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특허 상세정보

Apparatus and method of securing a workpiece during high-pressure processing

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B08B-011/02    B08B-011/00    B08B-007/00   
미국특허분류(USC) 134/186; 134/200; 134/902
출원번호 US-0425701 (2003-04-28)
등록번호 US-7270137 (2007-09-18)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Haverstock & Owens LLP
인용정보 피인용 횟수 : 2  인용 특허 : 190
초록

An apparatus is disclosed for performing high-pressure processing of a workpiece having a top face and a bottom face. The apparatus comprises a processing chamber and a holder for securing the workpiece within the processing chamber so that a substantial portion of the top face and a substantial portion of the bottom face is exposed to a processing material introduced into the processing chamber. In one embodiment, the holder comprises an upper segment and a lower segment. The lower segment contacts the workpiece at or near an edge of the workpiece, thus...

대표
청구항

I claim: 1. A processing chamber, comprising: a. a first segment comprising a plurality of support elements having a triangular, wedge-shaped cross section configured to engage a workpiece at a first edge of the workpiece; and b. a second segment, comprising a plurality of support elements having a circular recessed configuration shaped to substantially match the contour of an edge of the workpiece and configured to engage the workpiece at a second edge of the workpiece, wherein the first segment and the second segment are positioned to secure a workpie...

이 특허에 인용된 특허 (190)

  1. Wilden, James K.; Tuck, Alan D.. Actuator valve. USP1985104549467.
  2. Wilden James K. (11727 Pendleton Yucaipa CA 92399). Air driven double diaphragm pump. USP1992125169296.
  3. Nozari Farhad. Aircraft hydraulic pump control system. USP1999025865602.
  4. Yoo, Jae Yoo; Lee, Jae Chun; Hwang, Min Kyu; Lee, Chel Woong. Apparatus and method for controlling a compressor. USP2003096616414.
  5. Yoo, Jae Yoo; Lee, Chel Woong; Sung, Ji Won; Lee, Hyuk. Apparatus and method for controlling operation of compressor. USP2004116815922.
  6. Shore Stephen H. ; Rosio Larry R.. Apparatus and method for controlling the use of carbon dioxide in dry cleaning clothes. USP1999105970554.
  7. Bettcher Dean ; Kubinski Christopher. Apparatus and method for drying solid articles. USP2000106128830.
  8. McCullough, Kenneth J.; Moreau, Wayne M.; Simons, John P.; Taft, Charles J.; Cotte, John M.. Apparatus and method for increasing throughput in fluid processing. USP2003056561220.
  9. Gessner Adolf W. (Silver Spring MD). Apparatus and method for reducing solvent vapor losses. USP1991014983223.
  10. Castrucci, Paul. Apparatus and method for semiconductor wafer test yield enhancement. USP2003026521466.
  11. Wirth, Paul Z.; Peace, Steven L.; Lund, Erik. Apparatus and methods for processing a workpiece. USP2003046548411.
  12. Wirth, Paul Z.; Peace, Steven L.; Lund, Erik. Apparatus and methods for processing a workpiece. USP2004106806194.
  13. Mita Katsuhisa,JPX ; Matsuoka Yasuo,JPX ; Taniyama Kenichi,JPX ; Takano Michirou,JPX ; Akasaki Tsuneo,JPX ; Kanda Kaoru,JPX. Apparatus for baking photoresist applied on substrate. USP1998105817178.
  14. Basso James E. (Hopewell Junction NY) Bhalla Parmesh K. (Pleasant Valley NY) Chahine John J. (Poughkeepsie NY) Diddell Daro (San Diego CA) Earle Gregory J. (Wallkill NY) Gabriel Edward P. (Newburgh N. Apparatus for cleaning and drying workpieces. USP1992095143103.
  15. Gopinath, Sanjay; Van Cleemput, Patrick A.; Juarez, Francisco; Shrinivasan, Krishnan. Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing. USP2003046550484.
  16. Gruenwald Heinrich (Gomaringen DEX) Ramisch Hans (Frankfurt DEX) Pawlakowitsch Anton (Alzenau DEX). Apparatus for plasma etching. USP1991045009738.
