Piezoelectric bimorph actuator and method of manufacturing thereof
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-041/053
H01L-041/00
출원번호
US-0262004
(2005-10-28)
등록번호
US-7259499
(2007-08-21)
발명자
/ 주소
Askew,Andy R.
Lyon,Gregory S.
출원인 / 주소
Askew,Andy R.
Lyon,Gregory S.
대리인 / 주소
Carter, DeLuca, Farrell & Schmidt, LLP
인용정보
피인용 횟수 :
3인용 특허 :
148
초록▼
An actuator is disclosed, which includes a piezoelectric bimorph. The actuator also includes a substantially moisture impervious and electrically insulating packaging having a cavity around the bimorph providing for a clearance around the bimorph. The packaging includes a carrier having first and se
An actuator is disclosed, which includes a piezoelectric bimorph. The actuator also includes a substantially moisture impervious and electrically insulating packaging having a cavity around the bimorph providing for a clearance around the bimorph. The packaging includes a carrier having first and second surfaces and an aperture wherein the bimorph is disposed, the packaging further includes first and second cover films selectively attached to the first and second surfaces respectively, and at least one flex circuit connected to the bimorph for supplying electrical energy thereto.
대표청구항▼
What is claimed is: 1. An actuator comprising: a piezoelectric bimorph; a substantially moisture impervious and electrically insulating packaging comprising a cavity around the bimorph providing for a clearance around the bimorph, the packaging comprising a carrier having first and second surfaces
What is claimed is: 1. An actuator comprising: a piezoelectric bimorph; a substantially moisture impervious and electrically insulating packaging comprising a cavity around the bimorph providing for a clearance around the bimorph, the packaging comprising a carrier having first and second surfaces and an aperture wherein the bimorph is disposed, the packaging further comprising first and second cover films selectively attached to the first and second surfaces respectively such that the bimorph is independent of the first and second cover films, wherein at least one of the first and second cover films is actuated upon activation of the bimorph; and at least one flex circuit connected to the bimorph for supplying electrical energy thereto. 2. An actuator as in claim 1, wherein first and second adhesive films selectively attach the first and second cover films to the first and second surfaces respectively. 3. An actuator as in claim 2, wherein the first and second adhesive films are formed from a thermal active adhesive. 4. An actuator as in claim 1, wherein at least one attachment mechanism attaches the first and second cover films to the first and second surfaces respectively. 5. An actuator as in claim 1, wherein the piezoelectric bimorph is formed from a material selected from the group of lead zirconate titanate, quartz, and barium titanate. 6. An actuator as in claim 1, wherein the carrier and the first and second cover films are formed from a polymer. 7. An actuator as in claim 6, wherein the polymer is polymide laminate. 8. An actuator as in claim 6, wherein the polymer is polyester. 9. A transducer comprising: a housing; and an actuator disposed within the housing, the actuator comprising: a piezoelectric bimorph; a substantially moisture impervious and electrically insulating packaging comprising a cavity around the bimorph providing for a clearance around the bimorph, the packaging comprising a carrier having first and second surfaces and an aperture wherein the bimorph is disposed, the packaging further comprising first and second cover films selectively attached to the first and second surfaces respectively such that the bimorph is independent of the first and second cover films, wherein at least one of the first and second cover films is actuated upon activation of the bimorph; and at least one flex circuit connected to the bimorph for supplying electrical energy thereto. 10. A transducer as in claim 9, wherein first and second adhesive films selectively attach the first and second cover films to the first and second surfaces respectively. 11. A transducer as in claim 10, wherein the first and second adhesive films are formed from a thermal active adhesive. 12. A transducer as in claim 9, wherein at least one attachment mechanism attaches the first and second cover films to the first and second surfaces respectively. 13. A transducer as in claim 9, wherein the piezoelectric bimorph is formed from a material selected from the group of lead zirconate titanate, quartz, and barium titanate. 