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Cooling system for electronic devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28F-007/00
  • F28D-015/00
출원번호 US-0298061 (2005-12-10)
등록번호 US-7286355 (2007-10-23)
발명자 / 주소
  • Cheon,Kioan
출원인 / 주소
  • Cheon,Kioan
인용정보 피인용 횟수 : 46  인용 특허 : 8

초록

A plurality of pouch bodies (14, 16, 18) are supported side-by-side from an assembly that includes a manifold block (26). The manifold block (26) includes an inlet manifold (28) and an outlet manifold (30). A liquid coolant (e.g. water) is delivered into the inlet manifold (28) via an inlet fitting

대표청구항

What is claimed is: 1. A cooling system, comprising: a first pouch body formed of sheet material that is deformable, said first pouch body having first and second ends, an inlet for a cooling fluid at the first end and an outlet for the cooling fluid at the second end; a second pouch body formed of

이 특허에 인용된 특허 (8)

  1. Mizzi John V. (Poughkeepsie NY), Close card cooling method.
  2. Moribe Makoto,JPX ; Goto Hironobu,JPX ; Yoshida Kazuki,JPX, Cooling arrangement comprising for a heat source a heat sink movable on an external sink.
  3. Hiroshi Nakamura JP, Electronic apparatus having heat sink for cooling heat generating component.
  4. Rumbut ; Jr. John T., Environmentally controlled circuit pack and cabinet.
  5. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL) Guzowski Lawrence (Tolland CT) Samarov Victor M. (Carlisle MA), Light source cooler for LCD monitor.
  6. McClary, Charles R., Methods and apparatus for conductive cooling of electronic units.
  7. Shannon, Jr., John K., Telescopically adjustable battery holddown.
  8. Danielson Richard D. (Hastings MN) Hesselroth David A. (St. Paul Park MN) Stein ; Jr. Ralph J. (So. St. Paul MN), Thermal transfer bag.

이 특허를 인용한 특허 (46)

  1. Rau, Timothy; Simon, Glenn C., Cold plate having blades that interleave with memory modules.
  2. Hughes, Phillip N.; Lipps, Robert J., Contact cooled electronic enclosure.
  3. Chen, Tsung-Yuan, Container data center.
  4. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system based on projected conditions.
  5. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system based on projected conditions.
  6. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system for reduced energy consumption.
  7. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system for reduced energy consumption.
  8. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  9. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  10. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  11. Chainer, Timothy J.; Gaynes, Michael A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Schultz, Mark D.; Simco, Daniel P.; Steinke, Mark E., Cooled electronic system with thermal spreaders coupling electronics cards to cold rails.
  12. Schaltz, Torben Søgaard; Hunskjær, Jan; Henriksen, Kim, Cooling plate row for in-line memory.
  13. Lipp, Robert J.; Hughes, Phillip P., Cooling system for contact cooled electronic modules.
  14. Chainer, Timothy J.; Coico, Patrick A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Directly connected heat exchanger tube section and coolant-cooled structure.
  15. Chainer, Timothy J.; Coico, Patrick A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Directly connected heat exchanger tube section and coolant-cooled structure.
  16. Chainer, Timothy J.; David, Milnes P.; Iyengar, Madhusudan K.; Parida, Pritish R.; Schmidt, Roger R.; Schultz, Mark D., Dynamically limiting energy consumed by cooling apparatus.
  17. Chainer, Timothy J.; David, Milnes P.; Iyengar, Madhusudan K.; Parida, Pritish R.; Schmidt, Roger R.; Schultz, Mark D., Dynamically limiting energy consumed by cooling apparatus.
  18. Andre, Bartley K.; Hopkinson, Ron Alan; Silvanto, Mikael; Yap, Derek, Electronic device.
  19. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  20. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  21. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  22. Eagle, Jason R., Fluid cooling system and associated fitting assembly for electronic component.
  23. Eagle, Jason R., Fluid cooling system and associated fitting assembly for electronic component.
  24. Zheng, Dong-Bo; Fu, Meng; Chen, Chun-Chi, Heat dissipation device for memory module cards.
  25. Chou, Chia-Hsing; Tsai, Chih-Wei; Lu, Chia-Hung, Heat-dissipating mechanism for use with memory module.
  26. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Rizzolo, Michael R.; Simons, Robert E., Liquid-cooled electronics apparatus and methods of fabrication.
  27. Meijer, Gerhard I.; Schmidt, Derek I.; Steinke, Mark E.; Womble, James S., Liquid-cooled memory system having one cooling pipe per pair of DIMMs.
  28. Barina, Richard M.; Kamath, Vinod; Ni, Chunjian; Schmidt, Derek I.; Steinke, Mark E.; Womble, James S., Liquid-cooling memory modules with liquid flow pipes between memory module sockets.
  29. Chou, Chun-Hung; Fang, Chih-Liang, Memory heater and heating aid arrangement.
  30. Chainer, Timothy J.; Gaynes, Michael A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Schultz, Mark D.; Simco, Daniel P.; Steinke, Mark E., Method of fabricating a cooled electronic system.
  31. Goth, Gary F.; Krug, Jr., Francis R.; Mullady, Robert K.; Vandeventer, Allan C.; Zoodsma, Randy J., Modular pumping unit(s) facilitating cooling of electronic system(s).
  32. Mulcahy, Gary; Icoz, Tunc, Modular scalable liquid cooled power system.
  33. Budai, James, Mother and daughter board configuration to improve current and voltage capabilities of a power instrument.
  34. Goth, Gary F.; Krug, Jr., Francis R.; Mullady, Robert K.; Low, Kevin P.; VanDeventer, Allan C.; Zoodsma, Randy J., Multi-level redundant cooling method for continuous cooling of an electronic system(s).
  35. Goth, Gary F.; Krug, Jr., Francis R.; Mullady, Robert K.; Low, Kevin P.; Vandeventer, Allan C.; Zoodsma, Randy J., Multi-level redundant cooling system for continuous cooling of an electronic system(s).
  36. Peterson, Eric C.; Rubenstein, Brandon; Chia, Vic Hong, Printed circuit board cooling assembly.
  37. Morin, James, Process and apparatus for cooling a metal part during a welding operation.
  38. Icoz, Tunc; Santini, John; Mulcahy, Gary; Feely, James, Sealed enclosure for power electronics incorporating a heat exchanger.
  39. Berk, Todd; Eriksen, Andre S., Server memory cooling apparatus.
  40. Berk, Todd; Eriksen, Andre S., Server memory cooling apparatus.
  41. Schaltz, Torben Søgaard; Hunskjær, Jan; Henriksen, Kim, Set of cooling plate rows for in-line memory.
  42. Schaltz, Torben Søgaard; Hunskjær, Jan; Henriksen, Kim, Single ended cooling module rows and assemblies for thermal management of in-line memory modules.
  43. Iyengar, Madhusudan K.; Kamath, Vinod; Mahaney, Jr., Howard V.; Matteson, Jason A.; Steinke, Mark E., System for cooling memory modules.
  44. David, Milnes P.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Parida, Pritish R.; Schmidt, Roger R.; Steinke, Mark E., Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s).
  45. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
  46. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
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