A method for making a part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) optionally pr
A method for making a part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) optionally providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer, whereby the cured or uncured upper layer becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) optionally curing the lower layer resulting from step (d) if the lower layer is uncured to yield a cured lower layer; (f) after step (e), optionally providing a new uncured upper layer on the uncured upper layer provided in step (d), whereby the uncured upper layer provided in step (d) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (g) after step (f) curing the uncured upper layer and/or the uncured lower layer(s) after step (f) using an electron beam; and (h) optionally repeating steps (d) through (g) a number of times to form a desired number of cured layers.
대표청구항▼
The invention claimed is: 1. A method for making a composite part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/
The invention claimed is: 1. A method for making a composite part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (c) after step (b) selectively curing using an electron beam one or more selected portions of the uncured upper layer and/or the uncured lower layer; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer from step (c), whereby the cured or uncured upper layer from step (c) becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) if the lower layer resulting from step (d) is uncured, selectively curing one or more selected portions of the lower layer resulting from step (d) to yield a cured lower layer that is bonded to one or more previously cured layers; (f) after step (e), providing a new uncured upper layer on the uncured upper layer provided in step (d), whereby the uncured upper layer provided in step (d) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (g) after step (f) selectively curing using an electron beam one or more portions of the uncured upper layer and/or the uncured lower layer(s) after step (f) to yield at least one newly cured layer that is bonded to one or more previously cured layers; (h) repeating steps (d) through (g) a number of times to form the composite part, wherein the composite part has a desired number of cured layers; and (i) optionally removing from the composite part at least some uncured portions. 2. A method as claimed in claim 1, wherein the upper and lower layers are nonmetallic layers. 3. A method as claimed in claim 1, wherein the upper and lower layers are not made of metal. 4. A method as claimed in claim 1, wherein the upper and lower layers are not metallic foil. 5. A method as claimed in claim 1, wherein step (c) comprises curing the uncured lower layer. 6. A method as claimed in claim 1, wherein step (g) comprises curing the uncured lower layer(s). 7. A method as claimed in claim 5, wherein step (g) comprises curing the uncured lower layer(s). 8. A method as claimed in claim 5, wherein step (c) further comprises curing the uncured upper layer. 9. A method as claimed in claim 6, wherein step (g) further comprises curing the uncured upper layer. 10. A method as claimed in claim 7, wherein step (c) further comprises curing the uncured upper layer, and wherein step (g) further comprises-curing the uncured upper layer. 11. A method as claimed in claim 1, wherein step (h) comprises repeating steps (d) through (g) at least about five times. 12. A method as claimed in claim 7, wherein step (h) comprises repeating steps (d) through (g) at least about five times. 13. A method as claimed in claim 1, wherein step (h) comprises repeating steps (d) through (g) at least about 25 times. 14. A method as claimed in claim 7, wherein step (h) comprises repeating steps (d) through (g) at least about 25 times. 15. A method as claimed in claim 1, wherein providing the uncured upper layer in step (a) comprises: (1) laying down a first layer comprising fibers, particles, powder, and/or electronic devices on the part, the substrate, the workpiece, the support platform, or the base layer, and (2) applying resin to the first layer to form the uncured upper layer. 16. A method as claimed in claim 1, wherein providing the new uncured upper layer in step (f) comprises: (1) laying down a second layer of fibers, particles, powder, and/or electronic devices on the uncured layer provided in step (d); and (2) applying resin to the second layer to form the new uncured upper layer. 17. A method as claimed in claim 15, wherein providing the new uncured upper layer in step (f) comprises: (1) laying down a second layer of fibers, particles, powder, and/or electronic devices on the uncured layer provided in step (d); and (2) applying resin to the second layer to form the new uncured upper layer. 18. A method as claimed in claim 1, wherein providing the uncured upper layer in step (a) comprises: applying a first layer of a mixture on the part, the substrate, the workpiece, the support platform, or the base layer, wherein the mixture comprises resin and also comprises fibers, particles, powder, and/or electronic devices. 19. A method as claimed in claim 18, wherein applying the first layer of the mixture comprises spraying, rolling, or brushing the mixture onto the part, the substrate, the workpiece, the support platform, or the base layer. 