Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one e
Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.
대표청구항▼
What is claimed is: 1. An article for electrochemical processing, comprising: a body defining an outer surface, wherein the body is a polishing pad and the outer surface is a polishing surface of the polishing pad; and a conductive contact element at least partially disposed through the body and po
What is claimed is: 1. An article for electrochemical processing, comprising: a body defining an outer surface, wherein the body is a polishing pad and the outer surface is a polishing surface of the polishing pad; and a conductive contact element at least partially disposed through the body and positionable in a substrate contact position, wherein the conductive contact element comprises at least two wires in contact with one another and defining a substrate contact surface. 2. The article of claim 1, wherein the conductive contact element is flexible in at least one planar direction. 3. The article of claim 1, wherein the body defines a plurality of channels and the conductive contact element is at least partially disposed in at least one channel. 4. The article of claim 1, wherein the body defines a plurality of fluid channels and the conductive contact element is at least partially disposed in at least one fluid channel. 5. The article of claim 1, wherein at least a portion of the conductive contact element comprises a noble metal. 6. The article of claim 1, further comprising a power supply element connected to the conductive contact element and adapted to supply a current from a power supply. 7. The article of claim 1, wherein the at least two wires are twisted about one another. 8. The article of claim 1, wherein the at least two wires form a loop at least partially extending over the outer surface. 9. The article of claim 1, wherein the at least two wires form a twisted loop flexible in at least two planar directions and at least partially extending over the outer surface. 10. The article of claim 1, wherein the conductive contact element comprises a first end contacting a first hollow conductive housing and a second end contacting a second hollow conductive housing, wherein each hollow conductive housing is disposed in the body. 11. The article of claim 1, further comprising a hollow conductive housing disposed in the body and in electrical contact with the conductive contact element. 12. The article of claim 11, further comprising insulating plugs disposed in the hollow conductive housing and pressing the conductive contact element against the hollow conductive housing to secure the conductive contact element. 13. The article of claim 11, wherein the hollow conductive housing is disposed in a portion of the body recessed below the polishing surface. 14. An article for electrochemical processing, comprising: a body defining an outer surface; a conductive contact element at least partially disposed through the body and positionable in a substrate contact position, wherein the conductive contact element comprises at least two wires in contact with one another and defining a substrate contact surface; and a hollow conductive housing disposed in the body and in electrical contact with the conductive contact element, wherein the conductive contact element comprises a first end contacting a first hollow conductive housing and a second end contacting a second hollow conductive housing, wherein each hollow conductive housing is disposed in the body. 15. The article of claim 14, further comprising insulating plugs disposed in the hollow conductive housing and pressing the conductive contact element against the hollow conductive housing to secure the conductive contact element. 16. The article of claim 14, wherein the hollow conductive housing is disposed in a portion of the body recessed below the substrate contact surface. 17. The article of claim 14, wherein the conductive contact element is f;exible in at least one planar direction. 18. The article of claim 14, wherein the body defines a plurality of channels and the conductive contact element is at least partially disposed in at least one channel. 19. The article of claim 14, wherein the body defines a plurality of fluid channels and the conductive contact element is at least partially disposed in at least one fluid channel. 20. The article of claim 14, wherein at least a portion of the conductive contact element comprises a noble metal. 21. The article of claim 14, further comprising a power supply element connected to the conductive element and adapted to supply a current from a power supply. 22. The article of claim 14, wherein the at least two wires are twisted about one another. 23. The articl of claim 14, wherein the at least two wires form a loop at least partially extending over the outer curface. 24. The article of claim 14, wherein the at least two wires form a twisted loop flexible in at least two planar directions and at least partially extending over the surface. 25. An article for electrochemical processing, comprising: a polymer body having an outer surface suitable for polishing a substrate; and a conductive contact element at least partially disposed through the body and positionable in a substrate contact position, wherein the conductive contact element comprises a wire portion and a relatively enlarged portion disposed on the wire portion and defining a substrate contact surface, and wherein the wire portion forms one of an arch and a loop. 26. The article of claim 25, wherein the wire portion is flexible in at least one planar direction. 