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Electrochemical processing cell 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25B-009/00
  • C25C-007/04
  • C25C-007/00
  • C25B-009/08
  • C25B-009/06
출원번호 US-0268284 (2002-10-09)
발명자 / 주소
  • Yang,Michael X.
  • Lubomirsky,Dmitry
  • Dordi,Yezdi
  • Singh,Saravjeet
  • Tulshibagwale,Sheshraj
  • Kovarsky,Nicolay
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Patterson & Sheridan, LLP.
인용정보 피인용 횟수 : 16  인용 특허 : 96

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (96)

  1. Uzoh Cyprian E. ; Andricacos Panayotis C. ; Dukovic John Owen ; Westerfield ; Jr. Robert P., Anode design for semiconductor deposition.
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  2. Kitada Masahiro (Tokyo JPX) Shimizu Noboru (Tokorozawa JPX) Tanabe Hideo (Higashimurayama JPX) Nakatani Ryoichi (Akigawa JPX) Yuito Isamu (Ome JPX) Koyama Naoki (Kokubunji JPX), Antiferromagnetic film superior in corrosion resistance, magnetoresistance-effect element and magnetoresistance-effect h.
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  3. Sheridan Geoffrey P. (Cheshire GB2), Antifoaming and defoaming compositions.
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  4. Chen LinLin, Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece.
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  6. Graham, Lyndon W.; Taylor, Thomas C.; Ritzdorf, Thomas L.; Lindberg, Fredrick A.; Carpenter, Bradley C., Apparatus for controlling and/or measuring additive concentration in an electroplating bath.
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  7. Cheung Robin ; Sinha Ashok ; Tepman Avi ; Carl Dan, Apparatus for electro-chemical deposition with thermal anneal chamber.
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  8. Kyle M. Hanson ; Scott Grace ; Matt Johnson ; Ken Gibbons, Apparatus for electrochemically processing a microelectronic workpiece.
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  9. Woodruff Daniel J. ; Hanson Kyle M., Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member.
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  10. Patton, Evan E.; Fetters, Wayne, Apparatus for electroplating copper onto semiconductor wafer.
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  11. Ang Jane (San Mateo CA), Apparatus for electroplating metal films including a cathode ring, insulator ring and thief ring.
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  12. Robert W. Batz, Jr. ; Scot Conrady ; Thomas L. Ritzdorf, Apparatus for high deposition rate solder electroplating on a microelectronic workpiece.
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  13. Davis Jeffry A. ; Meyer Kevin P. ; Dolechek Kert L., Automated semiconductor processing system.
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  15. Berner Robert W. ; Fatula ; Jr. Joseph J. ; Hitzfeld Robert ; Contreras Richard ; Chiu Andrew, Cathode current control system for a wafer electroplating apparatus.
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  20. Woo Christy Mei-Chu, Consistent plating system for electroplating.
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  33. Landau Uziel, Electro-chemical deposition system and method of electroplating on substrates.
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  34. Scherer Gunther G. (Hagglingen CHX) Buchi Felix N. (Zollikofen CHX) Gupta Bhuvanesh (New Delhi INX), Electrochemical cell with a polymer electrolyte and process for producing these polymer electrolytes.
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  35. Wilkinson David P. (Vancouver CAX) Voss Henry H. (West Vancouver CAX) Dudley James (Port Moody CAX) Lamont Gordon J. (Vancouver CAX) Basura Vesna (Burnaby CAX), Electrochemical fuel cell assembly with integral selective oxidizer.
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  36. Uziel Landau ; John J. D'Urso, Electrodeposition chemistry for filling of apertures with reflective metal.
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  37. Schultz Paul B. (Farmington CT) Yarkosky Eugene F. (Milford CT), Electroless nickel plating of aluminum.
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  38. Sampson Richard L. ; Sampson Allison Hawkins, Electrolytic process and apparatus for the controlled oxidation and reduction of inorganic and organic species in aqueou.
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  39. Reid Jonathan David ; Contolini Robert J. ; Dukovic John Owen, Electroplating anode including membrane partition system and method of preventing passivation of same.
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  40. Calhoun Robert B. ; Johns Earl C., Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations.
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  41. Maydan, Dan; Sinha, Ashok K., Electroplating apparatus using a perforated phosphorus doped consumable anode.
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  42. Reid Jonathan D. ; Taatjes Steven W. ; Contolini Robert J. ; Patton Evan E., Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability.
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  43. Inoue Satoshi,JPX ; Tanaka Toyoaki,JPX ; Nakagawa Yoshiro,JPX, Electroplating method.
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  44. Woodruff Daniel J. ; Hanson Kyle M., Electroplating reactor including back-side electrical contact apparatus.