20. A method as claimed in claim 1, wherein providing the new uncured upper layer in step (f) comprises: applying a second layer of a mixture on the part, the substrate, the workpiece, the support platform, or the base layer, wherein the mixture comprises resin and also comprises fibers, particles, powder, and/or electronic devices. 21. A method as claimed in claim 20, wherein applying the second layer of the-mixture comprises spraying, rolling, or brushing the mixture onto the part, the substrate, the workpiece, the support platform, or the base layer. 22. A method as claimed in claim 18, wherein providing the new uncured upper layer in step (f) comprises: applying a second layer of a mixture on the part, the substrate, the workpiece, the support platform, or the base layer, wherein the mixture comprises resin and also comprises fibers, particles, powder, and/or electronic devices. 23. A method as claimed in claim 19, wherein providing the new uncured upper layer in step (f) comprises: applying a second layer of a mixture on the part, the substrate, the workpiece, the support platform, or the base layer, wherein the mixture comprises resin and also comprises fibers, particles, powder, and/or electronic devices; and wherein applying the second layer of the mixture comprises spraying, rolling, or brushing the mixture onto the part, the substrate, the workpiece, the support platform, or the base layer. 24. A method as claimed in claim 1, wherein providing the uncured upper layer in step (a) comprises: (1) laying down a first layer comprising resin on the part, the substrate, the workpiece, the support platform, or the base layer; and (2) applying fibers, particles, powder, and/or electronic devices to the first layer to form the uncured upper layer. 25. A method as claimed in claim 1, wherein providing the new uncured upper layer in step (f) comprises: (1) laying down a second layer comprising resin on the part, the substrate, the workpiece, the support platform, or the base layer; and (2) applying fibers, particles, powder, and/or electronic devices to the second layer to form the new uncured upper layer. 26. A method as claimed in claim 24, wherein providing the new uncured upper layer in step (f) comprises: (1) laying down a second layer comprising resin on the part, the substrate, the workpiece, the support platform, or the base layer; and (2) applying fibers, particles, powder, and/or electronic devices to the second layer to form the new uncured upper layer. 27. A method as claimed in claim 1, wherein step (g) comprises curing the uncured lower layer resulting from step (f) to yield a cured lower layer that is bonded to a previously cured lower layer. 28. A method as claimed in claim 1, wherein the uncured upper layer in step (c) has a first length in an x direction, a first width in a y direction, and a first depth in a z direction, and wherein the uncured upper layer in step (c) further comprises fibers in the resin generally in the z direction; and wherein the uncured upper layer in step (g) has a second length in the x direction, a second width in the y direction, and a second depth in the z direction, and wherein the uncured upper layer in step (g) further comprises fibers in the resin generally in the z direction. 29. A method as claimed in claim 1, wherein the uncured lower layer instep (c) has a third length in an x direction, a third width in a y direction, and a third depth in a z direction, and wherein the uncured lower layer in step (c) further comprises fibers in the resin generally in the z direction; and wherein the uncured lower layer in step (g) has a fourth length in the x direction, a fourth width in the y direction, and a fourth depth in the z direction, and wherein the uncured lower layer in step (g) further comprises fibers in the resin generally in the z direction. 30. A method as claimed in claim 28, wherein the uncured lower layer in step (c) has a third length in the x direction, a third width in the y direction, and a third depth in the z direction, and wherein the uncured lower layer in step (c) further comprises fibers in the resin generally in the z direction; and wherein the uncured lower layer in step (g) has a fourth length in the x direction, a fourth width in the y direction, and a fourth depth in the z direction, and wherein the uncured lower layer in step (g) further comprises fibers in the resin generally in the z direction. 31. A method as claimed in claim 1, wherein the uncured upper layer in step (c) has a first length in an x direction, a first width in a y direction, and a first depth in a z direction, and wherein the uncured upper layer in step (c) further comprises fibers in the resin generally in the z direction; and wherein the uncured upper layer in step (g) has a second length in the x direction, a second width in the y direction, and a second depth in the z direction, and wherein the uncured upper layer in step (g) further comprises fibers in the resin generally in the z direction; wherein the uncured lower layer in step (c) has a third length in the x direction, a third width in the y direction, and a third depth in the z direction, and wherein the uncured lower layer in step (c) further comprises fibers in the resin generally in the z direction; and wherein the uncured lower layer in step (g) has a fourth length in the x direction, a fourth width in the y direction, and a fourth depth in the z direction, and wherein the uncured lower layer in step (g) optionally further comprises fibers in the resin generally in the z direction; wherein step (g) comprises curing the uncured lower layer resulting from step (f) to yield a cured lower layer that is bonded to a previously cured lower layer and that is also connected to the previously cured lower layer by the fibers in the z direction; wherein the z direction is generally perpendicular to booth the x direction and the y direction; and wherein the x direction is generally perpendicular to the y direction. 