최소 단어 이상 선택하여야 합니다.
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다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
DataON 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Edison 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
|
출원번호 | US-0169926 (2005-06-30) |
등록번호 | US-7301748 (2007-11-27) |
발명자 / 주소 |
|
출원인 / 주소 |
|
인용정보 | 피인용 횟수 : 49 인용 특허 : 373 |
The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module,
The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed.
What is claimed is: 1. An energy conditioning, comprising a G conductive structure, said G conductive structure comprising: a first conductive layer, said first conductive layer having top and bottom major surfaces, a first conductive layer first side edge surface, and a first conductive layer seco
What is claimed is: 1. An energy conditioning, comprising a G conductive structure, said G conductive structure comprising: a first conductive layer, said first conductive layer having top and bottom major surfaces, a first conductive layer first side edge surface, and a first conductive layer second side edge surface; a second conductive layer above said first conductive layer, said second conductive layer having a second conductive layer first side edge surface and a second conductive layer second side edge surface; a third conductive layer above said second conductive layer, said third conductive layer having a third conductive layer first side edge surface and a third conductive layer second side edge surface; a first conductive connection structure physically and conductively contacting to said first conductive layer first side edge surface, said second conductive layer first side edge surface, and said third conductive layer first side edge surface; and a second conductive connection structure physically and conductively contacting to said first conductive layer second side edge surface, said second conductive layer second side edge surface, and said third conductive layer second side edge surface. 2. The conditioner of claim 1 wherein said first conductive layer first side edge surface, said second conductive layer first side edge surface, and said third conductive layer first side edge surface are aligned with one another. 3. The conditioner of claim 1 wherein said first conductive layer first side edge surface and said first conductive layer second side edge surface are on opposite ends of said first conductive layer from one another. 4. The conditioner of claim 1 further comprising: additional conductive layers above said third conductive layer each of which having a first side edge and a second side edge, and wherein said first conductive connection structure physically and conductively contacts to the first side edges of all of said additional conductive layers, and wherein said second conductive connection structure physically and conductively contacts to the second side edges of all of said additional conductive layers. 5. The conditioner of claim 1 wherein said G conductive structure consists of an odd total number of conductive layers in a stack of layers including said first conductive layer. 6. The conditioner of claim 1 wherein: (1) said first conductive layer, said second conductive layer, and the portions of said first conductive connection structure and said second conductive connection structure connecting said first conductive layer to said second conductive layer define a first cage structure; (2) said second conductive layer, said third conductive layer, and the portions of said first conductive connection structure and said second conductive connection structure connecting said second conductive layer to said third conductive layer define a second cage structure; and further comprising: a first layer of an A differential electrode contained in said first cage structure; and a first layer of a B differential electrode contained in said second cage structure. 7. The conditioner of claim 6 wherein said A conductive structure consists of an odd total number of conductive layers in a stack of layers including said first layer of said A differential electrode. 8. The conditioner of claim 6 wherein said B conductive structure consists of an odd total number of conductive layers in a stack of layers including said first layer of said B differential electrode. 9. The conditioner of claim 6 further comprising additional cage structures having the same shape as said first cage structure, wherein adjacent cage structures have an adjoining wall formed from a single conductive layer. 10. The conditioner of claim 9 wherein a total number of the cage structures is an even number. 11. The conditioner of claim 9 wherein no more than a single conductive layer a differential electrode resides inside of any one of the cage structures. 12. The conditioner of claim 9 wherein at least one of the cage structures contains no conductive layer of any differential electrode. 13. The conditioner of claim 9 wherein a pair of adjacent cage structures both contain conductive layers of the same differential electrode. 14. A method of making an energy conditioning, said method comprising providing a G conductive structure, said G conductive structure comprising: a first conductive layer, said first conductive layer having top and bottom major surfaces, a first conductive layer first side edge surface, and a first conductive layer second side edge surface; a second conductive layer above said first conductive layer, said second conductive layer having a second conductive layer first side edge surface and a second conductive layer second side edge surface; a third conductive layer above said second conductive layer, said third conductive layer having a third conductive layer first side edge surface and a third conductive layer second side edge surface; a first conductive connection structure physically and conductively contacting to said first conductive layer first side edge surface, said second conductive layer first side edge surface, and said third conductive layer first side edge surface; and a second conductive connection structure physically and conductively contacting to said first conductive layer second side edge surface, said second conductive layer second side edge surface, and said third conductive layer second side edge surface. 15. The method of claim 14 wherein said first conductive layer first side edge surface, said second conductive layer first side edge surface, and said third conductive layer first side edge surface are aligned with one another. 16. The method of claim 14 wherein said first conductive layer first side edge surface and said first conductive layer second side edge surface are on opposite ends of said first conductive layer from one another. 17. The method of claim 14 further comprising: providing additional conductive layers above said third conductive layer each of which having a first side edge and a second side edge, and wherein said first conductive connection structure physically and conductively contacts to the first side edges of all of said additional conductive layers, and wherein said second conductive connection structure physically and conductively contacts to the second side edges of all of said additional conductive layers. 18. The method of claim 14 wherein said G conductive structure consists of an odd total number of conductive layers in a stack of layers including said first conductive layer. 19. The method of claim 14 wherein: (1) said first conductive layer, said second conductive layer, and the portions of said first conductive connection structure and said second conductive connection structure connecting said first conductive layer to said second conductive layer define a first cage structure; (2) said second conductive layer, said third conductive layer, and the portions of said first conductive connection structure and said second conductive connection structure connecting said second conductive layer to said third conductive layer define a second cage structure; and further comprising: a first layer of an A differential electrode contained in said first cage structure; and a first layer of a B differential electrode contained in said second cage structure. 20. A method of using an energy conditioning comprising a G conductive structure, said G conductive structure comprising: a first conductive layer, said first conductive layer having top and bottom major surfaces, a first conductive layer first side edge surface, and a first conductive layer second side edge surface; a second conductive layer above said first conductive layer, said second conductive layer having a second conductive layer first side edge surface and a second conductive layer second side edge surface; a third conductive layer above said second conductive layer, said third conductive layer having a third conductive layer first side edge surface and a third conductive layer second side edge surface; a first conductive connection structure physically and conductively contacting to said first conductive layer first side edge surface, said second conductive layer first side edge surface, and said third conductive layer first side edge surface; and a second conductive connection structure physically and conductively contacting to said first conductive layer second side edge surface, said second conductive layer second side edge surface, and said third conductive layer second side edge surface; and said method comprising connecting terminals of said conditioner in a circuit across a source and a load.
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