  17. Hazano Shigeki (Yokohama CA JPX) Shibagaki Masahiro (San Jose CA) Jyo Hidetaka (Sagamihara JPX) Sensui Reiichiro (Sagamihara JPX) Iwami Munenori (Yokohama JPX) Suzuki Noboru (Chigasaki JPX). Apparatus for producing semiconductor devices. USP1987094693777.
  18. Eui-Yeol Oh,KRX. Apparatus for producing semiconductors and other devices and cleaning apparatus. USP2000036035871.
  19. Ikeda Masahide,JPX ; Ohtani Masami,JPX. Apparatus for substrate holding. USP1999115989342.
  20. Gallego JosM. (Ormskirk GB2). Apparatus for the deposition of multi-layer coatings. USP1986064592306.
  21. Uehara Akira (Yokohama JPX) Kiyota Hiroyuki (Hiratsuka JPX) Nakane Hisashi (Kawasaki JPX) Toda Shozo (Fujisawa JPX). Apparatus for treatment with gas plasma. USP1981014245154.
  22. Habuka Hitoshi (Gunma-ken JPX). Apparatus for vapor-phase epitaxial growth. USP1997095672204.
  23. Biggerstaff Rex L. (Lubbock TX) Skinner Charles W. (Lubbock TX) Syverson Daniel J. (Robbinsdale MN) Jenson Mark L. (Princeton MN) Kegley James G. (St. Paul MN). Apparatus for wafer processing with in situ rinse. USP1992125169408.
  24. Smick Theodore H. ; Andrews Robert S. ; Cordts ; III Bernhard F.. Arc inhibiting wafer holder assembly. USP2000126155436.
  25. Annapragada Rao Venkateswara. Autoclave with improved heating and access. USP2000046048494.
  26. Schumack Russell (Shenandoah PA). Automatic control system for diaphragm pumps. USP1993105252041.
  27. Dong Qimin ; Young Jack. Bearing system including lubricant circulation and cooling apparatus. USP2001076264003.
  28. Schuetz Guenter (Cologne DEX) Stueber Hans-Guenter (Cologne DEX) Kinzig Volker (Gelnhausen DEX). Bearings for use in negative-pressure environments. USP1991075028219.
  29. Brenes Arthur. Bellows driver slot valve. USP1999115975492.
  30. Preston A. Duane ; Turner Jon R.. Carbon dioxide dry cleaning system. USP1999055904737.
  31. Preston, A. Duane; Turner, Jon R.; Svoboda, Charles. Carbon dioxide dry cleaning system. USP2005026851148.
  32. Shirai Hidenobu,JPX. Chamber apparatus for processing semiconductor devices. USP2001026186722.
  33. Nitta, Takahisa; Miki, Nobuhiro; Yamaguchi, Yoshiaki. Chemical supply system. USP2004076764212.
  34. Zucchini ; Guido. Circuit for the recovery of solvent vapor evolved in the course of a cleaning cycle in dry-cleaning machines or plants,. USP1978054091643.
  35. Kamikawa Yuji,JPX. Cleaning and drying apparatus for objects to be processed. USP2000126164297.
  36. Adler Robert,ATX. Cleaning of workpieces having organic residues. USP1999115980648.
  37. Blaudszun Bernd (Hamburg DEX). Cleaning or stripping of coated objects. USP1984104474199.
  38. Timothy L. Racette ; Gene R. Damaso ; James E. Schulte. Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent. USP2002036355072.
  39. Noe Renato R. (Union City NJ). Closure apparatus for a high pressure vessel. USP1988124789077.
  40. Platts Douglas J. (Worksop GB2). Closure for pipes or pressure vessels and a seal therefor. USP1983124422651.
  41. Bernhard F. Cordts, III ; Julian G. Blake. Coated wafer holding pin. USP2002086433342.
  42. Siefering Kevin L. ; Hamre Scott W. ; Foline Michael J.. Combined process chamber with multi-positionable pedestal. USP2001046221781.
  43. Wytman Joseph. Compliant wafer chuck. USP2001066241825.
  44. Budde Dirk (Donatusstrasse 37 4052 Korschenbroich 1 DEX). Compressed air driven double diaphragm pump. USP1983094406596.
