IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0077466
(2005-03-10)
|
등록번호 |
US-7305016
(2007-12-04)
|
발명자
/ 주소 |
- Stephens, IV,Edward Franklin
|
출원인 / 주소 |
- Northrop Grumman Corporation
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
92 |
초록
▼
A laser diode assembly has a laser diode. The laser diode has an emitting surface and a reflective surface opposing the emitting surface. The laser diode has first and second side surfaces between the emitting and reflective surfaces. A first electrically-insulating heat sink is attached to the firs
A laser diode assembly has a laser diode. The laser diode has an emitting surface and a reflective surface opposing the emitting surface. The laser diode has first and second side surfaces between the emitting and reflective surfaces. A first electrically-insulating heat sink is attached to the first side surface of the laser diode via a first solder bond, and the first heat sink has a first cooling channel. A second electrically-insulating heat sink is attached to the second side surface of the laser diode via a second solder bond, and the second electrically-insulating heat sink has a second cooling channel. A substrate has a top side and a bottom side, and the top side being in communication with a first bottom side of the first electrically-insulating heat sink and a second bottom side of the second electrically-insulating heat sink. The substrate has a flow channel system for passing a coolant to the first cooling channel and the second cooling channel. A metallization layer is attached to the first electrically-insulating heat sink and the second electrically-insulating heat sink. The metallization layer is electrically coupled to the laser diode and conducts electrical current to the laser diode. The metallization layer is isolated from the coolant.
대표청구항
▼
What is claimed is: 1. A laser diode assembly, comprising: a laser diode having an emitting surface and a reflective surface opposing the emitting surface, the laser diode having first and second side surfaces between the emitting and reflective surfaces; a first electrically-insulating heat sink a
What is claimed is: 1. A laser diode assembly, comprising: a laser diode having an emitting surface and a reflective surface opposing the emitting surface, the laser diode having first and second side surfaces between the emitting and reflective surfaces; a first electrically-insulating heat sink attached to the first side surface of the laser diode via a first solder bond, the first heat sink having a first cooling channel; a second electrically-insulating heat sink attached to the second side surface of the laser diode via a second solder bond, the second electrically-insulating heat sink having a second cooling channel; a substrate having a top side and a bottom side, the top side being in communication with a first bottom side of the first electrically-insulating heat sink and a second bottom side of the second electrically-insulating heat sink, the substrate having a flow channel system for passing a coolant to the first cooling channel and the second cooling channel; and a metallization layer attached to the first electrically-insulating heat sink and the second electrically-insulating heat sink, the metallization layer being electrically coupled to the laser diode and conducting electrical current to the laser diode, the metallization layer being isolated from the coolant. 2. The laser diode assembly of claim 1, further including a fluid manifold in communication with the substrate, the fluid manifold distributing the coolant to the substrate. 3. The laser diode assembly of claim 1, wherein the first electrically-insulating heat sink and the second electrically-insulating heat sink are formed of electrically-insulating silicon blocks. 4. The laser diode assembly of claim 3, wherein the electrically-insulating silicon blocks are formed of bonded layers of silicon. 5. The laser diode assembly of claim 1, wherein the coolant is water. 6. The laser diode assembly of claim 1, wherein the flow channel system has an inlet, an outlet, and a bypass region, the inlet providing the coolant to the first electrically-insulating heat sink, the bypass region passing the coolant from the first electrically-insulating heat sink to the second electrically-insulating heat sink, and the outlet receiving the coolant from the second electrically-insulating heat sink. 7. The laser diode assembly of claim 6, wherein the substrate is made of a plurality of layers that are fused together to create the bypass region. 8. The laser diode assembly of claim 1, wherein at least one of the first and second electrically-insulating heat sinks includes an impingement region causing the coolant to impinge against a wall that is near the one of the side surfaces of the laser diode. 9. The laser diode assembly of claim 8, wherein the impingement region includes an impingement nozzle providing a plurality of streams of the coolant against the wall, the at least one of the first and second electrically-insulating heat sinks being made of a material and the impingement nozzle being made of a metal encased in the material. 10. The laser diode assembly of claim 9, wherein the wall is a side surface of a thermally conductive structure at least partially encased in the material, the material being polymeric. 11. The laser diode assembly of claim 1, wherein the metallization layer is located on an exterior surface of the first and second electrically-insulative heat sinks. 