초록 ▼

Disclosed herein is a light module comprising a substrate, at least one light-emitting element on the substrate, a sealing cap on the substrate and covering the light-emitting elements, and a fluid in the space formed among the sealing cap, the light-emitting elements, and the substrate, such that h

Disclosed herein is a light module comprising a substrate, at least one light-emitting element on the substrate, a sealing cap on the substrate and covering the light-emitting elements, and a fluid in the space formed among the sealing cap, the light-emitting elements, and the substrate, such that heat dissipation is fast and yellowing of the encapsulating material is retarded.

대표청구항 ▼

What is claimed is: 1. A light module, comprising: a substrate; at least one light-emitting element on the substrate; a sealing cap on the substrate and covering the light-emitting elements; and a fluid in a space formed among the sealing cap, the light-emitting elements, and the substrate, wherein

What is claimed is: 1. A light module, comprising: a substrate; at least one light-emitting element on the substrate; a sealing cap on the substrate and covering the light-emitting elements; and a fluid in a space formed among the sealing cap, the light-emitting elements, and the substrate, wherein the fluid further comprises wavelength-converting material particles, diffuser particles, or anti-UV agents. 2. The light module of claim 1, wherein the light module comprises a plurality of light-emitting elements on the substrate and the light-emitting elements are light-emitting diode chips electrically connected to each other. 3. The light module of claim 2, wherein the light-emitting diode chips comprise a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. 4. The light module of claim 1, wherein the light module comprises a plurality of light-emitting elements on the substrate and the light-emitting elements are light-emitting diode package bodies electrically connected to each other. 5. The light module of claim 4, wherein the light-emitting diode package bodies comprise a red light-emitting diode package body, a green light-emitting diode package body, and a blue light-emitting diode package body. 6. The light module of claim 1, wherein the fluid comprises a transparent fluid having properties of heat resistance and light resistance. 7. The light module of claim 6, wherein the fluid comprises silicone oil. 8. The light module of claim 1, wherein the substrate has heat conductivity. 9. The light module of claim 1, wherein the sealing cap comprises transparent material. 10. The light module of claim 1, wherein the sealing cap comprises a single material layer or a composite material layer formed from one or more selected from the group consisting of silica gel, glass, ceramics, epoxy resin, polyimide, and B-staged bisbenzocyclobutene polymer. 11. The light module of claim 1, wherein the substrate has a recess, and the light-emitting element is positioned on the recess. 12. The light module of claim 4, wherein the light-emitting package bodies each have a capsulation material layer. 13. The light module of claim 12, wherein the capsulation material layer comprises a single material layer or a composite material layer formed from one or more selected from the group consisting of silica gel, glass, ceramics, epoxy resin, polyimide, and B-staged bisbenzocyclobutene polymer. 14. A light module, comprising: a substrate; a plurality of light-emitting diode package bodies on the substrate, wherein the light-emitting diode package bodies are electrically connected to each other; a sealing cap on the substrate and covering the light-emitting elements; and a fluid in a space formed among the sealing cap, the light-emitting elements, and the substrate. 15. The light module of claim 14, wherein the light-emitting diode package bodies comprise a red light-emitting diode package body, a green light-emitting diode package body, and a blue light-emitting diode package body. 16. The light module of claim 14, wherein the fluid comprises a transparent fluid having properties of heat resistance and light resistance. 17. A light module, comprising: a substrate; a plurality of light-emitting elements on the substrate and the light-emitting elements are light-emitting diode package bodies electrically connected to each other; a sealing cap on the substrate and covering the light-emitting elements; and a fluid in a space formed among the sealing cap, the light-emitting elements, and the substrate, wherein the substrate has a recess, and the light-emitting element is positioned on the recess.