  45. Kishimoto Akio,JPX ; Ueda Kenji,JPX ; Yoshida Zenichi,JPX. Compressor for use in refrigerator. USP2000016010315.
  46. Novakovi Mili (KOD(c/o) Mrs. Mare Vucak ; UL.Trg Pobede Broj 16 11080 Zemun YUX). Control valve. USP1993065217043.
  47. Berger, Terry A.; Fogelman, Kimber D.; Staats, III, L. Thompson; Nickerson, Mark; Bente, III, Paul F.. Converting a pump for use in supercritical fluid chromatography. USP2003056561767.
  48. Lyman George F. (Rocky Point ME). Culture media transfer assembly. USP1986124626509.
  49. Fowler David E. (Gainesville FL) Witt Charles R. (Crystal River FL). Decontamination apparatus for chemically and/or radioactively contaminated tools and equipment. USP1989094865061.
  50. Wanger Freddy (Oberrohrdorf) Refer Marcel (Mohnthal) Schneckenburger Rainer (Stein CHX). Device for the shifting and tilting of a vessel closure. USP1993035191993.
  51. Horn Waldemar (Wimsheim DEX). Diaphragm for an hydraulically driven diaphragm pump. USP1993025188515.
  52. Hicks Cecil T. (908 Cassandra Ave. Huntsville AL 35802). Diaphragm pump. USP1988104778356.
  53. Credle ; Jr. William S. (Stone Mountain GA). Double-acting diaphragm pump and reversing mechanism therefor. USP1987074682937.
  54. Austin Cary M.. Dribble flow valve. USP2000086109296.
  55. Kamikawa Yuji,JPX ; Minami Teruomi,JPX ; Kitahara Shigenori,JPX. Drying treatment method and apparatus. USP2000026029371.
  56. Masato M. Toshima ; Phil M. Salzman ; Steven C. Murdoch ; Cheng Wang ; Mark A. Stenholm ; James Howard ; Leonard Hall ; David Cheng. Dual cassette load lock. USP2002096454519.
  57. Toshima Masato M. (Sunnyvale CA) Salzman Phil M. (San Jose CA) Murdoch Steven C. (Palo Alto CA) Wang Cheng (San Jose CA) Stenholm Mark A. (San Jose CA) Howard James (San Jose CA) Hall Leonard (San Jo. Dual cassette load lock. USP1993025186594.
  58. Toshima Masato M. ; Salzman Phil M. ; Murdoch Steven C. ; Wang Cheng ; Stenholm Mark A. ; Howard James ; Hall Leonard ; Cheng David. Dual cassette load lock. USP1998065769588.
  59. Schaffer Eric J. ; Werner Neal A. ; Handzel James J.. Electronic CAM compensation of pressure change of servo controlled pumps. USP1999105971714.
  60. Johansson Arne I. (Fgelvagen 5 840 70 Hammarstrand SEX). Fail-safe device for a lid of a pressure vessel. USP1984014426358.
  61. Murphy James C. ; Goodge Kevin ; Hlebovy Jim. Fitting installation process and apparatus for a molded plastic vessel. USP1999055900107.
  62. Shen, Der-Fan. Flow regulator for water pump. USP2003056564826.
  63. Wang, Luping; Tabler, Terry A.; Dietz, James A.. Fluid distribution system and process, and semiconductor fabrication facility utilizing same. USP2003056561213.
  64. Filonczuk, Michael A.. Fluid flow control apparatus for controlling and delivering fluid at a continuously variable flow rate. USP2003056561481.
  65. Gehm William ; Gehm Lanny. Fluid pump speed controller. USP2000046045331.
  66. Story Carl E. (Cupertino CA) Nichols Jerry A. (San Jose CA) Cady Byron C. (Gilroy CA). Fluid pumping apparatus and system with leak detection and containment. USP1991115062770.
  67. Robinson Karl M.. Formation of planar dielectric layers using liquid interfaces. USP2000086103638.
  68. Robinson, Karl M.. Formation of planar dielectric layers using liquid interfaces. USP2003036532772.
  69. James B. Miller ; Joseph D. Jolson. Gas sensor. USP2002026344174.
  70. Takeshita Kazuhiro,JPX ; Nagashima Shinji,JPX ; Mizutani Yoji,JPX ; Katayama Kyoshige,JPX. Gas treatment apparatus. USP2001026190459.
