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In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface adapted to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer, and a second conductive layer co

In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface adapted to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer, and a second conductive layer coupled to the intermediate layer. The second conductive layer may have a plurality of independently electrically biasable zones and is configured to be coupled with a power delivery arrangement. The intermediate layer may contain a polymer material support disk, a backing layer, or combinations thereof. Generally, the first conductive layer, the second conductive layer, and the intermediate layer are adhered or secured together and removable as a unitary replaceable body. In one example, the intermediate layer may contain a plurality of perforations or cannels that have a diameter within a range from about 0.5 mm to about 10 mm.

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What is claimed is: 1. A pad assembly for electro-processing a substrate, comprising: a first conductive layer having a working surface to contact the substrate during a polishing process; an intermediate layer coupled to the first conductive layer; and a second conductive layer coupled to the inte

What is claimed is: 1. A pad assembly for electro-processing a substrate, comprising: a first conductive layer having a working surface to contact the substrate during a polishing process; an intermediate layer coupled to the first conductive layer; and a second conductive layer coupled to the intermediate layer, wherein the second conductive layer has a plurality of independently electrically biasable zones and is configured to be coupled with a power delivery arrangement. 2. The pad assembly of claim 1, wherein the intermediate layer comprises a polymer material support disk, a backing layer, or combinations thereof. 3. The pad assembly of claim 2, wherein the first conductive layer, the second conductive layer, and the intermediate layer are adhered or secured together and removable as a unitary replaceable body. 4. The pad assembly of claim 2, wherein the intermediate layer comprises a plurality of perforations, channels, apertures, or holes. 5. The pad assembly of claim 4, wherein the perforations or the channels have a diameter within a range from about 0.5 mm to about 10 mm. 6. The pad assembly of claim 1, wherein the first conductive layer comprises a dielectric body and at least one conductive element. 7. The pad assembly of claim 4, wherein the dielectric body comprises a polymeric material. 8. The pad assembly of claim 7, wherein the polymeric material is selected from the group consisting of polyurethane, polycarbonate, polyphenylene sulfide, polyethylene, derivates thereof, and combinations thereof. 9. The pad assembly of claim 7, wherein the dielectric body comprises a fluoropolymeric material. 10. The pad assembly of claim 1, wherein the working surface further comprises at least one of grooves, embossment, or other texturing formed therein. 11. The pad assembly of claim 1, wherein the first conductive layer is at least one of permeable to electrolyte or contains perforations. 12. The pad assembly of claim 1, wherein the first conductive layer further comprises a plurality of conductive elements adapted to deliver a current to the working surface. 13. The pad assembly of claim 12, wherein the first conductive layer comprises a dielectric body and a plurality of conductive elements configured to be coupled with the power delivery arrangement. 14. The pad assembly of claim 1, further comprising at least one contact element extending through the pad assembly and adapted to deliver a current to the working surface. 15. The pad assembly of claim 1, wherein the second conductive layer further comprises a plurality of concentric conductive elements. 16. The pad assembly of claim 1, wherein the second conductive layer further comprises conductive elements comprising a material selected from the group consisting of copper, graphite, titanium, platinum, gold, alloys thereof, and combinations thereof. 17. A pad assembly for electro-processing a substrate, comprising: a first conductive layer having a working surface to contact the substrate; a second conductive layer having a plurality of independently electrically biasable zones and is configured to be coupled with a power delivery arrangement; and an intermediate layer between and coupled with the first conductive layer and the second conductive layer, wherein the intermediate layer comprises a polymer material support disk, a backing layer, or combinations thereof. 18. The pad assembly of claim 17, wherein the first conductive layer, the second conductive layer, and the intermediate layer are adhered or secured together and removable as a unitary replaceable body. 19. The pad assembly of claim 17, wherein the intermediate layer comprises a plurality of perforations, channels, apertures, or holes, wherein the perforations or the channels have a diameter within a range from about 0.5 mm to about 10 mm. 20. The pad assembly of claim 17, wherein the first conductive layer comprises a dielectric body and at least one conductive, wherein the dielectric body comprises a polymeric material selected from the group consisting of polyurethane, polycarbonate, polyphenylene sulfide, polyethylene, fluoropolymeric material, derivates thereof, and combinations thereof. 21. The pad assembly of claim 17, wherein the first conductive layer is at least one of permeable to electrolyte or contains perforations. 22. The pad assembly of claim 17, wherein the first conductive layer further comprises a plurality of conductive elements adapted to deliver a current to the working surface. 23. The pad assembly of claim 22, wherein the first conductive layer comprises a dielectric body and a plurality of conductive elements configured to be coupled with the power delivery arrangement. 24. The pad assembly of claim 17, further comprising at least one contact element extending through the pad assembly and adapted to deliver a current to the working surface. 25. The pad assembly of claim 17, wherein the second conductive layer further comprises a plurality of concentric conductive elements. 26. The pad assembly of claim 17, wherein the second conductive layer further comprises conductive elements comprising a material selected from the group consisting of copper, graphite, titanium, platinum, gold, alloys thereof, and combinations thereof. 27. A pad assembly for electro-processing a substrate, comprising: a first conductive layer having a working surface to contact the substrate by a plurality of conductive elements; a second conductive layer having a plurality of independently electrically biasable zones and is configured to be coupled with a power delivery arrangement; and an intermediate layer between and coupled with the first conductive layer and the second conductive layer, wherein the intermediate layer further comprises a plurality of perforations, channels, apertures, or holes.