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A suspension assembly includes a load beam, a mount plate, first and second piezoelectric microactuators, and a flex circuit segment. The first piezoelectric microactuator is electrically non-conductively attached to the load beam and the mount plate. The first piezoelectric microactuator includes

A suspension assembly includes a load beam, a mount plate, first and second piezoelectric microactuators, and a flex circuit segment. The first piezoelectric microactuator is electrically non-conductively attached to the load beam and the mount plate. The first piezoelectric microactuator includes a first piezoelectric element, a first top electrode, and a first bottom electrode. The second piezoelectric microactuator is electrically non-conductively attached to the load beam and the mount plate. The second piezoelectric microactuator includes a second piezoelectric element, a second top electrode, and a second bottom electrode. The flex circuit segment is disposed folded about the first and second piezoelectric microactuators. The flex circuit segment is in electrical communication with the first top electrode, the first bottom electrode, the second top electrode, and the second bottom electrode.

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I claim: 1. A suspension assembly for use with a disk drive, the suspension assembly comprising: a load beam; a mount plate; a first piezoelectric microactuator disposed between the load beam and the mount plate for pivoting the load beam relative to the mount plate, the first piezoelectric microac

I claim: 1. A suspension assembly for use with a disk drive, the suspension assembly comprising: a load beam; a mount plate; a first piezoelectric microactuator disposed between the load beam and the mount plate for pivoting the load beam relative to the mount plate, the first piezoelectric microactuator being electrically non-conductively attached to the load beam and the mount plate for electrically isolating the first piezoelectric microactuator from the load beam and the mount plate, the first piezoelectric microactuator including a first piezoelectric element, a first top electrode disposed upon the first piezoelectric element, and a first bottom electrode disposed upon the first piezoelectric element opposite the first top electrode; a second piezoelectric microactuator disposed between the load beam and the mount plate for pivoting the load beam relative to the mount plate, the second piezoelectric microactuator being electrically non-conductively attached to the load beam and the mount plate for electrically isolating the second piezoelectric microactuator from the load beam and the mount plate, the second piezoelectric microactuator including a second piezoelectric element, a second top electrode disposed upon the second piezoelectric element, and a second bottom electrode disposed upon the second piezoelectric element opposite the second top electrode; and the first and second piezoelectric microactuators being at least partially enclosed by a folded flex circuit segment, the flex circuit segment being in electrical communication with the first top electrode, the first bottom electrode, the second top electrode, and the second bottom electrode. 2. The suspension assembly of claim 1 wherein the first and second piezoelectric microactuators are electrically non-conductively attached to the load beam and the mount plate with non-conductive adhesive. 3. The suspension assembly of claim 1 wherein the first and second piezoelectric elements each have opposing first and second ends, the first ends are each respectively electrically non-conductively attached to the load beam, the second ends are each respectively electrically non-conductively attached to the mount plate. 4. The suspension assembly of claim 3 wherein the first ends are each respectively electrically non-conductively attached to the load beam with non-conductive adhesive, the second ends are each respectively electrically non-conductively attached to the mount plate with non-conductive adhesive. 5. The suspension assembly of claim 1 wherein the first and second bottom electrodes are disposed between the load beam and the mount plate without being in electrical contact with the load beam and the mount plate. 6. The suspension assembly of claim 1 further includes a flex circuit assembly with a head trace segment disposed along the load beam. 7. The suspension assembly of claim 6 wherein the flex circuit segment is integrally formed with the flex circuit assembly. 8. The suspension assembly of claim 1 wherein the flex circuit segment includes first, second, and third traces electrically connected to the first and second piezoelectric microactuators. 9. The suspension assembly of claim 8 wherein the first trace is electrically connected to the first top electrode, the second trace is electrically connected to the second top electrode and the first bottom electrode, the third trace is electrically connected to the second bottom electrode. 10. A head stack assembly for use with a disk drive, the head stack assembly comprising: an actuator arm; and a suspension assembly attached to the actuator arm, the suspension assembly including: a load beam; a mount plate coupled to the actuator arm; a first piezoelectric microactuator disposed between the load beam and the mount plate for pivoting the load beam relative to the mount plate, the first piezoelectric microactuator being electrically non-conductively attached to the load beam and the mount plate for electrically isolating the first piezoelectric microactuator from the load beam and the mount plate, the first piezoelectric microactuator including a first piezoelectric element, a first top electrode disposed upon the first piezoelectric element, and a first bottom electrode disposed upon the first piezoelectric element opposite the first top electrode; a second piezoelectric microactuator disposed between the load beam and the mount plate for pivoting the load beam relative to the mount plate, the second piezoelectric microactuator being electrically non-conductively attached to the load beam and the mount plate for electrically isolating the second piezoelectric microactuator from the load beam and the mount plate, the second piezoelectric microactuator including a second piezoelectric element, a second top electrode disposed upon the second piezoelectric element, and a second bottom electrode disposed upon the second piezoelectric element opposite the second top electrode; and the first and second piezoelectric microactuators being at least partially enclosed by a folded flex circuit segment, the flex circuit segment being in electrical communication with the first top electrode, the first bottom electrode, the second top electrode, and the second bottom electrode. 