Apparatus and method of securing a workpiece during high-pressure processing
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B08B-011/02
B08B-011/00
B08B-007/00
출원번호
US-0425701
(2003-04-28)
등록번호
US-7270137
(2007-09-18)
발명자
/ 주소
Yokomizo,Kenji
출원인 / 주소
Tokyo Electron Limited
대리인 / 주소
Haverstock & Owens LLP
인용정보
피인용 횟수 :
2인용 특허 :
190
초록▼
An apparatus is disclosed for performing high-pressure processing of a workpiece having a top face and a bottom face. The apparatus comprises a processing chamber and a holder for securing the workpiece within the processing chamber so that a substantial portion of the top face and a substantial por
An apparatus is disclosed for performing high-pressure processing of a workpiece having a top face and a bottom face. The apparatus comprises a processing chamber and a holder for securing the workpiece within the processing chamber so that a substantial portion of the top face and a substantial portion of the bottom face is exposed to a processing material introduced into the processing chamber. In one embodiment, the holder comprises an upper segment and a lower segment. The lower segment contacts the workpiece at or near an edge of the workpiece, thus supporting the workpiece in a first vertical direction and securing it in a horizontal plane. The upper segment contacts the workpiece at or near an edge of the workpiece, securing it in a second vertical direction.
대표청구항▼
I claim: 1. A processing chamber, comprising: a. a first segment comprising a plurality of support elements having a triangular, wedge-shaped cross section configured to engage a workpiece at a first edge of the workpiece; and b. a second segment, comprising a plurality of support elements having a
I claim: 1. A processing chamber, comprising: a. a first segment comprising a plurality of support elements having a triangular, wedge-shaped cross section configured to engage a workpiece at a first edge of the workpiece; and b. a second segment, comprising a plurality of support elements having a circular recessed configuration shaped to substantially match the contour of an edge of the workpiece and configured to engage the workpiece at a second edge of the workpiece, wherein the first segment and the second segment are positioned to secure a workpiece within the processing chamber so that a substantial portion of a first face of the workpiece and a substantial portion of a second face of the workpiece are exposed to a processing material introduced into the processing chamber. 2. The processing chamber of claim 1, further comprising: c. a top plate, the first segment coupled to the top plate; and d. a bottom plate, the second segment coupled to the bottom plate, wherein when the top plate and the bottom plate are brought together, the first segment and the second segment engage the workpiece, and further wherein the top plate and the bottom plate form a processing volume containing the workpiece. 3. The apparatus of claim 1, further comprising a wafer pick slidably mounted within the processing chamber, wherein in a first position the wafer pick is configured to support the workpiece so that the workpiece is disengaged from the second segment, and in a second position the wafer pick is disengaged from the workpiece, the workpiece engaged with the second segment. 4. The apparatus of claim 3, wherein the bottom plate is configured to receive the wafer pick, such that when the wafer pick is in the second position, the bottom plate and the wafer pick form a hermetically-sealed surface. 5. The processing chamber of claim 2, wherein the first segment and the second segment are configured so that when the top plate and the bottom plate are brought together, a volume between the workpiece and the top plate is substantially equal to a volume between the workpiece and the bottom plate. 6. The processing chamber of claim 2, further comprising: e. an inlet system configured to introduce a processing material into the processing volume; and f. an outlet system configured to exhaust the processing material from the processing volume. 7. The processing chamber of claim 6, wherein the inlet system includes inlet ports arranged substantially parallel to the first face and the second face of the workpiece. 8. The processing chamber of claim 6, wherein the inlet system comprises a plurality of inlet ports arranged annularly around a circumference of the processing chamber and the outlet system comprises a plurality of outlet ports arranged annularly around the circumference of the processing chamber. 9. The processing chamber of claim 8, wherein the plurality of inlet ports are arranged at an angle perpendicular to the circumference of the processing chamber. 10. The processing chamber of claim 8, wherein the plurality of inlet ports are arranged at angles not perpendicular to the circumference of the processing chamber. 11. The processing chamber of claim 8, wherein the plurality of outlet ports are arranged at an angle perpendicular to the circumference of the processing chamber. 12. The processing chamber of claim 8, wherein the plurality of outlet ports are arranged at angles not perpendicular to the circumference of the processing chamber. 13. The processing chamber of claim 8, wherein the plurality of inlet ports are positioned substantially opposite the plurality of output ports so that when the processing material is exhausted from the processing volume, the processing material is drawn across the first face and the second face of the workpiece. 14. The processing chamber of claim 8, wherein the plurality of inlet ports alternate with the plurality of outlet ports along the circumference of the processing chamber. 15. The processing chamber of claim 2, further comprising a supercritical condition generator coupled to the processing volume wherein the supercritical condition generator comprises a pump and a heater. 16. The processing chamber of claim 2, further comprising a first heater coupled to the top plate. 17. The processing chamber of claim 16, further comprising a second heater coupled to the bottom plate. 18. The processing chamber of claim 2, wherein the top plate comprises a dispenser ring coupled to the processing volume. 19. The processing chamber of claim 18, wherein the bottom plate comprises a collector ring coupled to the processing volume. 20. The processing chamber of claim 19, wherein the collector ring is coupled to the processing volume by a plurality of channels arranged at an angle perpendicular to a circumference of the processing chamber. 21. The processing chamber of claim 19, wherein the collector ring is coupled to the processing volume by a plurality of channels arranged at angles not perpendicular to a circumference of the processing chamber. 22. The processing chamber of claim 18, wherein the dispenser ring is coupled to the processing volume by a plurality of channels arranged at an angle perpendicular to a circumference of the processing chamber. 23. The processing chamber of claim 18, wherein the dispenser ring is coupled to the processing volume by a plurality of channels arranged at angles not perpendicular to a circumference of the processing chamber.
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