27. An article for electrochemical processing, comprising: a polymer body having an outer surface suitable for polishing a substrate; and a conductive contact element at least partially disposed through the body and positionable in a substrate contact position, wherein the conductive contact element comprises a wire portion and a relatively enlarged portion disposed on the wire portion and defining a substrate contact surface, and wherein the wire portion comprises at least two wire strands twisted about one another. 28. The article of claim 27, wherein the wire portion forms a twisted loop that is flexible in at least two planar directions and at least partially extending over the outer surface. 29. A current conducting assembly for electrochemical processing, comprising: a polishing pad defining a polishing surface; an insulating member defining a plurality of contact element retaining openings, wherein at least a portion of the insulating member is recessed below the polishing surface; a conducting surface disposed on the insulating member; and a plurality of contact elements each having a first end disposed in one of the plurality of contact element retaining openings and a second end disposed on the conducting surface, wherein a portion of each of the plurality of contact elements defines a substrate contact surface. 30. The current conducting assembly of claim 29, wherein at least a portion of the plurality of contact elements comprises a noble metal. 31. The current conducting assembly of claim 29, wherein at least a portion of the plurality of contact elements comprises a noble metal plating. 32. The current conducting assembly of claim 29, wherein the insulating member comprises a plurality of extremities each having one of the plurality of contact element retaining openings disposed therein. 33. The current conducting assembly of claim 29, wherein the plurality of contact elements each define a loop which includes the substrate contact surface. 34. The current conducting assembly of claim 29, further comprising a current transmission medium electrically coupled to the conducting surface and to a power supply. 35. The current conducting assembly of claim 29, wherein at least the substrate contact surfaces of the plurality of contact elements extend over the polishing surface. 36. The current conducting assembly of claim 29, wherein at least a portion of the plurality of contact elements each comprise a pair of wires defining the respective substrate contact surface. 37. The current conducting assembly of claim 36, wherein at least a portion of the plurality of contact elements comprises a noble metal. 38. The current conducting assembly of claim 29, wherein the conducting surface is a cylindrical member disposed through a central portion of the insulating member. 39. A current conducting assembly for electrochemical processing, comprising: an insulating member defining a plurality of contact element retaining openings; a conducting surface disposed on the insulating member, wherein the conducting surface is a cylindrical member disposed through a central portion of the insulating member; an insulating plug disposed at either end of the cylindrical member; and a plurality of contact elements each having a first end disposed in one of the plurality of contact element retaining openings and a second end disposed on the conducting surface, wherein a portion of each of the plurality of contact elements defines a substrate contact surface. 40. The current conducting assembly of claim 39, wherein at least a portion of the plurality of contact elements comprises a noble metal. 41. The current conducting assembly of claim 39, wherein at least a portion of the plurality of contact elements comprises a noble metal plating. 42. The current conducting assembly of claim 39, wherein the insulating member comprises a plurality of extremities each having one of the plurality of contact element retaining openings disposed therein. 43. The current conducting assembly of claim 39, wherein the plurality of contact elements each define a loop which includes the substrate contact surface. 44. The current conducting assembly of claim 39, further comprising a current transmission medium electrically coupled to the conducting surface and to a power supply. 45. The current conducting assembly of claim 39, further comprising a polishing pad defining a polishing surface, wherein at least a portion of the insulating member is recessed below the polishing surface and at least the substrate contact surfaces of the plurality of contact elements extend over the polishing surface. 46. The current conducting assembly of claim 39, wherein at least a portion of the plurality of contact elements each comprise a pair of wires defining the respective substrate contact surface. 47. The current conducting assembly of claim 46, wherein at least a portion of the plurality of contact elements comprises a noble metal. 48. A polishing article for electrochemical processing, comprising: a pad body defining a polishing surface; and an elongated assembly disposed in the pad body and at least partially recessed below the polishing surface, the elongated assembly comprising: at least two elongated conductive members in contact with one another along their respective lengths; a multi-turn conductive wire wound around and in contact with the least two elongated conductive members and forming at least two loops each comprising a portion at least partially extending over the polishing surface, wherein the portion of the at least two loops defines a substrate contact surface. 