IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0115559
(2005-04-27)
|
등록번호 |
US-7262964
(2007-08-28)
|
발명자
/ 주소 |
|
출원인 / 주소 |
- Hewlett Packard Development Company, L.P.
|
인용정보 |
피인용 횟수 :
17 인용 특허 :
34 |
초록
▼
An apparatus includes a printed circuit board having a first space, a member movably coupled to the printed circuit board and a baffle carried by the member. The baffle is configured to move to an extended position, which is maintained in the absence of a component in the space, to a retracted posit
An apparatus includes a printed circuit board having a first space, a member movably coupled to the printed circuit board and a baffle carried by the member. The baffle is configured to move to an extended position, which is maintained in the absence of a component in the space, to a retracted position in response to engaging a component in the space.
대표청구항
▼
What is claimed is: 1. An apparatus comprising: a printed circuit board having a first space; a member configured to be coupled to the printed circuit board; and a first baffle carried by the member, wherein the baffle is configured to move from an extended position, which is maintained in the abse
What is claimed is: 1. An apparatus comprising: a printed circuit board having a first space; a member configured to be coupled to the printed circuit board; and a first baffle carried by the member, wherein the baffle is configured to move from an extended position, which is maintained in the absence of a component in the first space, to a retracted position in response to engaging a component in the first space. 2. The apparatus of claim 1, wherein the member is pivotally coupled to the printed circuit board. 3. The apparatus of claim 2, wherein the first baffle is pivotally coupled to the member. 4. The apparatus of claim 1, wherein the first baffle is pivotally coupled to the member. 5. The apparatus of claim 1, wherein the first baffle is slidably coupled to the member. 6. The apparatus of claim 1, wherein the first baffle includes a plurality of overlapping sections when in the retracted position. 7. The apparatus of claim 1, wherein the first baffle extends substantially perpendicular to the member in the extended position. 8. The apparatus of claim 7, wherein the first baffle extends substantially perpendicular to the member in the retracted position. 9. The apparatus of claim 7, wherein the first baffle extends non-perpendicular to the member when in the retracted position. 10. The apparatus of claim 1, wherein the first baffle is resiliently biased towards the extended position. 11. The apparatus of claim 1 including a spring resiliently biasing the baffle towards the extended position. 12. The apparatus of claim 1, wherein the first baffle extends from the member to the printed circuit board in the extended position. 13. The apparatus of claim 12, wherein the first baffle is spaced less than or equal to 10 mm from the printed circuit board in the extended position. 14. The apparatus of claim 1 including a component in the first space, wherein the component engages the first baffle to retain the baffle in the retracted position. 15. The apparatus of claim 14, wherein the component includes a heat sink. 16. The apparatus of claim 15, wherein the heat sink includes a plurality of fins. 17. The apparatus of claim 1 including a fan configured to create air flow across the printed circuit board. 18. The apparatus of claim 1, wherein the printed circuit board has a second space configured to be connected to a second component. 19. The apparatus of claim 18 including a second baffle carried by the member, wherein the second baffle is configured to move from an extended position, which is maintained in the absence of a component in the second space, to a retracted position in response to engaging a component in the second space. 20. The apparatus of claim 1 including a component in the first space, wherein the component includes a heat sink and a heat generating element between the heat sink and the printed circuit board. 21. The apparatus of claim 20, wherein the member clamps the heat sink towards the heat generating element. 22. The apparatus of claim 21, wherein the heat generating element comprises a processor. 23. The apparatus of claim 21 including at least one frame coupled to the printed circuit board, wherein the member has a first portion pivotally coupled to the at least one frame and a second portion secured to the at least one frame. 24. The apparatus of claim 1, wherein the first baffle includes a first portion mounted to the member and a second portion integrally formed as a single unitary body with the first portion and pivotable relative to the first portion between the extended position and the retracted position. 25. The apparatus of claim 24, wherein the first portion and the second portion are at least partially formed from a resilient material. 26. The apparatus of claim 25, wherein the material is polymeric. 27. The apparatus of claim 1, wherein the member pivots about a first axis relative to the printed circuit board and wherein the first baffle pivots about a second axis relative to the printed circuit board. 28. The apparatus of claim 27, wherein the first axis and the second axis are parallel. 29. The apparatus of claim 1, wherein the first baffle includes a compressible cellular material. 30. A processing unit clamp system for use with a frame coupled to a printed circuit board that is connected to a processor unit having a processor and a heat sink, the system comprising: a member having a first portion configured to be pivotally coupled to the at least one frame so as to be pivoted to apply force to the processor unit; and a baffle carried by the member, the baffle being configured to move from an extended position, which is maintained in the absence of the processor unit connected to the printed circuit board, to a retracted position in response to engaging the processor unit connected to the printed circuit board. 31. An apparatus comprising: a printed circuit board having a space configured to receive a component; a member movably coupled to the printed circuit board; and means carried by the member for blocking air flow across the space in absence of a component in the space and for automatically retracting from the space in response to engaging a component in the space. 32. The apparatus of claim 31, wherein the member includes means for urging a component in the space towards the printed circuit board. 33. A method comprising: moving a baffle towards a space along a printed circuit board; and engaging the baffle against a component in the space to retract the baffle away from the printed circuit board. 34. The apparatus of claim 33, wherein moving the baffle includes pivoting the baffle about a first axis. 35. The method of claim 34, wherein retracting the baffle includes pivoting the baffle about a second distinct axis. 36. The method of claim 33, wherein retracting the baffle includes sliding the baffle. 37. The method of claim 33, wherein retracting the baffle includes folding the baffle. 38. The method of claim 33, wherein retracting the baffle includes pivoting the baffle. 39. The method of claim 33, wherein the baffle is carried by a member and wherein the method further includes applying force to the component by moving the member towards the printed circuit board.
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