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Apparatuses and methods for cooling processors and other electronic components in computers and other systems are disclosed herein. A heat sink configured in accordance with one embodiment of the invention includes a heat pipe structure. The heat pipe structure includes an interface portion offset

Apparatuses and methods for cooling processors and other electronic components in computers and other systems are disclosed herein. A heat sink configured in accordance with one embodiment of the invention includes a heat pipe structure. The heat pipe structure includes an interface portion offset from a body portion by a leg portion. The interface portion is configured to be positioned proximate to a processor or other electronic device, and the body portion is configured to be spaced apart from the electronic device. The heat pipe structure further includes a working fluid. The working fluid is positioned to absorb heat from the electronic device at the interface portion of the heat pipe structure and transfer the heat to the body portion of the heat pipe structure. In one embodiment, the heat sink can further include a plurality of cooling fins attached to the body portion of the heat pipe structure.

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I claim: 1. A heat sink for dissipating heat generated by an electronic device in a computer system, the heat sink comprising: a heat pipe structure formed from a single piece of heat pipe material having a plurality of evacuated passages, the heat pipe structure including: a planar interface porti

I claim: 1. A heat sink for dissipating heat generated by an electronic device in a computer system, the heat sink comprising: a heat pipe structure formed from a single piece of heat pipe material having a plurality of evacuated passages, the heat pipe structure including: a planar interface portion configured to be positioned proximate to the electronic device; a planar leg portion extending away from the interface portion, wherein the leg portion is at least generally perpendicular to the interface portion, and wherein the interface portion extends away from the leg portion in a first direction; a planar body portion vertically offset from the interface portion by the leg portion, wherein the body portion is at least generally parallel to the interface portion, and wherein the body portion includes a first portion of the evacuated passages which extends away from the leg portion in the first direction and a second portion of the evacuated passages which extend away from the leg portion in a second direction, the second direction being opposite to the first direction; and a working fluid that cycles through the evacuated passages of the heat pipe material to absorb heat from the electronic device at the interface portion of the heat pipe structure and transfer the heat to the body portion of the heat pipe structure. 2. The heat sink of claim 1, further comprising at least one cooling fin attached to the body portion of the heat pipe structure. 3. The heat sink of claim 1, further comprising a plurality of coplanar cooling fins attached to the body portion of the heat pipe structure. 4. The heat sink of claim 1, further comprising at least one cooling fin attached to the body portion of the heat pipe structure, wherein the body portion of the heat pipe structure is vertically offset from the interface portion in a third direction, and wherein the at least one cooling fin extends away from the body portion in a fourth direction, opposite to the third direction. 5. The heat sink of claim 1 wherein the heat pipe structure further includes at least one internal passage extending from the interface portion to the body portion, and wherein at least a portion of the working fluid is contained in the internal passage. 6. The heat sink of claim 1 wherein the heat pipe structure includes a plurality of capillaries through which the working fluid circulates. 7. A heat sink for dissipating heat generated by an electronic device in a computer system, the heat sink comprising: a heat pipe structure, the heat pipe structure including: an interface portion configured to be positioned proximate to the electronic device; a leg portion extending away from the interface portion, wherein the leg portion is at least generally perpendicular to the interface portion, and wherein the interface portion extends away from the leg portion in a first direction; a body portion vertically offset from the interface portion by the leg portion, wherein the body portion is, wherein the body portion has a planar surface that is at least generally parallel to the interface portion and substantially larger than the interface portion, and wherein the planar surface extends away from the leg portion in the first direction and a second direction, the second direction being opposite to the first direction; and a working fluid positioned to absorb heat from the electronic device at the interface portion of the heat pipe structure and transfer the heat to the body portion of the heat pipe structure, wherein the heat pipe structure includes a thermosyphon that carries at least a portion of the working fluid through a plurality of fluid passages in the body portion that extend away from the leg portion in the first direction and the second direction. 8. The heat sink of claim 1 wherein the heat pipe structure includes a porous wick structure that carries at least a portion of the working fluid. 9. The heat sink of claim 1 wherein the heat pipe structure includes a convection driven siphon that carries at least a portion of the working fluid. 10. The heat sink of claim 1 wherein the interface portion of the heat pipe structure is a generally planar structure. 11. The heat sink of claim 1 wherein interface portion and the body portion of the heat pipe structure are generally coplanar structures. 12. A heat sink for dissipating heat generated by an electronic device in a computer system, the heat sink comprising: a heat pipe structure, the heat pipe structure including: a first interface portion configured to be positioned proximate to a first electronic device, wherein the first interface portion is formed from heat pipe material having a plurality of evacuated passages; a body portion offset from the first interface portion by a first leg portion, wherein the body portion is configured to be spaced apart from the first electronic device, and wherein the body portion and the first leg portion are formed from the same heat pipe material as the first interface portion; a working fluid that cycles through the evacuated passages of the heat pipe material to absorb heat from the first electronic device at the first interface portion of the heat pipe structure and transfer the heat to the body portion of the heat pipe structure; and a second interface portion offset from the body portion by a second leg portion, wherein the second interface portion is configured to be positioned proximate to a second electronic device. 