32. A method as claimed in claim 28, wherein the composite part optionally has a tensile strength of about 500 MPa to about 3,000 MPa in a direction generally parallel to the fibers in the z direction; wherein the composite part optionally has a tensile modulus of about 50 GPa to about 220 GPa in a direction generally parallel to the fibers in the z direction; and wherein the composite part optionally has a flexural strength of about 600 MPa to about 2,000 MPa in a direction generally parallel to the fibers in the z direction. 33. A method as claimed in claim 30, wherein the composite part optionally has a tensile strength of about 500 MPa to about 3,000 MPa in a direction generally parallel to the fibers in the z direction; wherein the composite part optionally has a tensile modulus of about 50 GPa to about 220 GPa in a direction generally parallel to the fibers in the z direction; and wherein the composite part optionally has a flexural strength of about 600 MPa to about 2,000 MPa in a direction generally parallel to the fibers in the z direction. 34. A method as claimed in claim 30, wherein the composite part has a tensile strength of about 500 MPa to about 3,000 MPa in a direction generally parallel to the fibers in the z direction; wherein the composite part has a tensile modulus of about 50 GPa to about 220 GPa in a direction generally parallel to the fibers in the z direction; and wherein the composite part has a flexural strength of about 600 MPa to about 2,000 MPa in a direction generally parallel to the fibers in the z direction. 35. A method as claimed in claim 1, wherein the composite part includes a portion that is generally not flat. 36. A method as claimed in claim 1, wherein the composite part is not a cube or rectangular solid. 37. A method as claimed in claim 1, wherein the composite part has one or more curved surfaces. 38. A method as claimed in claim 1, wherein the composite part includes a portion that is at least partially cylindrical, spherical, pyramidal, conical, curved, or nonflat. 39. A method as claimed in claim 1, wherein each uncured layer has a length in a x direction, a width in a y direction, and a depth in a z direction; wherein the composite part has a length in the x direction, a width in the y direction, and a depth in the z direction; wherein the x direction is generally perpendicular to the y direction; and wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the length of one or more of the uncured layers is greater than the length of the composite part, and/or wherein the width of one or more of the uncured layers is greater than the width of the composite part, and/or wherein the depth of one or more of the uncured layers is greater than the depth of the composite part. 40. A method as claimed in claim 1, wherein each uncured layer has a length in a x direction, a width in a y direction, and a depth in a z direction; wherein the composite part has a length in the x direction, a width in the y direction, and a depth in the z direction; wherein the x direction is generally perpendicular to the y direction; and wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the lengths of most of the uncured layers are greater than the length of the composite part, and/or wherein the widths of most of the uncured layers are greater than the width of the composite part, and/or wherein the depths of most of the uncured layers are greater than the depth of the composite part. 41. A method for making a composite part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer from step (c), whereby the cured or uncured upper layer from step (c) becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) curing the lower layer resulting from step (d) if the lower layer is uncured to yield a cured lower layer; (f) after step (e) curing the uncured upper layer using an electron beam; and (g) repeating steps (d) through (f) a number of times to form a desired number of cured layers; wherein the uncured upper layer in step (c) has a first length in an x direction, a first width in a y direction, and a first depth in a z direction, and wherein the uncured upper layer in step (c) further comprises fibers in the resin generally in the z direction; wherein the uncured upper layer in step (g) has a second length in the x direction, a second width in the y direction, and a second depth in the z direction, and wherein the uncured upper layer in step (f) further comprises fibers in the resin generally in the z direction; wherein the uncured lower layer in step (c) has a third length in the x direction, a third width in the y direction, and a third depth in the z direction, and wherein the uncured lower layer in step (c) further comprises fibers in the resin generally in the z direction; wherein step (f) yields a cured upper layer that is bonded to the cured lower layer and that is also connected to the cured lower layer by the fibers in the z direction; wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the x direction is generally perpendicular to the y direction. 