  71. Blackwood Robert S. (Lubbock TX) Biggerstaff Rex L. (Lubbock TX) Clements L. Davis (Lincoln NE) Cleavelin C. Rinn (Lubbock TX). Gaseous process and apparatus for removing films from substrates. USP1988064749440.
  72. Shimazu Tomohisa,JPX ; Nakao Ken,JPX. Heat-treating boat for semiconductor wafers. USP2000056062853.
  73. Fujikawa Takao,JPX ; Narukawa Yutaka,JPX ; Masuoka Itaru,JPX ; Yuki Takahiro,JPX ; Sakashita Yoshihiko,JPX. Heating pressure processing apparatus. USP1999115979306.
  74. Malchow Gregory L. ; Kegler Andrew ; Harris Stephen L.. High pressure cleaning vessel with a space saving door opening/closing apparatus. USP2000066070440.
  75. Sutton, Thomas R.; Biberger, Maximilan A.. High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism. USP2004046722642.
  76. Kegler Andrew ; Malchow Gregory L. ; Harris Stephen L.. High pressure liquid/gas storage frame for a pressurized liquid cleaning apparatus. USP1999095946945.
  77. Yamagata, Masahiro; Oshiba, Hisanori; Sakashita, Yoshihiko; Inoue, Yoichi; Muraoka, Yusuke; Saito, Kimitsugu; Mizobata, Ikuo; Kitakado, Ryuji. High pressure processing apparatus. USP2005046874513.
  78. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert. High pressure processing chamber for semiconductor substrate. USP2005076921456.
  79. Fujikawa Takao,JPX ; Ishii Takahiko,JPX ; Nakai Tomomitsu,JPX ; Sakashita Yoshihiko,JPX. High-temperature high-pressure gas processing apparatus. USP1999045898727.
  80. Kato Hiroyuki,JPX ; Honda Shuichiro,JPX. High-temperature motor pump and method for operating thereof. USP1999035882182.
  81. Privat Michel (6 ; rue Monsigny 75002 Paris FRX). Installation for cleaning clothes and removal of particulate contaminants especially from clothing contaminated by radio. USP1986074601181.
  82. Davis Cecil J. (Greenville TX) Matthews Robert (Plano TX) Bowling Robert A. (Garland TX). Integrated circuit processing system. USP1991095044871.
  83. Ting Chiu H. ; Holtkamp William H.. Integrated vacuum and plating cluster system. USP2000016017820.
  84. Adams Paul R. ; Gabel Karl J. ; Roper Daniel G.. Intelligent pressure regulator. USP2000056056008.
  85. Tseronis, James A.; Mortiz, Heiko D.; Chandra, Mohan; Farmer, Robert B.; Jafri, Ijaz H.; Talbott, Jonathan. Inverted pressure vessel with horizontal through loading. USP2003016508259.
  86. Robert B Farmer ; Jonathan A. Talbott ; Mohan Chandra ; James A. Tseronis ; Heiko D. Moritz. Inverted pressure vessel with shielded closure mechanism. USP2002126497239.
  87. Akiyama Nobuyuki (Yokohama JPX) Kembo Yukio (Yokohama JPX) Nakagawa Yasuo (Yokohama JPX) Aiuchi Susumu (Yokohama JPX) Nomoto Mineo (Yokohama JPX). Light exposure device and method. USP1983074391511.
  88. Masakara Alok ; Ramos Teresa ; Smith Douglas M.. Limited-volume apparatus and method for forming thin film aerogels on semiconductor substrates. USP2000036037277.
  89. Maskara Alok ; Ramos Teresa ; Smith Douglas M.. Limited-volume apparatus for forming thin film aerogels on semiconductor substrates. USP2000126159295.
  90. Chao Sidney C. ; Purer Edna M. ; Sorbo Nelson W.. Liquid carbon dioxide cleaning using agitation enhancements at low temperature. USP2001076264753.
  91. Chao Sidney C. ; Purer Edna M. ; Sorbo Nelson W.. Liquid carbon dioxide cleaning using jet edge sonic whistles at low temperature. USP1999015858107.
  92. Lerette Ricky D. ; LeBlanc Maurice O. ; Silvia George A.. Liquified gas dry cleaning system. USP1999085943721.
  93. Roberts James L. ; Kegler Andrew. Liquified gas dry-cleaning system with pressure vessel temperature compensating compressor. USP1998125850747.
