Optical interface assembly and method of formation
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G02B-006/30
G02B-006/36
출원번호
US-0020520
(2004-12-22)
등록번호
US-7292756
(2007-11-06)
발명자
/ 주소
Moynihan,Matthew L.
Sicard,Bruno M.
Colangelo,Carl J.
Cahalen,John P.
Amos,Brian D.
Horgan,Kevin S.
Fisher,John J.
Sherrer,David W.
출원인 / 주소
Rohm and Haas Electronics Materials LLC
인용정보
피인용 횟수 :
16인용 특허 :
13
초록▼
Optical interface assemblies are provided. The optical interface assemblies include a first portion having a plurality of optical waveguides. The first portion is configured for mating engagement with an optical fiber connector. A second portion is mated to the first portion. The second portion is
Optical interface assemblies are provided. The optical interface assemblies include a first portion having a plurality of optical waveguides. The first portion is configured for mating engagement with an optical fiber connector. A second portion is mated to the first portion. The second portion is configured for mating engagement with an electronic substrate that includes an embedded waveguide assembly. The first and second portions are further configured so as to align the plurality of optical waveguides, at a first end of the first portion, with a plurality of corresponding waveguide cores of the embedded waveguide assembly. The first and second portions are further configured so as to align the plurality of optical waveguides, at a second end of the first portion, with a plurality of corresponding optical fibers in the optical fiber connector. Also provided are electronic assemblies and methods for coupling optical fibers with electronic substrate embedded waveguides.
대표청구항▼
What is claimed is: 1. An optical interface assembly, comprising: a first portion comprising a plurality of optical waveguides, said first portion being configured for mating engagement with an optical fiber connector; and a second portion, mated to said first portion, said second portion configure
What is claimed is: 1. An optical interface assembly, comprising: a first portion comprising a plurality of optical waveguides, said first portion being configured for mating engagement with an optical fiber connector; and a second portion, mated to said first portion, said second portion configured for mating engagement with an electronic substrate that comprises an embedded waveguide assembly; wherein said first and second portions are further configured so as to align said plurality of optical waveguides, at a first end of said first portion, with a plurality of corresponding waveguide cores of said embedded waveguide assembly, and wherein said first and second portions are further configured so as to align said plurality of optical waveguides, at a second end of said first portion, with a plurality of corresponding optical fibers in said optical fiber connector, wherein said plurality of optical waveguides terminate at said first end of said first portion. 2. The optical interface assembly of claim 1, wherein said plurality of optical waveguides comprise a plurality of optical fibers. 3. The optical interface assembly of claim 1, wherein said first portion further comprises; a base member comprising a plurality of fiber grooves formed therein, said base member further comprising one or more female connection features formed therein; and a top member covering said base member, said top member and said base member having said plurality of optical fibers disposed therebetween. 4. The optical interface assembly of claim 3, wherein: said base member and said top member are formed from a silicon substrate; and said fiber grooves comprise V-shaped grooves. 5. The optical interface assembly of claim 3, wherein said base member and said top member are formed from a molded plastic material. 6. The optical interface assembly of claim 3, wherein said top member of said first portion comprises a pair of flanges defined along outer edges thereof so as to accommodate said second portion. 7. The optical interface assembly of claim 6, wherein said second portion member further comprises a pair of prongs for engaging with said pair of flanges. 8. The optical interface assembly of claim 3, wherein: said second portion further comprises at least one male or female connection feature formed on or in a bottom surface thereof for connecting to a female or male connection feature, respectively, of the electronic substrate. 9. The optical interface assembly of claim 2, wherein said first portion further comprises: a base member comprising a plurality of fiber grooves formed therein, said base member further comprising one or more female alignment features formed therein; a plurality of optical fibers disposed within said plurality of fiber grooves; one or more male alignment features disposed within said one or more female alignment features; and a lid member covering said plurality of optical fibers. 10. The optical interface assembly of claim 9, wherein said second portion further comprises a top member covering said lid member and said one or more male and female alignment features. 11. The optical interface assembly of claim 10, wherein: said base member, said lid member and said top member are formed from a silicon substrate; and said fiber grooves comprise V-shaped grooves. 12. The optical interface assembly of claim 10, wherein said base member, said lid member and said top member are formed from a molded plastic material. 13. The optical interface assembly of claim 3, wherein: said second portion further comprises at least one male or female connection feature formed on or in a bottom surface thereof for connecting to a female or male connection feature, respectively, of the electronic substrate. 14. An electronic assembly, comprising: the optical interface assembly of claim 1; and an electronic substrate comprising an embedded waveguide assembly; wherein said second portion of said optical interface assembly is mated with said electronic substrate such that said plurality of optical waveguides are aligned, at a first end of said first portion, with a plurality of corresponding waveguide cores of said embedded waveguide assembly. 15. The electronic substrate of claim 14, further comprising an optical fiber connector comprising a plurality of optical fibers, wherein said first portion of said optical interface assembly is mated with said optical fiber connector such that said plurality of optical waveguides are aligned, at a second end of said first portion, with the optical fibers of said optical fiber connector. 16. The electronic substrate of claim 14, wherein said optical fiber connector is an MT connector comprising. 17. The electronic substrate of claim 14, wherein said embedded waveguide assembly comprises: a bottom clad layer disposed over said electronic substrate; a plurality of waveguide core segments formed over said bottom clad layer; and a photoimageable top clad layer formed over said plurality of waveguide core segments and said bottom clad layer; wherein at least one of said waveguide core segments is configured for passive alignment of said plurality of optical waveguides with said plurality of corresponding waveguide cores. 18. The electronic substrate of claim 14, wherein: said second portion further comprises at least one female or male connection feature formed in or on a bottom surface thereof; and said electronic substrate comprises at least one male or female connection feature formed thereon; wherein the optical interface assembly is secured to said electronic substrate through mating of said at least one female or male connection feature of said second portion with said at least one male or female connection feature of said electronic substrate. 19. The electronic substrate of claim 14, wherein said electronic substrate comprises an printed wiring board. 20. A method for coupling optical fibers with electronic substrate embedded waveguides, the method comprising: forming an optical interface assembly comprising a first portion and a second portion; said first portion comprising a plurality of optical waveguides, said first portion further configured for mating engagement with an optical fiber connector; and said second portion being mated to said first portion, said second portion further configured for mating engagement with an electronic substrate comprising an embedded waveguide assembly; wherein said first and second portions are further configured so as to align said plurality at optical fibers, at an end of said first portion, with a plurality of corresponding waveguide cores of said embedded waveguide assembly, wherein said plurality of optical waveguides terminate at said end of said first portion.
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이 특허에 인용된 특허 (13)
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Barwicz, Tymon; Gill, Douglas M.; Green, William M.; Khater, Marwan H.; Vlasov, Yurii A., Material structures for front-end of the line integration of optical polarization splitters and rotators.
Barwicz, Tymon; Gill, Douglas M.; Green, William M.; Khater, Marwan H.; Vlasov, Yurii A., Material structures for front-end of the line integration of optical polarization splitters and rotators.
Brusberg, Lars; Schroeder, Henning, Plug-in fiber coupling unit, fiber coupling system and method for coupling optical fibers to integrated optical waveguides.
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