초록 ▼

An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wh

An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wherein the portion of the workpiece to be processed and possibly the paddle is selectively immersed within the processing fluid. In accordance with a further independent aspect of the present invention, a paddle is provided for use proximate to a workpiece in a workpiece processing station. The paddle includes a one or more sets of delivery ports and one or more sets of fluid recovery ports. In at least one embodiment, the paddle provides for agitation of a processing fluid proximate to the surface of the workpiece. In at least another embodiment, the paddle provides for the delivery and/or recovery of one or more fluids to the portion of the workpiece to be processed. One aspect of the present invention enables the fluids supplied to the workpiece by the paddle to be limited to the space located between the workpiece and the paddle, thus avoiding mixing of these fluids with the processing fluid located within the bowl assembly not supplied by the paddle.

대표청구항 ▼

What is claimed is: 1. An apparatus for processing a microelectronic workpiece, comprising: a vessel configured to support a processing liquid; a head assembly positioned proximate to the vessel and configured to support a microelectronic workpiece for processing at a process location of the vessel

What is claimed is: 1. An apparatus for processing a microelectronic workpiece, comprising: a vessel configured to support a processing liquid; a head assembly positioned proximate to the vessel and configured to support a microelectronic workpiece for processing at a process location of the vessel; and a paddle assembly having a paddle positioned to move relative to the process location, the paddle having a first fluid aperture in fluid communication with a first fluid channel internal to the paddle, the paddle further having a second fluid aperture in fluid communication with a second fluid channel internal to the paddle, the first and second fluid channels being sealably separated from each other in the paddle assembly. 2. The apparatus of claim 1 wherein the first fluid aperture is configured to deliver fluid to the vessel and wherein the second fluid aperture is configured to retrieve fluid from the vessel. 3. The apparatus of claim 1 wherein the head assembly includes a first electrode positioned to contact the microelectronic workpiece when the head assembly carries the microelectronic workpiece, the first electrode being coupleable to an electrical potential at a first polarity, and wherein the apparatus further comprises a second electrode spaced apart from the first electrode and the paddle assembly, the second electrode being coupleable to an electrical potential at a second polarity opposite the first polarity. 4. The apparatus of claim 1, further comprising: an input/output station configured to receive a plurality of microelectronic workpieces; and a robot positioned between the input/output station to move microelectronic workpieces between the input/output station and the head assembly. 5. The apparatus of claim 1 wherein the paddle is an elongated paddle having a first end and a second end, and wherein the paddle assembly includes: a first paddle support to carry the paddle positioned toward the first end of the paddle; a second paddle support to carry the paddle positioned toward the second end of the paddle; and a drive unit operatively coupled to the paddle to move the paddle relative to the process location. 6. The apparatus of claim 5 wherein the first paddle support includes a first generally cylindrical guide rod and wherein the second paddle support includes a second generally cylindrical guide rod. 7. The apparatus of claim 5 wherein the drive unit includes a first powered portion coupled toward the first end of the paddle, and wherein the drive unit includes a second powered portion coupled toward the second end of the paddle. 8. The apparatus of claim 5 wherein the first paddle support includes a first generally cylindrical guide rod and wherein the second paddle support includes a second generally cylindrical guide rod, and wherein the paddle is slideably carried by the first and second guide rods. 9. The apparatus of claim 5 wherein the drive unit is configured to drive the paddle linearly back and forth relative to the process location. 10. The apparatus of claim 5, further comprising an electrode carried by the head assembly and configured to contact the microelectronic workpiece when the microelectronic workpiece is supported by the head assembly, the electrode being coupleable to an electrical potential. 11. The apparatus of claim 5, further comprising a programmable control system operatively coupled to the drive unit to direct operation of the drive unit. 12. The apparatus of claim 5 wherein the first support member includes a first travel guide and the second support member includes a second travel guide. 13. The apparatus of claim 5 wherein the first support member includes a first travel guide that is slideably received in an aperture of a first connecting assembly connected toward the first end of the paddle, and wherein the second support member includes a second travel guide that is slideably received in an aperture of a second connecting assembly connected toward the second end of the paddle. 14. The apparatus of claim 1 wherein the head assembly is configured to carry a microelectronic workpiece in a generally horizontal orientation for processing and wherein the paddle is positioned below the head assembly. 