49. The polishing article of claim 48, wherein the at least one elongated conductive member is disposed along a radial line of the pad body. 50. The polishing article of claim 48, wherein the wire comprises at least two wire strands twisted about one another. 51. The polishing article of claim 48, wherein the substrate contact surface comprises a noble metal. 52. The polishing article of claim 48, wherein the elongated assembly further comprises an elongated carrier having at least one of the at least two elongated members disposed therein. 53. The polishing article of claim 52, wherein the elongated carrier comprises a conductive material. 54. The polishing article of claim 52, wherein the at least one of the at least two elongated members is disposed in a groove formed in the elongated carrier. 55. The polishing article of claim 52, wherein at least one of the elongated carrier and the elongated members comprises copper and the wire comprises a noble metal. 56. The polishing article of claim 48, wherein the wire comprises a substrate contact portion disposed thereon, wherein the substrate contact portion has the substrate contact surface defined thereon and wherein the support portion is made of a first material and the substrate contact surface is made of a second material. 57. The polishing article of claim 56, wherein the second material is a noble metal. 58. The polishing article of claim 56, wherein the substrate contact portion is a relatively enlarged portion, relative to a greatest diameter of the support portion. 59. The polishing article of claim 56, wherein the substrate contact portion is a nodule formed on the wire. 60. A polishing article for electrochemical processing, comprising: a pad body defining a polishing surface; and an elongated assembly disposed in the pad body and at least partially recessed below the polishing surface, the elongated assembly comprising: at least one elongated conductive member; a noble-metal-containing conductive sheet wrapped around and in contact with the least one elongated conductive member and defining a substrate contact surface. 61. The polishing article of claim 60, wherein the at least one elongated conductive member comprises at least two elongated conductive members in contact with one another along their respective lengths. 62. The polishing article of claim 60, wherein the at least one elongated conductive member is disposed along a radial line of the pad body. 63. The polishing article of claim 60, wherein the noble-metal-containing conductive sheet comprises nylon coated with a noble metal. 64. The polishing article of claim 60, wherein the substrate contact surface comprises a noble metal. 65. The polishing article of claim 60, wherein the elongated assembly further comprises an elongated carrier having the at least one elongated member disposed therein. 66. The polishing article of claim 65, wherein the elongated carrier comprises a conductive material. 67. The polishing article of claim 65, wherein at least one of the elongated carrier and the elongated member comprises copper and the noble-metal-containing conductive sheet comprises a noble metal. 68. An electrochemical processing contact assembly, comprising: a support body; a conductive housing disposed in the support body; a removable insulative plug disposed in the support body; and an electrically conductive wire contact wrapped about the removable insulative plug and forming an arch defining a substrate contact surface at an apex, wherein the support body is a polishing pad. 69. The assembly of claim 68, further comprising a power supply electrically connected to the conductive housing. 70. The assembly of claim 68, wherein the electrically conductive wire contact comprises a noble metal. 71. The assembly of claim 68, wherein the electrically conductive wire contact is flexible. 72. The assembly of claim 68, wherein the electrically conductive wire contact comprises a plurality of twisted wire strands.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (142)
Buchanan Scott J. (Minneapolis) Morrison Eric D. (West St. Paul) Boston David R. (Woodbury) Hedrick Steven T. (Cottage Grove) Kausch William L. (Cottage Grove) Larson Wayne K. (Maplewood MN), Abrasive article having vanadium oxide incorporated therein.
Harmer Walter L. (Arden Hills MN) Christensen Leif (St. Paul MN) Drtina Gary J. (Woodbury MN) Helmin Harvey J. (Golden Valley MN), Abrasive article with conductive, doped, conjugated, polymer coat and method of making same.
Ryoke Katsumi (Kanagawa JPX) Fujiyama Masaaki (Kanagawa JPX) Yamada Keisuke (Kanagawa JPX), Abrasive tape having an interlayer for magnetic head cleaning and polishing.
Birang Manoocher ; Rosenberg Lawrence M. ; Somekh Sasson ; White John M, Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet.
Satou Yuuichi,JPX, Apparatus for accurately measuring local thickness of insulating layer on semiconductor wafer during polishing and polishing system using the same.
Cote William J. (Poughquag NY) Ryan James G. (Newtown CT) Okumura Katsuya (Poughkeepsie NY) Yano Hiroyuki (Wappingers Falls NY), Apparatus for processing semiconductor wafers.
Andreshak Joseph C. (Mahopac NY) Datta Madhav (Peekskill NY) Romankiw Lubomyr T. (Briarcliff Manor NY) Vega Luis F. (Simsbury CT), Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands.
Dorsett Terry E. (11205 Hosford Rd. Chardon OH 44024) Rininger David P. (505 Courtland St. Fairport Harbor OH 44077) Strempel Thomas G. (23601 Colbourne Rd. Euclid OH 44123), Application of electroplate to moving metal by belt plating.