42. A method for making a composite part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) curing the uncured upper layer using an electron beam; (c) after step (b), providing a new uncured upper layer on the cured upper layer from step (b), whereby the cured upper layer from step (b) becomes a cured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (d) after step (c) curing the uncured upper layer using an electron beam; and (e) repeating steps (c) through (d) a number of times to form a desired number of cured layers; wherein the uncured upper layer in step (b) has a first length in an x direction, a first width in a y direction, and a first depth in a z direction, and wherein the uncured upper layer in step (b) further comprises fibers in the resin generally in the z direction; and wherein the uncured upper layer in step (d) has a second length in the x direction, a second width in the y direction, and a second depth in the z direction, and wherein the uncured upper layer in step (d) further comprises fibers in the resin generally in the z direction; wherein step (d) yields a cured upper layer that is bonded to the cured lower layer and that is also connected to the cured lower layer by the fibers in the z direction; wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the x direction is generally perpendicular to the y direction. 43. A method for making a composite part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer from step (c), whereby the cured or uncured upper layer from step (c) becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) curing the lower layer resulting from step (d) if the lower layer is uncured to yield a cured lower layer; (f) after step (e), providing a new uncured upper layer on the uncured upper layer provided in step (d), whereby the uncured upper layer provided in step (d) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (g) after step (f) curing the uncured upper layer and/or the uncured lower layer(s) after step (f) using an electron beam; and (h) repeating steps (d) through (g) a number of times to form a desired number of cured layers; wherein the uncured upper layer in step (c) has a first length in an x direction, a first width in a y direction, and a first depth in a z direction, and wherein the uncured upper layer in step (c) further comprises fibers in the resin generally in the z direction; and wherein the uncured upper layer in step (g) has a second length in the x direction, a second width in the y direction, and a second depth in the z direction, and wherein the uncured upper layer in step (g) optionally further comprises fibers in the resin generally in the z direction; wherein the uncured lower layer in step (c) has a third length in the x direction, a third width in the y direction, and a third depth in the z direction, and wherein the uncured lower layer in step (c) further comprises fibers in the resin generally in the z direction; and wherein the uncured lower layer in step (g) has a fourth length in the x direction, a fourth width in the y direction, and a fourth depth in the z direction, and wherein the uncured lower layer in step (g) further comprises fibers in the resin generally in the z-direction; wherein step (g) comprises curing the uncured lower layer resulting from step (f) to yield a cured lower layer that is bonded to a previously cured lower layer and that is also connected to the previously cured lower layer by the fibers in the z direction; wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the x direction is generally perpendicular to the y direction. 44. A method as claimed in claim 41, wherein the x direction and the y direction form an angle of about 70째 to about 110째, wherein the x direction and the z direction form an angle of about 70째 to about 110째, and wherein the y direction and the z direction form an angle of about 70째 to about 110째. 45. A method as claimed in claim 41, wherein the x direction and the y direction form an angle of about 85째 to about 95째, wherein the x direction and the z direction form an angle of about 85째 to about 95째, and wherein the y direction and the z direction form an angle of about 85째 to about 95째. 46. A method as claimed in claim 42, wherein the x direction and the y direction form an angle of about 70째 to about 110째, wherein the x direction and the z direction form an angle of about 70째 to about 110째, and wherein the y direction and the z direction form an angle of about 70째 to about 110째. 47. A method as claimed in claim 42, wherein the x direction and the y direction form an angle of about 85째 to about 95째 wherein the x direction and the z direction form an angle of about 85째 to about 95째 and wherein the y direction and the z direction form an angle of about 85째 to