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Multi-element heat exchange assemblies and methods of fabrication for a cooling system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0290757 (2005-11-30)
등록번호 US-7272005 (2007-09-18)
발명자 / 주소
  • Campbell,Levi A.
  • Chu,Richard C.
  • Ellsworth, Jr.,Michael J.
  • Iyengar,Madhusudan K.
  • Schmidt,Roger R.
  • Simons,Robert E.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Heslin Rothenberg Farley & Mesiti, P.C.
인용정보 피인용 횟수 : 33  인용 특허 : 15

초록

A heat exchange assembly for a cooling system, having first and second cooling loops, includes a housing with a first coolant inlet and outlet and a second coolant inlet and outlet, respectively coupling to the first and second cooling loops, and multiple heat exchange elements. Each heat exchange

대표청구항

What is claimed is: 1. A heat exchange assembly for a cooling system comprising a first cooling loop and a second cooling loop, the heat exchange assembly comprising: a housing including a first coolant inlet, a first coolant outlet, a second coolant inlet and a second coolant outlet, the first coo

이 특허에 인용된 특허 (15)

  1. Dewar Douglas M. ; Duncan Christopher K. ; Anderson Alexander F., Composite plate pin or ribbon heat exchanger.
  2. Charles M. Newton ; Randy T. Pike ; Richard A. Gassman, Electronic device using evaporative micro-cooling and associated methods.
  3. Kurematsu Masayuki,JPX, Heat exchanger.
  4. Okamoto Yoshiyuki,JPX ; Kawaguchi Kiyoshi,JPX ; Kadota Shigeru,JPX ; Sugito Hajime,JPX, Heat exchanger having plural fluid passages.
  5. Blomgren,Ralf Erik, Heat exchanger plate, a plate pack and a plate heat exchanger.
  6. Ritter, Allen M.; Black, Hugh David, Heat sink assembly.
  7. Upadhya,Girish; Kenny,Thomas W.; Zhou,Peng; Munch,Mark; Shook,James Gill; Goodson,Kenneth; Corbin,David, Interwoven manifolds for pressure drop reduction in microchannel heat exchangers.
  8. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
  9. Raunio Pentti (Riihimki FIX), Method of constructing a heat exchanger and a heat exchanger constructed by using that method.
  10. Tran Hai H. (2407 McNeil Wichita Falls TX 76307), Modular, compact heat exchanger.
  11. Vafai, Kambiz; Zhu, Lu, Multi-layered micro-channel heat sink, devices and systems incorporating same.
  12. Abiko, Tetsuo; Tujii, Jyunichi; Eta, Takashi, Plate fin heat exchanger for a high temperature.
  13. Abiko, Tetsuo; Tujii, Jyunichi; Eta, Takashi, Plate fin type heat exchanger for high temperature.
  14. Szcs Lszl (Budapest HUX) Harmatha Andrs (Budapest HUX), Plate-type heat exchanger.
  15. Mathur,Achint P.; Fulmer,Jason Michael, Shell and plate heat exchanger.

이 특허를 인용한 특허 (33)

  1. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.
  2. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
  3. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
  4. Farber, Nathaniel; Smith, Lee S., Configureable heat exchanger.
  5. Rasmussen, Neil; Bean, John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  6. Rasmussen, Neil; Bean, Jr., John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  7. Shen, Yu-Nung, Heat dissipating device.
  8. Kim, Youngwan; Park, Jaewon; Kim, Minhwan; Hong, Sungdeok; Lee, Wonjae; Chang, Jonghwa, High temperature and high pressure corrosion resistant process heat exchanger for a nuclear hydrogen production system.
  9. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  10. Wexler, Peter, In-row air containment and cooling system and method.
  11. Zaffetti, Mark A.; Taddey, Edmund P., Integral cold plate and structural member.
  12. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  13. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
  14. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
  15. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
  16. Tutunoglu, Ozan, Method and apparatus for cooling.
  17. Tutunoglu, Ozan; Bean, Jr., John H., Method and apparatus for cooling.
  18. Tutunoglu, Ozan; Lingrey, David James, Method and apparatus for cooling.
  19. Tutunoglu, Ozan; Bean, Jr., John H., Method of operating a cooling system having one or more cooling units.
  20. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  21. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  22. Eckberg, Eric A.; Graybill, David P.; Iyengar, Madhusudan K.; Mahaney, Jr., Howard V.; Schmidt, Roger R.; Schneebeli, Kenneth R., Multi-rack, door-mounted heat exchanger.
  23. Eckberg, Eric A.; Graybill, David P.; Iyengar, Madhusudan K.; Mahaney, Jr., Howard V.; Schmidt, Roger R.; Schneebeli, Kenneth R., Multi-rack, door-mounted heat exchanger.
  24. Eckberg, Eric A.; Graybill, David P.; Iyengar, Madhusudan K.; Mahaney, Jr., Howard V.; Schmidt, Roger R.; Schneebeli, Kenneth R., Multi-rack, door-mounted heat exchanger.
  25. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
  26. Shrivastava, Saurabh K.; VanGilder, James W., System and method for arranging equipment in a data center.
  27. VanGilder, James William, System and method for prediction of temperature values in an electronics system.
  28. Healey, Christopher M.; Zhang, Xuanhang, System and method for sequential placement of cooling resources within data center layouts.
  29. Sawczak, Stephen D.; Komlenic, Todd; Adams, Michael, Systems and methods for computer equipment management.
  30. Sawczak, Stephen D.; Komlenic, Todd; Adams, Michael, Systems and methods for computer equipment management.
  31. Sawczak, Stephen D.; Komlenic, Todd; Adams, Michael, Systems and methods for computer equipment management.
  32. Sawczak, Stephen D.; Komlenic, Todd; Adams, Michael, Systems and methods for computer equipment management.
  33. Paul, Brian K.; Brannon, Samuel T., Systems and methods of manufacturing microchannel arrays.
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