo (Ibaraki JPX) Goto Yasushi (Shimodate JPX), Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to.
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  83. Hilton T. Toy ; David L. Edwards ; Da-Yuan Shih ; Ajay P. Giri, Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assembly.
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  84. David R. Hembree, Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package.
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  85. David R. Hembree, Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package.
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  86. Smith John W., Methods of making microelectronic corrections with liquid conductive elements.
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  87. Sorimachi Haruo (Kawasaki JPX) Seyama Kiyotaka (Kawasaki JPX) Sumiyoshi Makoto (Kawasaki JPX) Satoh Kazuaki (Kawasaki JPX), Multi-chip module having thermal contacts.
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  88. Chan Min Y (Singapore SGX) Low Siu W. (Singapore SGX), Multi-layered lead frame assembly for integrated circuits.
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  89. Barker ; III Charles R. (Harvard MA) Casabona Richard J. (Stow MA) Fenwick David M. (Chelmsford MA), Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips.
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  90. Kurokawa Yasuhiro (Tokyo JPX), Package for semiconductor elements having thermal dissipation means.
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  92. Kurokawa Yasuhiro (Tokyo JPX), Package structure for semiconductor device having a flexible wiring circuit member spaced from the package casing.
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  93. Michii Kazunari (Itami JPX), Packaged semiconductor device having tab tape and particular power distribution lead structure.
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  94. Marrs Robert C. (Scottsdale AZ), Packaged semiconductor die including heat sink with locking feature.
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  95. Hamburgen William R. (Palo Alto CA) Fitch John S. (Newark CA) Dordi Yezdi N. (Cambridge MA), Paddleless molded plastic semiconductor chip package.
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  97. Wakefield Gene F. (Plano TX), Plastic packaging of microelectronic circuit devices.
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  98. Ohta Hideo (Tokyo JPX) Okuyama Tetsuo (Yokohama JPX) Fujieda Shinetsu (Kawasaki JPX) Kajiura Sadao (Kanagawa-ken JPX) Yoshizumi Akira (Yokohama JPX), Plastic-encapsulated semiconductor device.
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  101. Hayes Donald J. (Plano TX), Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produce.
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  102. Blish ; II Richard C. (Scottsdale AZ), Quad flat package heat slug composition.
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  108. Distefano Thomas H., Semiconductor chip package with expander ring and method of making same.
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  132. John G. Davis ; Michael A. Gaynes ; Joseph D. Poole, Thermoplastic adhesive preform for heat sink attachment.
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  133. Bollesen Vernon, Wire heat sink assembly and method of assembling.
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  1. Bridges, Jeremy S.; La Rocca, Paul J.; Megarity, William M., Heat sink for distributing a thermal load.
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  2. Zhang, Tonglong, Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same.
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AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

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AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

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