about 95째. 48. A method as claimed in claim 43, wherein the x direction and the y direction form an angle of about 70째 to about 110째, wherein the x direction and the z direction form an angle of about 70째 to about 110째, and wherein the y direction and the z direction form an angle of about 70째 to about 110째. 49. A method as claimed in claim 43, wherein the x direction and the y direction form an angle of about 85째 to about 95째, wherein the x direction and the z direction form an angle of about 85째 to about 95째, and wherein the y direction and the z direction form an angle of about 85째 to about 95째. 50. A method for making a composite part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises. fibers, particles, powder, and/or electronic devices; (b) providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer, whereby the cured or uncured upper layer becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) curing the lower layer resulting from step (d) if the lower layer is uncured to yield a cured lower layer; (f) after step (e), providing a new uncured upper layer on the uncured upper layer provided in step (d), whereby the uncured upper layer provided in step (d) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (g) after step (f) curing the uncured upper layer and/or the uncured lower layer(s) after step (f) using an electron beam; and (h) repeating steps (d) through (g) a number of times to form a desired number of cured layers; wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) comprises electronic devices. 51. A method as claimed in claim 1, wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) comprises electronic devices. 52. A method as-claimed in claim 41, wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) comprises electronic devices. 53. A method as claimed in claim 42, wherein at least the uncured upper layer in step (a) or the new uncured upper layer in step (c) comprises electronic devices. 54. A method as claimed in claim 43, wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) comprises electronic devices. 55. A method for making a composite part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer from step (c), whereby the cured or uncured upper layer from step (c) becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) curing the lower layer resulting from step (d) if the lower layer is uncured to yield a cured lower layer; (f) after step (e), providing a new uncured upper layer on the uncured upper layer provided in step (d), whereby the uncured upper layer provided in step (d) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (g) after step (f) curing the uncured upper layer and/or the uncured lower layer(s) after step (f) using an electron beam; and (h) repeating steps (d) through (g) a number of times to form a desired number of cured layers; wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) is nonmetallic. 56. A method as claimed in claim 55, wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) does not comprise metallic foil. 57. A method as claimed in claim 55, wherein the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), and the new uncured upper layer in step (f) are nonmetallic. 58. A method as claimed in claim 55, wherein the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), and the new uncured upper layer in step (f) do not comprise metallic foil. 59. A method as claimed in claim 41, wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) is nonmetallic. 60. A method as claimed in claim 42, wherein at least the uncured upper layer in step (a) or the new uncured upper layer in step (c) is nonmetallic. 61. A method as claimed in claim 43, wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) is nonmetallic. 62. A method as claimed in claim 50, wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) is nonmetallic. 63. A method as claimed in claim 1, wherein each uncured layer has a length in a x direction, a width in a y direction, and a depth in a z direction; wherein the composite part has a length in the x direction, a width in the y direction, and a depth in the z direction; wherein the x direction is generally perpendicular to the y direction; and wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the length of one or more of the uncured layers is at least about 1 cm. greater than the length of the composite part and/or wherein the width of one or more of the uncured layers is at least about 1 cm. greater than the width of the composite part, and/or wherein the depth of one or more of the uncured layers is at least about 1 cm. greater than the depth of the composite part. 64. A method as claimed in claim 1, wherein each uncured layer has a length in a x direction, a width in a y direction, and a depth in a z direction; wherein the composite part has a length in the x direction, a width in the y direction, and a depth in the z direction; wherein the x direction is generally perpendicular to the y direction; and wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the lengths of most of the uncured layers are at least about 1 cm. greater than the length of the composite part, and/or wherein the widths of most of the uncured layers are at least about 1 cm. greater than the width of the composite part, and/or wherein the depths of most