15. The apparatus of claim 5 wherein the drive unit includes a motor and a belt operatively coupled between the motor and the paddle. 16. The apparatus of claim 1, further comprising: a first electrode carried by the head assembly and configured to contact the microelectronic workpiece when the microelectronic workpiece is supported by the head assembly, the first electrode being coupleable to an electrical potential at a first polarity; and a second electrode spaced apart from the paddle assembly and being coupleable to an electrical potential at a second polarity opposite the first polarity. 17. The apparatus of claim 1 wherein the vessel includes a weir over which the processing liquid flows, the weir defining an exposed surface of the processing liquid in the vessel, the exposed surface having a first width, and wherein the head assembly is positioned over the weir and is movable toward and away from the weir to position the microelectronic workpiece in contact with the exposed liquid surface, the head assembly and the microelectronic workpiece having a second width at the exposed surface that is no greater than the first width. 18. The apparatus of claim 17, further comprising a wall extending upwardly from a position above the weir, the wall having a third width that is no greater than the first width, the head assembly being movable alongside the wall to contact the microelectronic workpiece with the processing liquid. 19. The apparatus of claim 17, further comprising a current thief positioned proximate to the head assembly and the weir to redirect plating material from an outer edge of the microelectronic workpiece. 20. The apparatus of claim 1, further comprising a current thief positioned proximate to the head assembly to redirect plating material from an outer edge of the microelectronic workpiece. 21. An apparatus for processing a microelectronic workpiece, comprising: a vessel configured to support a processing liquid; a head assembly positioned proximate to the vessel and configured to carry a microelectronic workpiece for processing at a process location of the vessel; an elongated paddle having a first end and a second end and being positioned to move relative to the process location, wherein the paddle has at least one fluid delivery port oriented toward the microelectronic workpiece when the microelectronic workpiece is carried by the head assembly, and wherein the paddle further includes at least one fluid recovery port; a first paddle support to carry the paddle positioned toward the first end of the paddle; a second paddle support to carry the paddle positioned toward the second end of the paddle; and a drive unit operatively coupled to the paddle to move the paddle relative to the process location. 22. The apparatus of claim 21, further comprising: an input/output station configured to receive a plurality of microelectronic workpieces; and a robot positioned between the input/output station and the head assembly to move microelectronic workpieces between the input/output station and the head assembly. 23. An apparatus for processing a microelectronic workpiece, comprising: a vessel configured to support a processing liquid; a head assembly positioned proximate to the vessel and configured to carry a microelectronic workpiece in a generally horizontal orientation for processing at a process location of the vessel; a paddle assembly having a paddle positioned to move relative to the process location, wherein the paddle has at least one fluid delivery port oriented toward the microelectronic workpiece when the microelectronic workpiece is carried by the head assembly, and wherein the paddle further includes at least one fluid recovery port; and a drive unit operatively coupled to the paddle to move the paddle relative to the process location. 24. The apparatus of claim 23, further comprising: an input/output station configured to receive a plurality of microelectronic workpieces; and a robot positioned between the input/output station and the head assembly to move microelectronic workpieces between the input/output station and the head assembly. 25. The apparatus of claim 23 wherein the paddle has a first end and a second end, and wherein the apparatus further comprises: a first paddle support to carry the paddle positioned toward the first end of the paddle, the first paddle support including a first generally cylindrical guide rod; and a second paddle support to carry the paddle positioned toward the second end of the paddle, the second paddle support including a second generally cylindrical guide rod. 26. The apparatus of claim 23 wherein the drive unit includes a first powered portion coupled toward a first end of the paddle, and wherein the drive unit includes a second powered portion coupled toward a second end of the paddle. 27. The apparatus of claim 23 wherein the drive unit is configured to drive the paddle linearly back and forth relative to the process location. 28. The apparatus of claim 23, further comprising an electrode carried by the head assembly and configured to contact the microelectronic workpiece when the microelectronic workpiece is supported by the head assembly, the electrode being coupleable to an electrical potential. 29. The apparatus of claim 23, further comprising a programmable control system operatively coupled to the drive unit to direct operation of the drive unit.