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Thermal solution for portable electronic devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0176596 (2005-07-07)
등록번호 US-7292441 (2007-11-06)
발명자 / 주소
  • Smalc,Martin David
  • Shives,Gary D.
  • Reynolds, III,Robert Anderson
출원인 / 주소
  • Advanced Energy Technology Inc.
대리인 / 주소
    Waddey & Patterson
인용정보 피인용 횟수 : 36  인용 특허 : 19

초록

A thermal solution for a portable electronic device, which is positioned between a heat source and another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the second component from the heat generated by the heat source.

대표청구항

What is claimed is: 1. A thermal dissipation and shielding system for a cell phone, comprising: a cell phone comprising a first component which comprises a heat source and a second component to which the first component transmits heat; a thermal solution interposed between the first component and t

이 특허에 인용된 특허 (19)

  1. Tracy Mark S. ; Nguyen Minh H ; Progl Curtis L., Apparatus, method and system for thermal management of a semiconductor device.
  2. Bien Jonathan S., Combined cosmetics compact and cellular radiotelephone.
  3. Suzuki Masahiro,JPX, Cooling system for electronic packages.
  4. Mercuri Robert Angelo ; Capp Joseph Paul ; Gough Jeffrey John, Flexible graphite composite.
  5. Tzeng Jing-Wen ; Getz ; Jr. George ; Weber Thomas William, Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner.
  6. Richey ; III Joseph B., Flexible heat transfer device and method.
  7. Norley, Julian; Tzeng, Jing-Wen; Klug, Jeremy, Graphite-based heat sink.
  8. Voorhes David W. (Winchester MA) Goldman Richard D. (Stoughton MA) Lopez Robert R. (Boxford MA), Heat sink.
  9. Kobayashi Takashi,JPX ; Nonaka Takashi,JPX, Heat sink assembly including flexible heat spreader sheet.
  10. Arnold Judson V. ; Peoples James R. ; McKague Elbert L., High heat density transfer device.
  11. Fujiwara, Norio; Fukukawa, Yoshihiro, Information processing apparatus.
  12. Greinke Ronald A. (Medina OH) Mercuri Robert A. (Seven Hills OH) Beck Edgar J. (Fairview Park OH), Intercalation of graphite.
  13. Charlier Michael L. (Arlington Heights IL), Keypad apparatus.
  14. Sauzade Jean-Denis (Juan Les Pins FRX) L\Hote Manuel (Vence FRX), Mounting for printed circuits forming a heat sink with controlled expansion.
  15. Smalc, Martin D., Radial finned heat sink.
  16. Banks Bruce A. (Olmsted Township ; Cuyahoga County OH) Gaier James R. (Strongsville OH), Semiconductor cooling apparatus.
  17. Fujiwara Norio,JPX ; Akiba Yasuhiro,JPX ; Watanabe Tetsuyuki,JPX ; Nishiki Naomi,JPX, Thermal conductive unit and thermal connection structure using the same.
  18. Jing Wen Tzeng, Thermal management system.
  19. Bergerson Steven E., Thermally conductive filled polymer composites for mounting electronic devices and method of application.

이 특허를 인용한 특허 (36)