of the uncured layers are at least about 1 cm. greater than the depth of the composite part. 65. A method as claimed in claim 1 wherein each uncured layer has a length in a x direction, a width in a y direction, and a depth in a z direction; wherein the composite part has a length in the x direction, a width in the y direction, and a depth in the z direction; wherein the x direction is generally perpendicular to the y direction; and wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the length of one or more of the uncured layers is at least about 5 cm. greater than the length of the composite part, and/or wherein the width of one or more of the uncured layers is at least about 5 cm. greater than the width of the composite part, and/or wherein the depth of one or more of the uncured layers is at least about 5 cm. greater than the depth of the composite part. 66. A method as claimed in claim 1, wherein each uncured layer has a length in a x direction, a width in a y direction, and a depth in a z direction; wherein the composite part has a length in the x direction, a width in the y direction, and a depth in the z direction; wherein the x direction is generally perpendicular to the y direction; and wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the lengths of most of the uncured layers are at least about 5 cm. greater than the length of the composite part, and/or wherein the widths of most of the uncured layers are at least about 5 cm. greater than the width of the composite part, and/or wherein the depths of most of the uncured layers are at least about 5 cm. greater than the depth of the composite part. 67. A method as claimed in claim 1, wherein each uncured layer has a length in a x direction, a width in a y direction, and a depth in a z direction; wherein the composite part has a length in the x direction, a width in the y direction, and a depth in the z direction; wherein the x direction is generally perpendicular to the y direction; and wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the length of one or more of the uncured layers is at least about 10 cm. greater than the length of the composite part, and/or wherein the width of one or more of the uncured layers is at least about 10 cm. greater than the width of the composite part, and/or wherein the depth of one or more of the uncured layers is at least about 10 cm. greater than the depth of the composite part. 68. A method as claimed in claim 1, wherein each uncured layer has a length in a x direction, a width in a y direction, and a depth in a z direction; wherein the composite part has a length in the x direction, a width in the y direction, and a depth in the z direction; wherein the x direction is generally perpendicular to the y direction; and wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the lengths of most of the uncured layers are at least about 10 cm. greater than the length of the composite part, and/or wherein the widths of most of the uncured layers are at least about 10 cm. greater than the width of the composite part, and/or wherein the depths of most of the uncured layers are at least about 10 cm. greater than the depth of the composite part. 69. A method as claimed in claim 1, wherein each uncured layer has a length in a x direction, a width in a y direction, and a depth in a z direction; wherein the composite part has a length in the x direction, a width in the y direction, and a depth in the z direction; wherein the x direction is generally perpendicular to the y direction; and wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the length of one or more of the uncured layers is at least about 25 cm. greater than the length of the composite part, and/or wherein the width of one or more of the uncured layers is at least about 25 cm. greater than the width of the composite part, and/or wherein the depth of one or more of the uncured layers is at least about 25 cm. greater than the depth of the composite part. 70. A method as claimed in claim 1, wherein each uncured layer has a length in a x direction, a width in a y direction, and a depth in a z direction; wherein the composite part has a length in the x direction, a width in the y direction, and a depth in the z direction; wherein the x direction is generally perpendicular to the y direction; and wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the lengths of most of the uncured layers are at least about 25 cm. greater than the length of the composite part, and/or wherein the widths of most of the uncured layers are at least about 25 cm. greater than the width of the composite part, and/or wherein the depths of most of the uncured layers are at least about 25 cm. greater than the depth of the composite part.
Janke Christopher J. ; Lopata Vincent J.,CAX ; Havens Stephen J. ; Dorsey George F. ; Moulton Richard J., High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators.
Lin, Pui-Yan; Rajendran, Govindasamy Paramasivan; Zahr, George Elias, Low loss dielectric material for printed circuit boards and integrated circuit chip packaging.
Juskey Frank J. (Coral Springs FL) Suppelsa Anthony B. (Coral Springs FL) Dorinski Dale W. (Coral Springs FL), Method of forming a three-dimensional printed circuit assembly.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.