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  45. Webb, Eric G.; Reid, Jonathan D.; Sukamto, John H.; Varadarajan, Sesha; Pollack, Margolita M.; Buckalew, Bryan L.; Majid, Tariq, Electroplating using DC current interruption and variable rotation rate.
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  46. Uzoh Cyprian Emeka, Electroplating workpiece fixture having liquid gap spacer.
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  47. Chambers, Stephen T.; Dubin, Valery M.; Ott, Andrew W.; Hau-Riege, Christine S., Enhancement of an interconnect.
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  48. Champenois Christophe Jean Roger,FRX ; David Laurent Jean Pierre,FRX ; Gueldry Gerard Michel Roland,FRX ; Martinou Robert Lucien,FRX, Hybrid component with high strength/mass ratio and method of manufacturing said component.
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  49. Cheung Robin ; Carl Daniel A. ; Dordi Yezdi ; Hey Peter ; Morad Ratson ; Chen Liang-Yuh ; Smith Paul F. ; Sinha Ashok K., In-situ electroless copper seed layer enhancement in an electroplating system.
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  50. Kedem Ora,ILX ; Schechtmann Ludmilla,ILX, Ion exchange membranes.
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  51. Ghandour Osman A. (New York NY), Laser etching of semiconductors.
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  52. Reid, Jonathan David; Contolini, Robert J.; Dukovic, John Owen, Membrane partition system for plating of wafers.
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  53. Emesh, Ismail; Chadda, Saket; Korovin, Nikolay N.; Mueller, Brian L., Method and apparatus for electrochemical planarization of a workpiece.
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  54. Forand James L. ; Keeney Harold M. ; Vananglen Erik S., Method and apparatus for electrochemical processing.
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  55. Reid Jonathan David ; Taatjes Steve, Method and apparatus for treating surface including virtual anode.
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  56. Mayer, Steven T.; Patton, Evan E.; Blackman, Brian Paul; Reid, Jonathan D.; Ponnuswamy, Thomas Anand; Perry, Harold D., Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources.
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  57. Chen Linlin, Method for electrolytically depositing copper on a semiconductor workpiece.
    상세보기
  58. Ang Jane, Method for electroplating metal films including use a cathode ring insulator ring and thief ring.
    상세보기
  59. Hui Wang, Method for electropolishing metal on semiconductor devices.
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  60. Andricacos, Panayotis Constantinou; Cabral, Jr., Cyril; Parks, Christopher Carr; Rodbell, Kenneth Parker; Tsai, Roger Yen-Luen, Method for forming electromigration-resistant structures by doping.
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  61. Valery M. Dubin ; Dave W. Jentz ; Christopher Collazo-Davila, Method of copper electroplating.
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  62. Cheung, Robin; Chen, Liang-Yuh, Method of forming copper interconnects.
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  63. Reid, Jonathan D.; Mayer, Steven T.; Varadarajan, Seshasayee; Smith, David C.; Patton, Evan E.; Kalakkad, Dinesh S.; Lind, Gary, Methods and apparatus for controlled-angle wafer immersion.
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  64. Fulton, Dakin; Ritzdorf, Thomas L., Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath.
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  65. Mayer, Steven T.; Stowell, R. Marshall; Patton, Evan E.; Varadarajan, Seshasayee, Methods and apparatus for controlling electrolyte flow for uniform plating.
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  66. Hui Wang, Methods and apparatus for electropolishing metal interconnections on semiconductor devices.
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  67. Wang Hui, Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces.
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  68. Doss Saad K. (Gilroy CA) McKean Dennis R. (San Jose CA) Renaldo Alfred F. (San Jose CA) Wilson Robert J. (Cupertino CA), Patterned electroplating.
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  69. Dordi, Yezdi N., Perforated anode for uniform deposition of a metal layer.
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  70. Hui Wang, Plating apparatus and method.
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  71. Reynolds H. Vincent (Marcellus NY), Plating cell having laminar flow sparger.
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  72. Brown Craig J. (Pickering CAX), Process and apparatus for control of electroplating bath composition.
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  73. Setsuro Ogata JP; Kenichi Ueno JP, Process for copper-plating a wafer using an anode having an iridium oxide coating.
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  74. Drewery, John S.; Powell, Ronald A., Process for forming barrier/seed structures for integrated circuits.
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  75. Vaughan Daniel J., Process for removing iron from tin-plating electrolytes.
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  76. Smith Barbara F. (Los Alamos NM) Robinson Thomas W. (Los Alamos NM), Process for the displacement of cyanide ions from metal-cyanide complexes.
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  77. Oda Masaharu (Hiroshima JPX) Ohashi Hidehiko (Hiroshima JPX) Kamada Kensuke (Hiroshima JPX), Process for the electrodeposition of an amorphous cobalt-iron-phosphorus alloy.