12. A laser diode assembly, comprising: a laser diode having an emitting surface and a reflective surface opposing the emitting surface, the laser diode having first and second side surfaces between the emitting and reflective surfaces; a first heat sink attached to the first side surface of the laser diode, the first heat sink having a first set of multiple components for creating a first cooling channel, the first heat sink being created by bonding a first plurality of layers of material, the first plurality of layers being the first set of multiple components; a second heat sink attached to the second side surface of the laser diode, the second heat sink having a second set of multiple components for creating a second cooling channel, the second heat sink being created by bonding a second plurality of layers of material, the second plurality of layers being the second set of multiple components; at least one substrate being in communication with the first heat sink and the second heat sink, wherein the at least one substrate has a flow channel system for passing a coolant to the first cooling channel and the second cooling channel; a metallic path being electrically coupled to the laser diode and conducting electrical current to the laser diode; and wherein the first plurality of layers and the second plurality of layers are copper sheets and the metallic oath is provided by the copper sheets. 13. The laser diode assembly according to claim 12, wherein the at least one substrate includes one substrate, and the flow channel system includes a bypass region, an inlet, and an outlet, the inlet providing the coolant to the first heat sink, the bypass region passing the coolant from the first heat sink to the second heat sink, the outlet receiving the coolant from the second heat sink. 14. The laser diode assembly according to claim 12, wherein the coolant is deionized water. 15. The laser diode assembly according to claim 12, wherein at least the first heat sink includes an impingement region causing the coolant to impinge against a wall that is near the first side surface of the laser diode, the first set of multiple components including a base structure and an impingement nozzle encased within the base structure. 16. A method of manufacturing a laser diode assembly having a laser diode with an emitting surface and a reflective surface opposing the emitting surface, the laser diode having first and second side surfaces between the emitting and reflective surfaces, comprising: coupling a first electrically-insulating heat sink to the first side surface of the laser diode via a first solder layer, the first heat sink having a first cooling channel; coupling a second electrically-insulating heat sink to the second side surface of the laser diode via a second solder layer, the second heat sink having a second cooling channel; coupling at least one substrate to the first electrically-insulating heat sink and the second electrically-insulating heat sink, the at least one substrate having a flow channel system for passing a coolant to the first cooling channel and the second cooling channel; and creating a current path that is attached to the first electrically-insulating heat sink and the second electrically-insulating heat sink, the current path being electrically isolated from the coolant and providing current to the laser diode. 17. The method of claim 16, wherein the creating includes applying a metallization layer to the first electrically-insulating heat sink and the second electrically-insulating heat sink. 18. The method of claim 16, further including forming the first electrically-insulating heat sink and the second electrically-insulating heat sink from a plurality of bonded layers. 19. The method of claim 16, wherein at least one of the first and second electrically-insulating heat sinks includes an impingement region causing the coolant to impinge against a wall that is near the one of the side surfaces of the laser diode. 20. The method of claim 19, wherein the impingement region includes an impingement nozzle providing a plurality of streams of the coolant against the wall, the at least one of the first and second electrically-insulating heat sinks being made of a polymeric material and the impingement nozzle being made of a metal encased in the polymeric material. 21. The method of claim 16, wherein the first and second solder layers are the same material. 22. The method of claim 16, wherein the coupling the at least one substrate to the first and the second electrically-insulating heat sinks includes soldering involving a third solder layer, the third solder layer being material that is different from the first and second solder layers. 23. A laser diode assembly, comprising: a laser diode having an emitting surface and a reflective surface opposing the emitting surface, the laser diode having first and second side surfaces between the emitting and reflective surfaces; a first heat sink attached to the first side surface of the laser diode, the first heat sink having a first set of multiple components for creating a first cooling channel, the first heat sink being created by bonding a first plurality of silicon layers, the first plurality of silicon layers being the first set of multiple components; a second heat sink attached to the second side surface of the laser diode, the second heat sink having a second set of multiple components for creating a second cooling channel, the second heat sink being created by bonding a second plurality of silicon layers, the second plurality of silicon layers being the second set of multiple components; at least one substrate being in communication with the first heat sink and the second heat sink, wherein the at least one substrate has a flow channel system for passing a coolant to the first cooling channel and the second cooling channel; a metallic path being electrically coupled to the laser diode and conducting electrical current to the laser diode, the metallic path being provided by a metallization layer on the first and second heat sinks. 24. The laser diode assembly according to claim 23, wherein the at least one substrate includes one substrate, and the flow channel system includes a bypass region, an inlet, and an outlet, the inlet providing the coolant to the first heat sink, the bypass region passing the coolant from the first heat sink to the second heat sink, the outlet receiving the coolant from the second heat sink. 25. The laser diode assembly according to claim 23, wherein at least the first heat sink includes an impingement region causing the coolant to impinge against a wall that is near the first side surface of the laser diode, the first set of multiple components including a base structure and an impingement nozzle encased within the base structure.
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