  94. Simon Chooi SG; Mei Sheng Zhou SG; Yi Xu SG. Low dielectric constant materials for copper damascene. USP2002086436824.
  95. Mack Alfred (Poughkeepsie NY) O\Neill Brian C. (Millbrook NY) Penzetta Fred L. (Wappingers Falls NY). Low shock transmissive antechamber seal mechanisms for vacuum chamber type semi-conductor wafer electron beam writing ap. USP1982104355937.
  96. Boitnott Charles A. (Half Moon Bay CA) Toole Monte M. (San Carlos CA). Method and apparatus for batch processing a semiconductor wafer. USP1992125167716.
  97. Masuzawa Jun (Kobe JPX). Method and apparatus for controlling hydraulic systems of construction equipment. USP1996075540554.
  98. Tanaka Akinori,JPX ; Okano Shoichi,JPX ; Maki Isao,JPX. Method and apparatus for drying washed objects. USP2001046216364.
  99. Kawamura Yoshio,JPX ; Yamamoto Tatuharu,JPX ; Moriyama Shigeo,JPX ; Kawamoto Yoshifumi,JPX ; Yokoyama Natsuki,JPX ; Uchida Fumihiko,JPX ; Hidaka Minoru,JPX ; Matsui Miyako,JPX. Method and apparatus for fabricating semiconductor devices. USP1999115981399.
  100. Hassan Javathu K. (Hopewell Junction NY) Mack Alfred (Poughkeepsie NY) Wojtaszek Michael R. (Poughkeepsie NY). Method and apparatus for handling workpieces. USP1976073968885.
  101. Bergman Eric J. ; Sharp Ian ; Meuchel Craig P. ; Woods H. Frederick. Method and apparatus for high-pressure wafer processing and drying. USP2001096286231.
  102. Dryer Paul William ; Tirendi Richard Scott ; Sundin James Bradley. Method and apparatus for immersion cleaning of semiconductor devices. USP2000026021791.
  103. Jevtic Dusan. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer pr. USP1999075928389.
  104. Starov Vladimir ; Basha Syed S. ; Shrinivasan Krishnan ; Reinhardt Karen A. ; Kabansky Aleksandr. Method and apparatus for removing post-etch residues and other adherent matrices. USP2001056228563.
  105. Starov Vladimir ; Erez Shmuel ; Basha Syed S. ; Shimanovich Arkadiy I. ; Vellanki Ravi ; Shrinivasan Krishnan ; Reinhardt Karen A. ; Kabansky Aleksandr. Method and apparatus for removing post-etch residues and other adherent matrices. USP2001126333268.
  106. Nguyen Thu ; Lavi Michal. Method and apparatus for sequencing wafers in a multiple chamber, semiconductor wafer processing system. USP2000096122566.
  107. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert. Method and apparatus for supercritical processing of multiple workpieces. USP2004056736149.
  108. Weil Peter (Helene-Mayer-Ring 10 D-8000 Munich DEX). Method and apparatus for treating objects in a closed vessel with a solvent. USP1991045011542.
  109. Humayun, Raashina; Joyce, Patrick Christopher. Method and apparatus to remove additives and contaminants from a supercritical processing solution. USP2004106805801.
  110. Wen Ziying. Method for chemical processing semiconductor wafers. USP2001056239038.
  111. Paranjpe Ajit P. (Plano TX). Method for cleaning semiconductor wafers using liquified gases. USP1996025494526.
  112. Greer Mark R. ; Mehaffey James D. ; Murray Darrell F.. Method for controlling fluid flow through a compressed fluid system. USP2000096123510.
  113. Morita Kiyoyuki (Osaka JPX) Ishihara Takeshi (Osaka JPX). Method for forming a dielectric thin film or its pattern of high accuracy on a substrate. USP1993025185296.
  114. Horner James W. (San Diego CA) Zablotny Gordon O. (San Diego CA). Method for forming filled holes in multi-layer integrated circuit packages. USP1993095242641.
  115. Matthews John C. (Gaithersburg MD) Wooten Robert D. (Rockville MD) Ferris David S. (Washington DC) Rounds Stuart N. (Germantown MD). Method for photoresist stripping using reverse flow. USP1991125071485.