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  78. Dahms Wolfgang,DEX ; Meyer Heinrich,DEX ; Kretschmer Stefan,DEX, Process for the electrolytic deposition of metal layers.
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  79. Zila Vladimir,CAX ; Berner Robert W. ; Woodruff Daniel J., Processing head for semiconductor processing machines.
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  80. Steven L. Peace ; Gary L. Curtis ; Raymon F. Thompson ; Brian Aegerter ; Curt T. Dundas, Reactor for processing a semiconductor wafer.
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  81. Woodruff Daniel J. ; Hanson Kyle M., Reactor vessel having improved cup anode and conductor assembly.
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  82. Woodruff Daniel J. ; Hanson Kyle M., Reactor vessel having improved cup, anode and conductor assembly.
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  83. Daniel J. Woodruff ; Kyle M. Hanson, Reactor vessel having improved cup, anode, and conductor assembly.
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  84. Inhofer Harold G. (Hopkins MN), Reciprocating piston-cylinder combination and valving control therefor.
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  85. Ritzdorf Thomas L. ; Turner Jeffrey I. ; Graham Lyndon W., Semiconductor plating bowl and method using anode shield.
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  86. Bergman Eric J. (Kalispell MT) Oberlitner Thomas H. (Whitefish MT), Semiconductor processing with non-jetting fluid stream discharge array.
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  87. Thompson Raymon F. ; Berner Robert W. ; Curtis Gary L. ; Culliton Stephen P. ; Wright Blaine G., Semiconductor wafer processing system.
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  88. Thompson Raymon F. ; Berner Robert W. ; Curtis Gary L. ; Culliton Stephen P. ; Wright Blaine G., Semiconductor wafer processing system with immersion module.
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  89. Dana Scranton ; Gary L. Curtis, Single semiconductor wafer processor.
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  90. Dana Scranton ; Gary L. Curtis, Single semiconductor wafer processor.
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  91. Thompson Raymon F. (Kalispell MT) Gordon Robert W. (Seattle WA) Durado Daniel (Kalispell MT), Single wafer processor.
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  92. Thompson Raymon F. (Kalispell MT) Owczarz Aleksander (Kalispell MT), Single wafer processor apparatus.
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  93. John D. Watson ; Paul Krogh ; David B. Carnegie-Smith AU; Mihailo Gavrilovic ; Ockert R. Fourie AU, Slide assembly having retractable gas-generator apparatus.
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  94. Jieh-Hwa Shyu ; Peter V. Kimball, Spiral anode for metal plating baths.
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  95. Gromko Robert Dean ; Lisi Edmund Terry, Wafer sensor utilizing hydrodynamic pressure differential.
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  96. Kass John J. ; McCoy Richard W., Weight distributing hitch and slide bracket assembly.
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  1. Yang, Michael X.; Kovarsky, Nicolay Y., Anolyte for copper plating.
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  2. Chandrasekhar, Prasanna, Complimentary polymer electrochromic device.
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  3. Chandrasekhar, Prasanna, Complimentary polymer electrochromic device.
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  4. Chandrasekhar, Prasanna, Complimentary polymer electrochromic device.
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  5. Guarnaccia, David; Keigler, Arthur; Papapanayiotou, Demetrius; Chiu, Johannes, Electro chemical deposition and replenishment apparatus.
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  6. Papapanayiotou, Demetrius; Keigler, Arthur; Guarnaccia, David; Hander, Jonathan; Chiu, Johannes, Electro chemical deposition and replenishment apparatus.
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  7. Chandrasekhar, Prasanna; Zay, Brian J.; Modes, Sr., Richard; LaRosa, Anthony; Hobin, Kyle, Electrochemical deposition apparatus and methods of using the same.
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  8. Keigler, Arthur; Guarnaccia, David; Papapanayiotou, Demetrius; Hander, Jonathan, Electrochemical deposition apparatus with remote catholyte fluid management.
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  9. Chandrasekhar, Prasanna; Zay, Brian J.; Laganis, Edward J.; Romanov, Vasily V.; LaRosa, Anthony J., Electrochromic eyewear.
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  10. Woodruff, Daniel J., Electroplating processor with thin membrane support.
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  11. James, Jerome, Metal plating method and apparatus.
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  12. James, Jerome, Metal plating method and apparatus.
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  13. Chandrasekhar, Prasanna; Chai, Yanjie, Potentiostat/galvanostat with digital interface.
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  14. Goodman, Daniel; Keigler, Arthur; Guarnaccia, David G., Substrate holder.
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  16. Chandrasekhar, Prasanna, Variable-emittance electrochromic devices and methods of preparing the same.
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