11. The head stack assembly of claim 10 wherein the first and second piezoelectric microactuators are electrically non-conductively attached to the load beam and the mount plate with non-conductive adhesive. 12. The head stack assembly of claim 10 wherein the first and second piezoelectric elements each have opposing first and second ends, the first ends are each respectively electrically non-conductively attached to the load beam, the second ends are each respectively electrically non-conductively attached to the mount plate. 13. The head stack assembly of claim 12 wherein the first ends are each respectively electrically non-conductively attached to the load beam with non-conductive adhesive, the second ends are each respectively electrically non-conductively attached to the mount plate with non-conductive adhesive. 14. The head stack assembly of claim 10 wherein the first and second bottom electrodes are disposed between the load beam and the mount plate without being in electrical contact with the load beam and the mount plate. 15. The head stack assembly of claim 10 further includes a slider supported by the load beam and a flex circuit assembly with a head trace segment disposed along the load beam in electrical communication with the slider. 16. The head stack assembly of claim 15 wherein the flex circuit segment is integrally formed with the flex circuit assembly. 17. The head stack assembly of claim 10 wherein the flex circuit segment includes first, second, and third traces electrically connected to the first and second piezoelectric microactuators. 18. The head stack assembly of claim 17 wherein the first trace is electrically connected to the first top electrode, the second trace is electrically connected to the second top electrode and the first bottom electrode, the third trace is electrically connected to the second bottom electrode. 19. A disk drive comprising: a disk drive base; and a head stack assembly rotatably coupled to the disk drive base, the head stack assembly including an actuator arm and a suspension assembly attached to the actuator arm, the suspension assembly including: a load beam; a mount plate coupled to the actuator arm; a first piezoelectric microactuator disposed between the load beam and the mount plate for pivoting the load beam relative to the mount plate, the first piezoelectric microactuator being electrically non-conductively attached to the load beam and the mount plate for electrically isolating the first piezoelectric microactuator from the load beam and the mount plate, the first piezoelectric microactuator including a first piezoelectric element, a first top electrode disposed upon the first piezoelectric element, and a first bottom electrode disposed upon the first piezoelectric element opposite the first top electrode; a second piezoelectric microactuator disposed between the load beam and the mount plate for pivoting the load beam relative to the mount plate, the second piezoelectric microactuator being electrically non-conductively attached to the load beam and the mount plate for electrically isolating the second piezoelectric microactuator from the load beam and the mount plate, the second piezoelectric microactuator including a second piezoelectric element, a second top electrode disposed upon the second piezoelectric element, and a second bottom electrode disposed upon the second piezoelectric element opposite the second top electrode; and the first and second piezoelectric microactuators being at least partially enclosed by a folded flex circuit segment, the flex circuit segment being in electrical communication with the first top electrode, the first bottom electrode, the second top electrode, and the second bottom electrode. 20. The disk drive of claim 19 wherein the first and second piezoelectric microactuators are electrically non-conductively attached to the load beam and the mount plate with non-conductive adhesive. 21. The disk drive of claim 19 wherein the first and second piezoelectric elements each have opposing first and second ends, the first ends are each respectively electrically non-conductively attached to the load beam, the second ends are each respectively electrically non-conductively attached to the mount plate. 22. The disk drive of claim 21 wherein the first ends are each respectively electrically non-conductively attached to the load beam with non-conductive adhesive, the second ends are each respectively electrically non-conductively attached to the mount plate with non-conductive adhesive. 23. The disk drive of claim 19 wherein the first and second bottom electrodes are disposed between the load beam and the mount plate without being in electrical contact with the load beam and the mount plate. 24. The disk drive of claim 19 wherein the head stack assembly further includes a slider supported by the load beam, the head stack assembly further includes a flex circuit assembly with a head trace segment disposed along the load beam in electrical communication with the slider. 25. The disk drive of claim 24 wherein the flex circuit segment is integrally formed with the flex circuit assembly. 26. The disk drive of claim 19 wherein the flex circuit segment includes first, second, and third traces electrically connected to the first and second piezoelectric microactuators. 27. The disk drive of claim 26 wherein the first trace is electrically connected to the first top electrode, the second trace is electrically connected to the second top electrode and the first bottom electrode, the third trace is electrically connected to the second bottom electrode.