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Systems and methods for cooling a component within a housing adapted for subsurface disposal using a vortex tube. The housing contains a first pressure chamber; a vortex tube coupled to the first pressure chamber; a cooling chamber coupled to the vortex tube; and a second pressure chambercoupled to

Systems and methods for cooling a component within a housing adapted for subsurface disposal using a vortex tube. The housing contains a first pressure chamber; a vortex tube coupled to the first pressure chamber; a cooling chamber coupled to the vortex tube; and a second pressure chambercoupled to the cooling chamber; wherein the pressure chambers are adapted to stimulate a cool fluid flow from the vortex tube into the cooling chamber. A cooling method entails disposing the component to be cooled within the cooling chamber and adapting the system pressure chambers to stimulate a cool fluid flow from a vortex tube into the cooling chamber.

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What is claimed is: 1. A vortex tube cooling system, comprising: a housing adapted for subsurface disposal, the housing containing: a first gas storage chamber; a vortex tube coupled to the first gas storage chamber; a cooling chamber coupled to the vortex tube; and a second gas storage chamber cou

What is claimed is: 1. A vortex tube cooling system, comprising: a housing adapted for subsurface disposal, the housing containing: a first gas storage chamber; a vortex tube coupled to the first gas storage chamber; a cooling chamber coupled to the vortex tube; and a second gas storage chamber coupled to the cooling chamber; wherein the first and second gas storage chambers are adapted to stimulate a cool fluid flow from the vortex tube into the cooling chamber; wherein the cool fluid flow is retained within the housing. 2. The system of claim 1, wherein the first gas storage chamber is adapted for pressurization and the second gas storage chamber is adapted for evacuation. 3. The system of claim 1, the housing further comprising a third gas storage chamber coupled between the first gas storage chamber and the vortex tube, the third chamber adapted to sustain a predetermined fluid pressure for input to the vortex tube. 4. The system of claim 1, the housing further comprising a heat exchanger coupled between the second gas storage chamber and the vortex tube, the heat exchanger adapted to receive hot fluid flow from the vortex tube. 5. The system of claim 1, the housing further comprising a compressor adapted to pump a fluid from the second gas storage chamber into the first gas storage chamber. 6. The system of claim 5, the housing further comprising: a third gas storage chamber coupled between the cooling chamber and the second gas storage chamber; and a second compressor adapted to pump a fluid from the third gas storage chamber into the second gas storage chamber. 7. The system of claim 1, wherein the cooling chamber is double walled and adapted to allow fluid flow from the vortex tube through a space between the walls of the cooling chamber. 8. The system of claim 1, wherein the housing is adapted for disposal within a borehole traversing a subsurface formation while drilling the borehole. 9. The system of claim 1, wherein the housing is adapted for disposal within a borehole traversing a subsurface formation via a wireline cable. 10. The system of claim 1, further comprising a plurality of valves linked between the first gas storage chamber, the second gas storage chamber, and the cooling chamber to regulate fluid flow through the chambers. 11. The system of claim 1, wherein the cooling chamber is adapted to house an electronic component. 12. The system of claim 1, wherein the exterior of at least one of the first gas storage chamber, second gas storage chamber, and the cooling chamber is covered by an insulating material. 13. The system of claim 1, wherein at least one of the first gas storage chamber, second gas storage chamber, and the cooling chamber is disposed within a Dewar flask. 14. A method for cooling a component within a housing adapted for subsurface disposal, comprising: a) equipping the housing with: a first gas storage chamber; a vortex tube coupled to the first gas storage chamber; a cooling chamber coupled to the vortex tube; a second gas storage chamber coupled to the cooling chamber; b) disposing the component to be cooled within the cooling chamber; and c) adapting the gas storage chambers to stimulate a tool fluid flow from the vortex tube into the cooling chamber; d) retaining the cool fluid flow within the housing. 15. The method of claim 14, wherein step (c) comprises pressurizing the first gas storage chamber and evacuating the second gas storage chamber. 16. The method of claim 14, wherein step (c) comprises pumping a fluid from the second gas storage chamber into the first gas storage chamber. 17. The method of claim 14, further comprising equipping the housing with a heat exchanger coupled to the vortex tube to receive hot fluid flow from the vortex tube. 18. The method of claim 14, further comprising equipping the housing with a third gas storage chamber coupled between the cooling chamber and the second gas storage chamber, and pumping a fluid from the third gas storage chamber into the second gas storage chamber. 19. The method of claim 14, wherein the cooling chamber is double walled and adapted to allow fluid flow from the vortex tube through a space between the walls of the cooling chamber. 20. The method of claim 14, further comprising disposing the housing within a borehole traversing a subsurface formation white drilling the borehole. 21. The method of claim 14, further comprising disposing the housing within a borehole traversing a subsurface formation via a wireline cable. 22. The method of claim 14, further comprising equipping the housing with a plurality of valves linked between the first gas storage chamber, the second gas storage chamber, and the cooling chamber to regulate fluid flow through the chambers. 23. The method of claim 14, wherein the component to be cooled is an electronic component. 24. The method of claim 14, wherein at least one of the exterior of the first gas storage chamber, second gas storage chamber, and the cooling chamber is covered by an insulating material. 25. The method of claim 14, wherein a least one of the first gas storage chamber, second gas storage chamber, and the cooling chamber is disposed within a Dewar flask. 26. A vortex tube cooling system, comprising: a housing adapted for subsurface disposal, the housing containing: a first gas storage chamber; a vortex tube coupled to the first gas storage chamber; a cooling chamber coupled to the vortex tube; and a second gas storage chamber coupled to the cooling chamber, wherein the first and second gas storage chambers are adapted to stimulate a cool fluid flow from the vortex tube into the cooling chamber; and a compressor adapted to pump a fluid from the second gas storage chamber into the first gas storage chamber. 27. The system of claim 26, wherein the first gas storage chamber is adapted for pressurization and the second gas storage chamber is adapted for evacuation. 28. The system of claim 26, the housing further comprising a third gas storage chamber coupled between the first gas storage chamber and the vortex tube, the third gas storage chamber adapted to sustain a predetermined fluid pressure for input to the vortex tube. 29. The system of claim 26, the housing further comprising a heat exchanger coupled between the second gas storage chamber and the vortex tube, the heat exchanger adapted to receive hot fluid flow from the vortex tube. 30. The system of claim 26, wherein the cooling chamber is double walled and adapted to allow fluid flow from the vortex tube through a space between the walls of the cooling chamber. 31. The system of claim 26, wherein the housing is adapted for disposal within a borehole traversing a subsurface formation while drilling the borehole. 32. The system of claim 26, further comprising a plurality of valves linked between the first gas storage chamber and the cooling chamber to regulate fluid flow through the chambers. 33. The system of claim 26, wherein the cooling chamber is adapted to house an electronic component. 34. The system of claim 26, wherein the exterior of at least one of the first gas storage chamber, the second gas storage chamber, and the cooling chamber is covered by an insulating material. 35. The system of claim 26, wherein at least one of the first gas storage chamber, the second gas storage chamber, and the cooling chamber is disposed within a Dewar flask. 36. The system of claim 26, the housing further comprising: a third gas storage chamber coupled between the cooling chamber and the second gas storage chamber; and a second compressor adapted to pump a fluid from the third gas storage chamber into the second gas storage chamber.