IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0478409
(2006-06-28)
|
등록번호 |
US-7273310
(2007-09-25)
|
우선권정보 |
CN-2005 1 0037507(2005-09-22) |
발명자
/ 주소 |
|
출원인 / 주소 |
- Hon Hai Precision Industry Co., Ltd.
|
인용정보 |
피인용 횟수 :
7 인용 특허 :
1 |
초록
▼
An edge-lighting type backlight module (10) includes a light guide plate (12), at least one light sources (14), a reflector (16), a thermally conductive layer (18), and a plurality of heat pipes (20). The light guide plate has a light incident surface (120). The at least one light source is disposed
An edge-lighting type backlight module (10) includes a light guide plate (12), at least one light sources (14), a reflector (16), a thermally conductive layer (18), and a plurality of heat pipes (20). The light guide plate has a light incident surface (120). The at least one light source is disposed adjacent to the light incident surface, and partly surrounded by the reflector. The thermally conductive layer is formed on an inner surface of the reflector near to the at least one light source, and the heat pipes attached to an outer surface of the reflector facing away from the at least one light source. A direct type backlight module (30) includes a diffuser plate (32), a reflector (34), at least one light sources (36), a thermally conductive layer (38), and a plurality of heat pipes (40).
대표청구항
▼
What is claimed is: 1. A backlight module comprising: a light guide plate having a light incident surface; at least one light source disposed adjacent to the light incident surface; a reflector partly surrounding the at least one light source; a thermally conductive layer formed on an inner surface
What is claimed is: 1. A backlight module comprising: a light guide plate having a light incident surface; at least one light source disposed adjacent to the light incident surface; a reflector partly surrounding the at least one light source; a thermally conductive layer formed on an inner surface of the reflector facing the at least one light source; and a plurality of heat pipes each having one end thereof attached to an outer surface of the reflector, each heat pipe further extending away from the at least one light source. 2. The backlight module as described in claim 1, wherein the reflector is comprised of a material selected from the group consisting of copper, aluminum, and any alloy thereof. 3. The backlight module as described in claim 1, wherein the thermally conductive layer is comprised of silver. 4. The backlight module as described in claim 1, wherein the thermally conductive layer is comprised of silver particles having an average grain size in the range from about 100 nm to about 1000 nm. 5. The backlight module as described in claim 1, further comprising a thermal interface material layer arranged between the reflector and the heat pipes. 6. The backlight module as described in claim 5, wherein the thermal interface material layer is comprised of carbon nanotubes in silver paste solution. 7. The backlight module as described in claim 1, further comprising a heat sink coupled with the other ends of the heat pipes. 8. The backlight module as described in claim 7, further comprising a fan attached to the heat sink. 9. The backlight module as described in claim 1, wherein the at least one light source is one of at least one light emitting diode and at least one cold cathode fluorescent lamp. 10. A backlight module comprising: a diffuser plate; a reflector; at least one light source arranged between the diffuser plate and the reflector; a thermally conductive layer formed on an inner surface of the reflector facing the at least one light source; and a plurality of heat pipes each having one end thereof attached to an outer surface of the reflector, each heat pipe further extending away from the at least one light source. 11. The backlight module as described in claim 10, wherein the reflector is comprised of a material selected from the group consisting of copper, aluminum, and any combination alloy thereof. 12. The backlight module as described in claim 10, wherein the thermally conductive layer is comprised of silver. 13. The backlight module as described in claim 10, wherein the thermally conductive layer is comprised of silver particles having an average grain size in the range from about 100 nm to about 1000 nm. 14. The backlight module as described in claim 10, further comprising a thermal interface material layer arranged between the reflector and the heat pipes, the thermal interface material layer comprising a plurality of carbon nanotubes with silver gel therein. 15. The backlight module as described in claim 10, further comprising a heat sink coupled with the other ends of the heat pipes. 16. The backlight module as described in claim 15, further comprising a fan attached to the heat sink. 17. The backlight module as described in claim 10, wherein the at least one light source chosen from the group consisting of light emitting diodes and cold cathode fluorescent lamps.
이 특허에 인용된 특허 (1)
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Mori Shigeki,JPX ; Ishii Takayuki,JPX, LCD with bimetal switch between panel and heat sink for regulating temperature of panel.
이 특허를 인용한 특허 (7)
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Kawase, Mitsuhiro, Backlight device and liquid crystal display apparatus.
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Hsu, Nien-Hui; Lee, Ching-Po, Backlight module with a heat dissipation device.
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Hsiao, Chih Chung, Backlight module with light reflector having plural reflection capability and liquid crystal display using same.
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Kim, Kyung Il, Backlight unit and liquid crystal display using the same.
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Kuo, Yi-Cheng; Zhou, Gege, Edge-lit backlight device and liquid crystal display.
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Cronk, Michael Kent; Stephens, Owen Boyd, Light emitting diode illumination system.
-
Iwasaki, Osamu, Planar lighting device.
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