Damgaard Morten J.,DKX ; Bjerregaard Leila,DKX, Attachment means and use of such means for attaching a sheet-formed abrasive or polishing means to a magnetized support.
Schnabel Herbert W. (Midlothian VA) Buchanan Scott J. (Minneapolis MN) McAllister Richard G. (Sterling MA), Coated abrasive article containing an electrically conductive backing.
Tolles Robert D. ; Shendon Norm ; Somekh Sasson ; Perlov Ilya ; Gantvarg Eugene ; Lee Harry Q., Continuous processing system for chemical mechanical polishing.
Homayoun Talieh ; Cyprian Uzoh ; Bulent M. Basol, Device providing electrical contact to the surface of a semiconductor workpiece during metal plating.
Edelstein Daniel C. ; Horkans Wilma J. ; Luce Stephen E. ; Lustig Naftali E. ; Pope Keith R. ; Roper Peter D., Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing.
Ho Kwok-Lun (P.O. Box 33427 St. Paul MN 55133-3427) Harmer Walter L. (P.O. Box 33427 St. Paul MN 55133-3427), High performance abrasive articles containing abrasive grains and nonabrasive composite grains.
Kaanta Carter W. (Colchester VT) Leach Michael A. (Bristol VT), In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection.
Cheung Robin ; Carl Daniel A. ; Dordi Yezdi ; Hey Peter ; Morad Ratson ; Chen Liang-Yuh ; Smith Paul F. ; Sinha Ashok K., In-situ electroless copper seed layer enhancement in an electroplating system.
Adefris Negus B. ; Erickson Carl P., Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece.
Ben Mooring ; Wilbur Krusell ; Glenn Travis ; Erik Engdahl, Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed.
Tsai, Stan D.; Wang, Yuchun; Wijekoon, Kapila; Bajaj, Rajeev; Redeker, Fred C., Method and apparatus for enhanced CMP using metals having reductive properties.
Tsai, Stan D.; Wang, Yuchun; Wijekoon, Kapila; Bajaj, Rajeev; Redeker, Fred C., Method and apparatus for enhanced CMP using metals having reductive properties.
Lustig Naftali Eliahu ; Guthrie William L. ; Sandwick Thomas E., Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing.
Sabde Gundu M. ; Meikle Scott, Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives.
Walker Michael A., Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies.
Mayer Steven T. (Piedmont CA) Contolini Robert J. (Pleasanton CA) Bernhardt Anthony F. (Berkeley CA), Method and apparatus for spatially uniform electropolishing and electrolytic etching.
Emesh, Ismail; Gopalan, Periya; Rayer, II, Phillip M.; Palmer, Bentley J., Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface.
Jalal Ashjaee ; Boguslaw A. Nagorski ; Bulent M. Basol ; Homayoun Talieh ; Cyprian Uzoh, Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing.
Yu Chris C. (Boise ID) Doan Trung T. (Boise ID), Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing.
Xu, Cangshan; Zhao, Eugene Y.; Dai, Fen, Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same.
Cook Lee Melbourne ; James David B. ; Jenkins Charles William ; Reinhardt Heinz F. ; Roberts John V. H. ; Pillai Raj Raghav, Methods for using polishing pads.
Markoo Eric L. (Markaryd SW) Strand Tore G. H. (Naasjo SW) Sandell Thorsten W. (Markaryd SW), Multilayered flexible abrasive containing a layer of electroconductive material.
Shyng-Tsong Chen ; Alex Siu Keung Chung ; Oscar Kai Chi Hsu ; Kenneth P. Rodbell ; Jean Vangsness, Multilayered polishing pad, method for fabricating, and use thereof.
Reinhardt Heinz F. (Chadds Ford PA) Roberts John V. H. (Newark DE) McClain Harry G. (Middletown DE) Budinger William D. (Newark DE) Jensen Elmer W. (New Castle DE), Polymeric polishing pad containing hollow polymeric microelements.
Perlov Ilya ; Gantvarg Eugene ; Lee Harry Q. ; Somekh Sasson ; Tolles Robert D., Radially oscillating carousel processing system for chemical mechanical polishing.
Leach Michael A. (Bristol VT) Paulsen James K. (Jericho VT) Machesney Brian J. (Burlington VT) Venditti Daniel J. (Essex Junction VT) Whitaker Christopher R. (Jericho VT), System for mechanical planarization.
Carlson David W., Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.