IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0247114
(2005-10-11)
|
등록번호 |
US-7297399
(2007-11-20)
|
발명자
/ 주소 |
- Zhang,Jian
- Tonapi,Sandeep Shrikant
- Mills,Ryan Christopher
- Gowda,Arun Virupaksha
|
출원인 / 주소 |
|
인용정보 |
피인용 횟수 :
23 인용 특허 :
8 |
초록
▼
A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is o
A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.
대표청구항
▼
The invention claimed is: 1. A thermal transport structure, comprising: a thermal transport layer comprising a thermally conductive material and having a first surface and a second surface wherein each of the thermal transport layer first surface and second surface are outward-facing surfaces of th
The invention claimed is: 1. A thermal transport structure, comprising: a thermal transport layer comprising a thermally conductive material and having a first surface and a second surface wherein each of the thermal transport layer first surface and second surface are outward-facing surfaces of the thermal transport layer that are configured to contact a heat-generating unit or a heat-dissipating unit, and the thermally conductive material is oriented in a predetermined direction to directionally facilitate heat conduction in a direction substantially perpendicular to the predetermined direction wherein the thermal transport layer comprises a plurality of individual thermally conductive strips of substantially uniform thickness that are disposed in an alternating array with a plurality of individual relatively non-thermally conductive strips of substantially uniform thickness, and at least one of the thermally conductive strips comprises thermal pyrolytic graphite and has no resin layer present between the thermal transport layer first surface and second surface; and a resin layer secured to the thermal transport layer second surface, and the resin layer is relatively less thermally conductive than the thermal transport layer, and wherein the thermal transport layer is one of a plurality of thermal transport layers, and each of the plurality of thermal transport layers has a first surface and a second surface, and in each of the plurality of thermal transport layers the thermally conductive material in each thermally conductive strip is oriented in a determined direction to directionally facilitate heat conduction relative to the determined direction, and the resin layer is one of a plurality of resin layers, and each of the plurality of resin layers is relatively less thermally conductive than any one of the plurality of thermal transport layers; and each of the plurality of the thermal transport layers and each of the plurality of resin layers are arranged alternating to each other. 2. The thermal transport structure as defined in claim 1, wherein the resin layer is a film. 3. The thermal transport structure as defined in claim 1, wherein the thermal transport layer has a thickness in a range of less than about 1000 micrometers. 4. The thermal transport structure as defined in claim 1, wherein the resin layer has a thickness in a range of greater than about 1000 micrometers. 5. The thermal transport structure as defined in claim 1, wherein a bulk resistance of the thermal transport layer having a thickness of about 500 micrometers is less than about 25 mm2-K/w. 6. The thermal transport structure as defined in claim 1, wherein the thermal transport layer and the resin layer form a composite, which is sliced in cross section, and a cross-sectional slice of the composite exposes a first end of the thermal transport layer on a first surface of the slice and a second end of the thermal transport layer on a second surface of the slice, wherein the thermal transport layer is operable to transfer heat directionally perpendicular to a first surface of the slice and a second surface of the slice. 7. The thermal transport structure as defined in claim 6, wherein the slice may have a thickness in a range of less than about 1000 micrometers. 8. The thermal transport structure as defined in claim 6, wherein the slice may have a thickness in a range of less than about 500 micrometers. 9. The thermal transport structure as defined in claim 6, wherein a surface of the slice is modified by etching or sputtering. 10. The thermal transport structure as defined in claim 6, wherein a surface of the slice comprises one or more exposed portions of the thermal transport layer. 11. The thermal transport structure as defined in claim 10, wherein an amount of the surface of the slice that comprises the exposed portions of the thermal transport layer is more than 60 percent of the surface area. 12. The thermal transport structure as defined in claim 1, the resin layer, the thermal transport layer, or both the resin layer and the thermal transport layer are cured. 13. The thermal transport structure as defined in claim 1, the resin layer, the thermal transport layer, or both the resin layer and the thermal transport layer are a film comprising a thermoplastic material or a B-staged resin. 14. The thermal transport structure as defined in claim 1, wherein the thermal transport layer comprises a binder. 15. The thermal transport structure as defined in claim 14, wherein the binder comprises one or more additives. 16. The thermal transport structure as defined in claim 1, wherein the thermally conductive material consists essentially of thermal pyrolytic graphite. 17. The thermal transport structure as defined in claim 1, wherein the resin layer, the thermal transport layer, or both layers comprise a filler. 18. The thermal transport structure as defined in claim 17, wherein the filler comprises one or more of boron, aluminum, copper, nickel, or combinations thereof. 19. The thermal transport structure as defined in claim 17, wherein the filler comprises one or more of an oxide, a nitride, a boride, or combinations thereof. 20. The thermal transport structure as defined in claim 17, wherein the filler is electrically insulative. 21. The thermal transport structure as defined in claim 17, wherein the filler comprises spherical particles. 22. The thermal transport structure as defined in claim 17, wherein the filler comprises particles, each having a length that differs from a width. 23. The thermal transport structure as defined in claim 22, wherein the particles are directionally oriented relative to a plane defined by the thermal transport layer. 24. A pre-formed structure for transporting thermal energy, comprising: a sliced portion having a first surface and a second surface; and one or more discontinuous portions of thermal transport layers that extend from the sliced portion first surface through the sliced portion to the sliced portion second surface; and wherein the one or more discontinuous portions of thermal transport layers transport heat directionally perpendicular to at least one of the sliced portion first or second surfaces.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.