  116. Paranjpe Ajit P. (Plano TX). Method for planarization. USP1995075434107.
  117. Gonzales David (Boise ID) Hudson Guy F. (Boise ID). Method for post chemical-mechanical planarization cleaning of semiconductor wafers. USP1997105679169.
  118. Stucker John F.. Method for rejuvenating pressurized fluid solvent used in cleaning a fabric article. USP1998065772783.
  119. Shortes Samuel R. (Lewisville TX) Penn Thomas C. (Richardson TX). Method for removing photoresist layer from substrate by ozone treatment. USP1982074341592.
  120. Keigler Arthur. Method of and apparatus for controlling fluid flow and electric fields involved in the electroplating of substantially flat workpieces and the like and more generally controlling fluid flow in the pr. USP2001066251250.
  121. Wu, Chih-Ning; Yang, Chan-Lon; Chien, Sun-Chieh. Method of cleaning a dual damascene structure. USP2003106635565.
  122. Morita, Kiyoyuki; Ohtsuka, Takashi; Ueda, Michihito. Method of forming film for semiconductor device with supercritical fluid. USP2003046541278.
  123. Dickson Donald J. (Charleston WV) Marchetti Marcelo J. (Kanawha WV). Method, apparatus, and article for forming a heated, pressurized mixture of fluids. USP1993035190373.
  124. Hoy Kenneth L. (St. Albans WV) Nielsen Kenneth A. (Charleston WV). Methods for cleaning apparatus using compressed fluids. USP1994045306350.
  125. DeYoung, James P.; McClain, James B.; Gross, Stephen M.; DeSimone, Joseph M.. Methods for cleaning microelectronic structures with aqueous carbon dioxide systems. USP2003116641678.
  126. DeYoung, James; McClain, James B.; Cole, Michael E.; Brainard, David. Methods for cleaning microelectronic structures with cyclical phase modulation. USP2003076596093.
  127. Bernhard H. Weigl ; Paul Yager ; James P. Brody ; Mark R. Holl ; Fred K. Forster ; Eric Altendorf ; Paul C. Galambos ; Margaret Kenny ; David Schutte ; Gregory Hixson ; Diane Zebert ; Andr. Microfabricated devices and methods. USP2002096454945.
  128. Yager Paul ; Brody James P. ; Holl Mark R. ; Forster Fred K. ; Galambos Paul C.. Microfabricated differential extraction device and method. USP1999085932100.
  129. McCullough John V. ; Ice Charles L. ; Leonard Jeremy W. ; Sherard Stephen. Microwave pressure vessel and method of sterilization. USP2000086097015.
  130. Berner Robert W. ; Woodruff Daniel J. ; Schmidt Wayne J. ; Coyle Kevin W. ; Zila Vladimir,CAX ; Lund Worm. Modular semiconductor workpiece processing tool. USP2001036203582.
  131. White John M. ; Conner Robert B. ; Law Kam S. ; Turner Norman L. ; Lee William T. ; Kurita Shinichi. Modular substrate processing system. USP2001056235634.
  132. Stark Lawrence R. (San Jose CA) Turner Frederick (Sunnyvale CA). Modular wafer transport and processing system. USP1990044917556.
  133. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun. Multi-chamber integrated process system. USP1990084951601.
  134. Ozawa Masahito (Yamanashi JPX) Mizukami Masami (Yamanashi JPX) Kanazashi Masanobu (Kofu JPX) Takasoe Toshihiko (Yamanashi JPX) Narushima Masaki (Yamanashi JPX) Kubodera Masao (Yamanashi JPX). Multi-chamber system provided with carrier units. USP1995125474410.
  135. Asakawa Teruo,JPX ; Saeki Hiroaki,JPX. Multi-chamber treatment system. USP1999085934856.
  136. Maydan Dan ; Somekh Sasson ; Wang David Nin-Kou ; Cheng David ; Toshima Masato ; Harari Isaac ; Hoppe Peter D.. Multiple chamber integrated process system. USP1999035882165.
  137. Dhindsa Jasbir S. (1239 Sugarcreek Blvd. Sugarland TX 77478) Arambula Hector C. (2517 Sage Brush La. Sugarland TX 77079). Multiple reciprocating pump system. USP1993115259731.
