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Use of thermally conductive vias to extract heat from microelectronic chips and method of manufacturing

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28F-007/00
  • H01L-023/34
출원번호 US-0842731 (2004-05-11)
등록번호 US-7286359 (2007-10-23)
발명자 / 주소
  • Khbeis,Michael
  • Metze,George
  • Goldsman,Neil
  • Akturk,Akin
출원인 / 주소
  • The U.S. Government as represented by the National Security Agency
대리인 / 주소
    Arent Fox LLP
인용정보 피인용 횟수 : 10  인용 특허 : 37

초록

A cooling device for a microcircuit provides a direct path of thermal extraction from a high heat producing area to a cooler area. A thermal insulation layer is formed on a body having at least one component thereon that generates the high heat producing area. At least one via is formed through an e

대표청구항

What is claimed is: 1. A cooling device for a microcircuit, comprising: a substrate; a thermal insulation layer formed on the substrate; at least one microelectronic device disposed between the substrate and the thermal insulation layer, wherein the at least one microelectronic device has at least

이 특허에 인용된 특허 (37)

  1. Barrett Joseph C., Apparatus for dissipating heat from a conductive layer in a circuit board.
  2. Caldwell, Barry, BGA heat ball plate spreader, BGA to PCB plate interface.
  3. Maheshwari Abhay ; Thomas Sunil, Backside encapsulation of tape automated bonding device.
  4. Castro Abram M., Ball grid substrate for lead-on-chip semiconductor package.
  5. Castro, Abram M., Ball grid substrate for lead-on-chip semiconductor package.
  6. Dibene ; II Joseph T. ; Wang Gang ; Muller P. Keith, Centralized cooling interconnect for electronic packages.
  7. Chao-Fan Chu Richard (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Goth Gary F. (Pleasant Valley NY) Simons Robert E. (Poughkeepsie NY) Zumbrunnen Michael L. (Poughkeepsie NY), Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels.
  8. Peugh Darrel Eugene ; Berndt Joanna Christine ; Myers Bruce Alan, Flip chip on circuit board with enhanced heat dissipation and method therefor.
  9. Mertol Atila, Grid array device package including advanced heat transfer mechanisms.
  10. Lin, Arthur K.; Anderson, Robert A.; Singh, Kuljeet, Grounding of package substrates.
  11. Huang, Chien-Ping; Her, Tzong-Dar, Heat dissipation ball grid array package.
  12. Crawford Robert K. (Palo Alto) Leibovitz Jacques (San Jose) Miller Daniel J. (San Francisco) Chen Kim H. (Fremont CA), Heat pipe-electrical interconnect integration method for chip modules.
  13. Dong-Hyuk Ju, Heat removal by removal of buried oxide in isolation areas.
  14. Efland Taylor R. ; Summerlin R. Travis ; Devore Joseph A., Heat spreader.
  15. Ma Qing ; Varner Lise ; Fujimoto Harry, Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units.
  16. William A. Hagerup, High speed differential attenuator using a low temperature co-fired ceramic substrate.
  17. Eiles, Travis M.; Paniccia, Mario J., Integrated circuit device having an embedded heat slug.
  18. Utagikar, Ajit; Chong, Num-Kwee, Integrated circuit package with an IC chip and pads that dissipate heat away from the chip.
  19. William A. Hagerup, Low temperature co-fired ceramic substrate structure having a capacitor and thermally conductive via.
  20. Israel Dubin ; Charles M. Erwin, Method and apparatus for heat dispersion from the bottom side of integrated circuit packages on printed circuit boards.
  21. Edwards Christopher Francis ; Meeks Ellen ; Kee Robert ; McCarty Kevin, Method and apparatus for heat extraction by controlled spray cooling.
  22. William R. Tonti ; Steven H. Voldman, Method for improved passive thermal flow in silicon on insulator devices.
  23. Chow Seng Guan SG; John Briar SG; Loreto Y. Cantillep SG, Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages.
  24. Chobot Ivan I. (Whitby NY CAX) Covert John A. (Binghamton NY) Haight Randy L. (Waverly NY) Mansfield Keith D. (New Milford PA) Miller Donald W. (Newark Valley NY) Neira Reinaldo A. (Endicott NY) Petr, Methods of forming electronic multi-layer printed circuit boards and/or cards and electronic packages including said boa.
  25. Masud Beroz, Methods of making a connection component using a removable layer.
  26. Kenji Koya JP, Multilayer printed wiring board provided with injection hole for thermally conductive filler.
  27. Ionescu, Adrian C.; Howard, Philip Earl, Pixel structure and an associated method of fabricating the same.
  28. Platt Richard, Printed circuit board with embedded integrated circuit.
  29. Schulte Donald W. ; Ghozeil Adam L, Resistor array with position dependent heat dissipation.
  30. Kramer, Allen Nicholas; Berg, Mark, Selective PCB via location to enhance cooling.
  31. Kazuhiro Mochizuki JP; Tohru Oka JP; Isao Ohbu JP; Kiichi Yamashita JP, Semiconductor device and method of producing the same.
  32. Ding, Yi-Chuan; Lee, Chang-Chi; Chen, Kun-Ching; Yeh, Yung-I, Thermal enhanced ball grid array package.
  33. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Thermal spreader and interface assembly for heat generating component of an electronic device.
  34. Barrow, Michael, Thermal spreading enhancements for motherboards using PBGAs.
  35. Deeter, Timothy L.; Marieb, Thomas; Murray, Daniel; Pantuso, Daniel; Sista, Sarangapani, Thermally coupling electrically decoupling cooling device for integrated circuits.
  36. Ghoshal, Uttam Shyamalindu, Thermoelectric spot coolers for RF and microwave communication integrated circuits.
  37. Pollard ; II Lloyd, Transient cooling augmentation for electronic components.

이 특허를 인용한 특허 (10)

  1. Gambino, Jeffrey P.; Graf, Richard S.; Mandal, Sudeep; Ventrone, Sebastian T., Cooling apparatus for an integrated circuit.
  2. Konchady, Manohar S.; Roy, Mihir K., Heat dissipation device embedded within a microelectronic die.
  3. Gambino, Jeffrey P.; Graf, Richard S.; Mandal, Sudeep; Ventrone, Sebastian T., Integrated circuit cooling apparatus.
  4. Venugopal, Archana; Cook, Benjamin Stassen; Colombo, Luigi; Doering, Robert Reid, Interconnect via with grown graphitic material.
  5. Thiagarajan, Prabhu; McElhinney, Mark; Helmrich, Jason; Lapinski, Feliks, Method and system for a laser diode bar array assembly.
  6. Krämer, Tomas, Semiconductor device with heat removal structure and related production method.
  7. Kim, Deok kee; Li, Wai Kin; Yang, Haining Sam, Thermal energy removal structure and method.
  8. Bodenweber, Paul F.; Davis, Taryn J.; Interrante, Marcus E.; Lian, Chenzhou; Marston, Kenneth C.; Rivera, Kathryn C.; Sikka, Kamal K.; Toy, Hilton T., Thermal hot spot cooling for semiconductor devices.
  9. Razeeb, Kafil M.; Roy, Saibal; Rohan, James Francis; Nagle, Lorraine Christine, Thermal interface material.
  10. Ferru, Gilles, Thermal isolation of electronic devices in submount used for LEDs lighting applications.
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