  1. Yu, Michelle; Lee, Ji Heun; Hayashida, Jeffrey, Apparatus related to a structure of a base portion of a computing device.
  2. Yu, Michelle; Lee, Ji Heun; Hayashida, Jeffrey, Apparatus related to a structure of a base portion of a computing device.
  3. Hill, Richard F.; Riaz, Shahi, Assemblies and methods for dissipating heat from handheld electronic devices.
  4. Hill, Richard F.; Riaz, Shahi, Assemblies and methods for dissipating heat from handheld electronic devices.
  5. Hill, Richard F.; Smythe, Robert Michael, Compliant multilayered thermally-conductive interface assemblies.
  6. Hayashida, Jeffrey, Computing device with heat spreader.
  7. Huang, Kung-Shiuh; Huang, Kuan-Tsae; Wu, June, Configurable heat conducting path for portable electronic device.
  8. Rugg, William L., Dissipating heat during device operation.
  9. Rugg, William L., Dissipating heat during device operation.
  10. Huang, Kung Shiuh; Huang, Kuan-Tsae; Wu, June, Dynamic heat conducting path for portable electronic device.
  11. Pierce, Amber M.; Bowers, Morris B.; Cole, Adam R.; Thiruppukuzhi, Srikanth V., Electronic device assembly with compression gasket.
  12. Fourie, Daniel, Graphite layer between carbon layers.
  13. Hwang, Ching-Bai; Meng, Jin-Gong; Liang, Cheng-Jen, Heat dissipation device and computer using same.
  14. Cavallaro, Alberto R.; Pais, Martin R., Heat management structure for a wearable electronic device and method for manufacturing same.
  15. Inoue, Masayuki, Information processing apparatus.
  16. Ichikawa, Yohei, Key sheet, press switch and electronic device provided with the press switch.
  17. Wahler, Ronald A.; Strandquist, Jack; Trotter, Donald J., Line replaceable unit with universal heat sink receptacle.
  18. Barnes, Philip Lionel; Chin, Hon Wah; Davidson, Howard Lee; Hallman, Kimberly D. A.; Hyde, Roderick A.; Ishikawa, Muriel Y.; Kare, Jordin T.; Lee, Brian; Lord, Richard T.; Lord, Robert W.; Mundie, Craig J.; Myhrvold, Nathan P.; Pasch, Nicholas F.; Rudder, Eric D.; Tegreene, Clarence T.; Tremblay, Marc; Tuckerman, David B.; Whitmer, Charles; Wood, Jr., Lowell L., Management of exterior temperatures encountered by user of a portable electronic device.
  19. Barnes, Philip Lionel; Chin, Hon Wah; Davidson, Howard Lee; Hallman, Kimberly D. A.; Hyde, Roderick A.; Ishikawa, Muriel Y.; Kare, Jordin T.; Lee, Brian; Lord, Richard T.; Lord, Robert W.; Mundie, Craig J.; Myhrvold, Nathan P.; Pasch, Nicholas F.; Rudder, Eric D.; Tegreene, Clarence T.; Tremblay, Marc; Tuckerman, David B.; Whitmer, Charles; Wood, Jr., Lowell L., Management of exterior temperatures encountered by user of a portable electronic device in response to an inferred user contact with the portable electronic device.
  20. Barnes, Philip Lionel; Chin, Hon Wah; Davidson, Howard Lee; Hallman, Kimberly D. A.; Hyde, Roderick A.; Ishikawa, Muriel Y.; Kare, Jordin T.; Lee, Brian; Lord, Richard T.; Lord, Robert W.; Mundie, Craig J.; Myhrvold, Nathan P.; Pasch, Nicholas F.; Rudder, Eric D.; Tegreene, Clarence T.; Tremblay, Marc; Tuckerman, David B.; Whitmer, Charles; Wood, Jr., Lowell L., Management of exterior temperatures encountered by user of a portable electronic device in response to an inferred user contact with the portable electronic device.
  21. Barnes, Philip Lionel; Chin, Hon Wah; Davidson, Howard Lee; Hallman, Kimberly D.A.; Hyde, Roderick A.; Ishikawa, Muriel Y.; Kare, Jordin T.; Lee, Brian; Lord, Richard T.; Lord, Robert W.; Mundie, Craig J.; Myhrvold, Nathan P.; Pasch, Nicholas F.; Rudder, Eric D.; Tegreene, Clarence T.; Tremblay, Marc; Tuckerman, David B.; Whitmer, Charles; Wood, Jr., Lowell L., Management of exterior temperatures encountered by user of a portable electronic device using multiple heat-rejection elements.
  22. Hill, Richard F.; Smythe, Robert Michael, Memory modules including compliant multilayered thermally-conductive interface assemblies.
  23. Reis, Bradley E.; Reynolds, III, Robert Anderson; Petroski, James T.; Xiong, Yin, Method for reducing temperature-caused degradation in the performance of a digital reader.
  24. Rich, David Gerard; Brubacher, Jonathan Quinn; Ignor, Matthew Michael, Methods and apparatus for detecting unauthorized batteries or tampering by monitoring a thermal profile.
  25. Rich, David Gerard; Sutarwala, Taha Shabbir Husain; Wu, Chee-Ming Jimmy, Mobile electronic device having a fuel cell surrounded by a solid-state battery.
  26. Wadley, Haydn N. G.; Haj-Hariri, Hossein; Zok, Frank; Norris, Pamela M., Multifunctional thermal management system and related method.
  27. Huang, Yi Chang; Lin, Yao Chung, Portable electronic apparatus.
  28. Huang, Yi-Chang; Lin, Yao-Chung, Portable electronic apparatus.
  29. Huang, Yi-Chang; Lin, Yao-Chung, Portable electronic device.
  30. Zhamu, Aruna; Xiong, Wei; Jang, Bor Z., Process for unitary graphene layer or graphene single crystal.
  31. Minamio, Masanori; Ujihara, Daisuke; Wada, Hiroshi, Resin-diamagnetic material composite structure.
  32. Han, Qian, Support frame with integrated thermal management features.
  33. Zhamu, Aruna; Wang, Mingchao; Xiong, Wei; Jang, Bor Z., Thermal management system containing an integrated graphene film for electronic devices.
  34. Wayne, Ryan J.; Taylor, Jonathan Andrew; Norley, Julian; Reis, Bradley E.; Pollock, Mark; McCallum, Ian Andrew; Weber, Thomas W.; Reynolds, III, Robert A.; Smalc, Martin David; Fishman, Elliot G., Thermal solution for prismatic lithium ion battery pack.
  35. Chen, Ko-Chun; Lin, Chiu-Lang, Use of a graphite heat-dissipation device including a plating metal layer.
  36. Chen, Ko-Chun; Lin, Chiu-Lang, Use of a graphite heat-dissipation device including a plating metal layer.
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