  138. Kiba Hiroshi (Hiroshima JPX) Nagano Kenzou (Hiroshima JPX) Sumiyoshi Shigeru (Hiroshima JPX). Painting truck washing system. USP1990054924892.
  139. Eric H. Lenz. Perimeter wafer lifting. USP2002056389677.
  140. Lenz Eric H.. Perimeter wafer lifting. USP2001106305677.
  141. Fujikawa Takao,JPX ; Yuki Takahiro,JPX ; Sakashita Yoshihiko,JPX ; Narukawa Yutaka,JPX ; Masuoka Itaru,JPX. Piston type gas compressor. USP2000066077053.
  142. Morch Leo,DKX. Pivotable and sealable cap assembly for opening in a large container. USP2000046053348.
  143. Rush John M.. Pod loader interface improved clean air system. USP1999085934991.
  144. Fitzgerald Wayne ; James Kenneth J. ; Waibel Brian J.. Precision high pressure control assembly. USP1999035888050.
  145. Gerald Bloom. Pressure controller. USP2002076418956.
  146. Malchow Gregory L. ; Harris Stephen L. ; Kegler Andrew. Pressure vessel door operating apparatus. USP2000076085935.
  147. Webb Douglas A.. Process for chemical vapor deposition of tungsten onto a titanium nitride substrate surface. USP1999055906866.
  148. Jur, Jesse Stephen; McCullough, Kenneth J.; Moreau, Wayne Martin; Simons, John Patrick; Taft, Charles Jesse. Process for cleaning a workpiece using supercritical carbon dioxide. USP2003056558475.
  149. Kagiyama Yasuhiro (Tokuyama JPX) Doi Koichi (Tabuse JPX) Nonaka Toru (Tokuyama JPX) Ishiyama Yuji (Shin-Nanyo JPX) Komatsubara Shigeo (Yokohama JPX). Process for washing semiconductor substrate with organic solvent. USP1988114788043.
  150. Guertin Ronald R.. Processing system having vacuum manifold isolation. USP2000036041817.
  151. Sitek George J. (Stevensville MI) Walker Sherman L. (Stevensville MI). Proximate analyzer. USP1985064522788.
  152. White ; III Dorsey E. (Poquoson VA) Updike ; deceased Benjamin T. (late of Newport News VA by Barbara G. Updike ; legal representative) Allred Johnny W. (Newport News VA). Quick actuating closure. USP1989044823976.
  153. Aschner Helmut,DEX ; Hauke Andreas,DEX ; Walk Ulrich,DEX ; Zernickel Dieter,DEX. Rapid thermal processing (RTP) system with gas driven rotating substrate. USP1999126005226.
  154. Curtis Gary L. ; Thompson Raymon F.. Reactor for processing a microelectronic workpiece. USP2001076264752.
  155. Steven L. Peace ; Gary L. Curtis ; Raymon F. Thompson ; Brian Aegerter ; Curt T. Dundas. Reactor for processing a semiconductor wafer. USP2002076423642.
  156. Mullee William H. ; de Leeuwe Marc ; Roberson ; Jr. Glenn A.. Removal of CMP residue from semiconductors using supercritical carbon dioxide process. USP2001086277753.
  157. Mullee, William H.. Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process. USP2003016509141.
  158. Mullee William H.. Removal of resist or residue from semiconductors using supercritical carbon dioxide. USP2001106306564.
  159. Takei Toshitaka (Suita JPX) Funatsu Tsunemasa (Sakai JPX). Resist developing apparatus. USP1989054827867.
  160. Wilson Leslie P. S. (Nassau BSX). Reverse osmosis liquid purification apparatus. USP1983014367140.
  161. Wolf Kurt (Wildbad DEX) Andre Wolfram K. (Aichwald DEX). Saucepan and cover for a cooking utensil, particulary a steam pressure cooking pan. USP1986034574184.
  162. Michael A. Johnson ; Clayton A. George ; Robert J. Boettcher. Sealant composition, article including same, and method of using same. USP2002066406782.