14. A transducer as in claim 9, wherein the carrier and the first and second cover films are formed from a polymer. 15. A transducer as in claim 14, wherein the polymer is polymide laminate. 16. A transducer as in claim 14, wherein the polymer is polyester. 17. A transducer as in claim 9, wherein the packaging includes at least one hole for attachment to the housing. 18. A method for manufacturing an actuator: assembling a substantially moisture impervious and electrically insulating packaging comprising a carrier having first and second surfaces and an aperture, selectively attaching a first cover film to the first surface; inserting a piezoelectric bimorph within the packaging; connecting at least one flex circuit to the bimorph for supplying electrical energy thereto; and selectively attaching a second cover film to the second surface to form a cavity around the bimorph providing for a clearance around the bimorph such that the bimorph is independent of the first and second cover films, wherein at least one of the first and second cover films is actuated upon activation of the bimorph. 19. A method as in claim 18, wherein first and second adhesive films selectively attach the first and second cover films to the first and second surfaces respectively. 20. A method as in claim 19, wherein the first and second adhesive films are formed from a thermal active adhesive. 21. A method as in claim 18, wherein at least one attachment mechanism attaches the first and second cover films to the first and second surfaces respectively. 22. A method as in claim 18, wherein the piezoelectric bimorph is formed from a material selected from the group of lead zirconate titanate, quartz, and barium titanate. 23. A method as in claim 18, wherein the carrier and the first and second cover films are formed from a polymer. 24. A method as in claim 23, wherein the polymer is polymide laminate. 25. A method as in claim 23, wherein the polymer is polyester.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (148)
Velamoor Sesh (Mercer Island WA) Mesterton Kai P. (Monroe WA), Acoustic transducer for level measurement in corrosive chemical environments.
Borchers, Ingo; Hartweg, Martin; Michel, Josef; Roitzheim, Rolf-Dirc; Tomaschko, Silvia; Wang, Ping; Schnur, Jürgen, Component having vibration-damping properties, mixture for manufacturing the component, and method of manufacturing such a component.
Olness Dolores U. (Livermore CA) Hirschfeld ; deceased Tomas B. (late of Livermore CA by Judith Hirschfeld ; Administratrix), Elastomer degradation sensor using a piezoelectric material.
Panasik, Carl M., Encapsulated packaging for thin-film resonators and thin-film resonator-based filters having a piezoelectric resonator between two acoustic reflectors.
Duerrstein Rolf,DEX ; von Esebeck Goetz Frhr.,DEX ; Ostertag Robert,DEX ; Reif Rene,DEX ; Weindorf Martin,DEX, Filter system for the lubricant of an internal combustion engine.
Winzer Stephen R. (Ellicott City MD) Caldwell Paul J. (Baltimore MD) Shankar Natarajan (Columbia MD) Shah Tushar K. (Sykesville MD) Bridger Keith (Washington DC) Ritter Andrew P. (Surf Side Beach SC), Integrated composite acoustic transducer array.
Jaster Heinz (Schenectady NY) Frey Gregg W. (East Wenatchee WA), Method and apparatus for dissipating heat from a transducer element array of an ultrasound probe.
Massa Frank (Hingham MA) Massa Donald P. (Hingham MA), Method of making an underwater electroacoustic transducer with long-lasting high leakage resistance.
Anderson Michael John (Phoenix AZ) Johnson Gary Carl (Tempe AZ) Popovich Mark Phillip (Gilbert AZ) Christensen Jeffrey Eames (Scottsdale IL), Microelectronic device package and method.
Henschel Mark E. (Phoenix AZ) Milla Juan G. (Mesa AZ) Consoer Kelly J. (Chandler AZ) Sikorski James M. (Moundsview MN) Larson Larry R. (Chandler AZ), Packaged integrated accelerometer.
Lazarus Kenneth B. (Boston MA) Lundstrom Mark E. (Cambridge MA) Moore Jeffrey W. (Concord MA) Crawley Edward F. (Cambridge MA), Packaged strain actuator.
Lazarus Kenneth B. (Boston MA) Lundstrom Mark E. (Cambridge MA) Moore Jeffrey W. (Concord MA) Crawley Edward F. (Cambridge MA), Packaged strain actuator.
Sakai Yoshimi,JPX ; Kooriike Takumi,JPX, Piezoelectric element package in which a piezoelectric element on a chip carrier is reliably shielded by using a cap.
Futakuchi Tomoaki,JPX ; Sawai Kunio,JPX ; Hino Taketoshi,JPX, Piezoelectric filter having a capacitance electrode extending onto a substrate side surface.
Miyagawa Takashi,JPX ; Yachi Masanori,JPX, Resonator device adapted for suppression of fluctuation in resonant resistance, and method of producing same.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.