13. A computer module assembly comprising: a motherboard; an electronic device mounted to the motherboard; and a heat sink configured to dissipate heat generated by the electronic device, the heat sink including a heat pipe structure having: an interface portion positioned proximate to the electronic device, wherein the interface portion is formed from heat pipe material having a plurality of evacuated passages; a leg portion extending away from the interface portion, wherein the leg portion is at least generally perpendicular to the interface portion, and wherein the interface portion extends away from the leg portion in a first direction; a body portion offset from the interface portion by the leg portion, wherein the body portion is spaced apart from the electronic device, wherein the body portion and the leg portion are formed from the same heat pipe material as the interface portion, and wherein the body portion includes a first portion of the evacuated passages that extends away from the leg portion in the first direction and a second portion of the evacuated passages that extend away from the leg portion in a second direction, the second direction being opposite to the first direction; and a working fluid that cycles through the evacuated passages in the heat pipe material to absorb heat from the electronic device and transfer the heat to the body portion of the heat pipe structure. 14. The computer module assembly of claim 13, wherein the heat pipe structure further includes a plurality of cooling fins extending away from the body portion toward the mother board. 15. A computer module assembly comprising: a motherboard; a first electronic device mounted to the motherboard; a heat sink configured to dissipate heat generated by the first electronic device, the heat sink including a heat pipe structure having: a first interface portion positioned proximate to the first electronic device, wherein the first interface portion is formed from heat pipe material having a plurality of evacuated passages; a body portion offset from the first interface portion by a leg portion, wherein the body portion is spaced apart from the first electronic device, and wherein the body portion and the leg portion are formed from the same heat pipe material as the first interface portion; and a working fluid that cycles through the evacuated passages in the heat pipe material to absorb heat from the first electronic device and transfer the heat to the body portion of the heat pipe structure, and a second electronic device mounted to the motherboard, wherein the heat pipe structure further includes a second interface portion spaced apart from the first interface portion and positioned proximate to the second electronic device. 16. A computer module assembly comprising: a motherboard; a first electronic device mounted to the motherboard; a second electronic device mounted to the motherboard; a heat sink configured to dissipate heat generated by the first electronic device, the heat sink including a heat pipe structure having: a first interface portion positioned proximate to the first electronic device;a body portion offset from the first interface portion by a leg portion, wherein the body portion is spaced apart from the first electronic device; a working fluid positioned to absorb heat from the first electronic device and transfer the heat to the body portion of the heat pipe structure; a second interface portion spaced apart from the first interface portion and positioned proximate to the second electronic device; and a plurality of cooling fins extending from the body portion toward the mother board between the first and second interface portions. 17. A system for dissipating heat generated by an electronic device mounted to a motherboard, the system comprising: means for transferring heat from the electronic device into a working fluid to thereby cause at least a portion of the working fluid to evaporate; means for conveying at least a portion of the evaporated working fluid away from the motherboard in a first direction; and means for transferring heat from the evaporated working fluid into a plurality of cooling fins extending toward the motherboard in a second direction opposite to the first direction, wherein the plurality of cooling fins include a first portion of cooling fins spaced apart from a second portion of cooling fins, wherein the first portion of cooling fins is offset from a first side of the means for conveying and the second portion of cooling fins is offset from a second side of the means for conveying, and wherein transferring heat from the evaporated working fluid into the plurality of cooling fins causes at least a portion of the evaporated working fluid to condense. 18. The system of claim 17 wherein the means for conveying at least a portion of the evaporated working fluid away from the motherboard include a plurality of capillaries. 19. The system of claim 17, further comprising means for returning at least a portion of the condensed working fluid to a position proximate the electronic device. 20. The system of claim 19 wherein the means for returning include a porous wick structure. 21. A method for cooling an electronic device in a computer system, the method comprising: forming an interface portion, a leg portion, and a body portion of a heat sink from a single piece of heat pipe material having a plurality of evacuated passages; positioning the interface portion of the heat sink at least proximate to a surface of the electronic device, wherein the interface portion of the heat sink is vertically offset from the body portion of the heat sink by the leg portion, wherein the interface portion extends away from the leg portion in a first direction, and wherein the body portion includes a first portion of the evacuated passages that extends away from the leg portion in the first direction and a second portion of the evacuated passages that extend away from the leg portion in a second direction, the second direction being opposite to the first direction, and wherein the heat sink further includes a working fluid positioned to absorb heat from the electronic device and transfer the heat to the body portion of the heat sink via the first and second portions of the evacuated passages; and moving air past a plurality of cooling fins extending from the body portion of the heat sink. 22. The method of claim 21 wherein positioning an interface portion of a heat sink at least proximate to a surface of the electronic device includes positioning the interface portion of the heat sink in contact with the surface of the electronic device. 23. The method of claim 21 wherein the body portion of the heat sink is vertically offset from the interface portion of the heat sink in a third direction, and wherein moving air past the plurality of cooling fins includes moving air past a plurality of cooling fins extending away from the body portion of the heat sink in a fourth direction opposite to the first direction.