  163. Shimizu Yuji,JPX. Semiconductor wafer carrier. USP2000076089377.
  164. Konishi Toko,JPX ; Ban Cozy,JPX. Semiconductor workpiece cleaning method and apparatus. USP2000116145519.
  165. Hunter Reginald. Sensor device for non-intrusive diagnosis of a semiconductor processing system. USP2001066244121.
  166. Dunmire, Charles W.. Short-length reduced-pressure backflow preventor. USP2003046546946.
  167. David C. Skee. Silicate-containing alkaline compositions for cleaning microelectronic substrates. USP2002106465403.
  168. Robert Michael Reese. Solid-state chip cooling by use of microchannel coolant flow. USP2002056388317.
  169. Skinner David R. (Odessa TX). Speed control. USP1979034145161.
  170. Messer Mark G. (Los Gatos CA) Stark Lawrence R. (San Jose CA). Sputter module for modular wafer processing system. USP1987064670126.
  171. Tepman Avi (Cupertino CA) Grunes Howard (Santa Cruz CA) Somekh Sasson (Los Altos Hills CA) Maydan Dan (Los Altos Hills CA). Staged-vacuum wafer processing system and method. USP1993025186718.
  172. Takahashi Nobuyuki (Fuchu JPX) Kitahara Hiroaki (Fuchu JPX). Substrate processing apparatus. USP1989054825808.
  173. Semyon Sherstinsky ; Arnold Kholodenko ; Calvin Augason ; Samuel Wilson ; Michael Phillips ; Leonel Zuniga. Substrate support member. USP2002106464790.
  174. Costantini, Michael A.; Chandra, Mohan; Moritz, Heiko D.; Jafri, Ijaz H.; Mount, David J.; Heathwaite, Rick M.. Supercritical fluid delivery and recovery system for semiconductor wafer processing. USP2003096612317.
  175. Heiko D Moritz ; Jonathan A. Talbott ; Mohan Chandra ; James A. Tseronis ; Ijaz Jafri. Supercritical fluid drying system and method of use. USP2002016334266.
  176. Farmer Robert B. ; Jones Bernard D. ; Gupta Kedar P. ; Jafri Ijaz H. ; Dispensa Derek M.. Supercritical phase wafer drying/cleaning system. USP2000056067728.
  177. Joyce, Patrick C.; Tipton, Adrianne; Shrinivasan, Krishnan; Hess, Dennis W.; Myneni, Satyanarayana; Levitin, Galit. Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials. USP2004076764552.
  178. Moore, Scott E.. System for filling openings in semiconductor products. USP2003116642140.
  179. Moore, Scott E.. System for filling openings in semiconductor products. USP2003096613105.
  180. Stucker John F.. System for rejuvenating pressurized fluid solvents used in cleaning substrates. USP2000076082150.
  181. Bertoncini Joseph (Gaithersburg MD). Tubeless cell harvester. USP1989114879431.
  182. Robert F. McLoughlin. Universal track interface. USP2002036363292.
  183. Sakamoto Eiji (Sagamihara JPX) Ebinuma Ryuichi (Machida JPX) Hara Shinichi (Yokohama JPX) Marumo Mitsuji (Sagamihara JPX). Vacuum chuck. USP1994125374829.
  184. Rand Burton (Norristown PA). Vapor degreasing system having a divider wall between upper and lower vapor zone portions. USP1977064029517.
  185. Kurokawa Hideaki (Hitachi JPX) Ebara Katsuya (Mito JPX) Takahashi Sankichi (Hitachi JPX) Matsuzaki Harumi (Hitachi JPX) Yoda Hiroaki (Tsuchiura JPX) Nitta Takahisa (Fuchu JPX) kouchi Isao (Hitachi JP. Vapor washing process and apparatus. USP1992045105556.
  186. Rahn Armin (St. Jean sur Richelieu CAX). Vapour phase treatment process and apparatus. USP1989064838476.
  187. Curry, Mark William; Greenbank, Daniel Paul; Lu, Danny Cam Toan. Variable speed pump control. USP2005116966967.
  188. Gadgil Prasad N. ; Seidel Thomas E.. Vertically-stacked process reactor and cluster tool system for atomic layer deposition. USP1999035879459.
  189. Ishijima Akira (Tokyo JPX) Beppu Toshihiko (Tokyo JPX) Kikuchi Gunpei (Tokyo JPX). Washing arrangement for and method of washing lead frames. USP1990104960140.
  190. Adachi Hideki,JPX ; Izumi Akira,JPX. Wet/dry substrate processing apparatus. USP2000066077321.