[특허]Coupling a light sensor array with an optical component

Kotura, Inc.

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Coupling a light sensor array with an optical component

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G02B-006/12
미국특허분류(USC)	385/014; 385/015
출원번호	US-0267812 (2002-10-08)
등록번호	US-7308166 (2007-12-11)
발명자 / 주소	Peng,Yihlih Pinyan,James A.
출원인 / 주소	Kotura, Inc.
대리인 / 주소	Gavrilovich, Dodd & Lindsey LLP
인용정보	피인용 횟수 : 15 인용 특허 : 45

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An optical component system includes an optical component having a plurality of ports through which light signals exit the optical component. The system also includes a light sensor array having a plurality of light sensors. The light sensor array is coupled to the optical component such that different light sensors receive light signals that exit the optical component through different ports. The system also includes a light barrier positioned between the optical component and the light sensor array and between adjacent light sensors. In some instances...

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The invention claimed is: 1. An optical system, comprising: an optical component having a plurality of waveguides that each has a length, the waveguides being positioned on a substrate such that each waveguide is immobilized relative to the substrate along the length of the waveguide, the optical component also having ports through which light signals guided through the waveguides exit the optical component; a light sensor array including a plurality of light sensors, different light sensors configured to receive light signals from different waveguides, each waveguide is associated with the light sensor configured to receive the light signals from that waveguide; a light transmitting medium between the optical component and the light sensor array, the light transmitting medium positioned such that the light signals travel through the light transmitting medium when traveling from the waveguides to the light sensors; and a light barrier positioned between an electrical contact pad on the optical component and an electrical contact pad on the light sensor array, the electrical contact pad on the optical component being positioned over a region of the optical component that is between ports and the electrical contact pad on the light sensor array being positioned over a region of the light sensor array that is between light sensors, the light barrier configured to prevent a first light signal traveling through the light transmitting medium from being received at one or more of the light sensors that are not associated with the waveguide from which the first light signal exited. 2. The system of claim 1, wherein the light barrier is electrically conductive. 3. The system of claim 1, wherein the light barrier includes a metal. 4. The system of claim 3, wherein the metal includes gold. 5. The system of claim 1, wherein the light barrier is positioned so as to surround an optical path that the first light signal travels from the waveguide from which the first light signal exited to the associated light sensor. 6. The system of claim 1, wherein a bonding medium is positioned adjacent to the light barrier, the bonding medium bonding the optical component to the light sensor array. 7. The system of claim 6, wherein the bonding medium is electrically conductive. 8. The system of claim 6, wherein the bonding medium is electrically conductive. 9. The system of claim 1, wherein the light sensor array is positioned over the optical component such that the ports are between the substrate and the light sensor array. 10. The system of claim 1, wherein the ports are configured to re-direct the light signals from the waveguides to a region over the optical component such that the waveguides are positioned between the substrate and the region over the optical component. 11. The system of claim 1, further comprising: a bonding medium bonding the optical component to the light sensor array; and a medium encapsulating the light sensor array, the medium being different from the bonding medium. 12. The system of claim 1, wherein the light barrier is one of a plurality of light barriers between the optical component and the light sensor array, the light barriers being configured to prevent the light signals traveling through the light transmitting medium from being received at the light sensors that are not associated with the waveguide from which each light signal exited. 13. The system of claim 1, wherein the light barrier extends from a region of the optical component between ports to a region of the light sensor array between light sensors. 14. The system of claim 1, wherein the light barrier is electrically conducting and provides electrical communication between an electrical contact pad on the optical component and an electrical contact pad on the light sensor array. 15. The system of claim 14, wherein the electrical contact pad on the optical component is between ports. 16. The system of claim 14, wherein the electrical contact pad on the optical component is between ports and the electrical contact pad on the light sensor array is between light sensors. 17. The system of claim 1, wherein the waveguides are arranged such that lengths of the waveguides define a plane and the ports are configured to re-direct the light signals traveling along the waveguides out of the plane. 18. The system of claim 1, wherein the waveguides are ridge waveguides that are each defined by a ridge of a medium extending from a slab of the medium such that each ridge extends from the same slab and such that the medium extends continuously from the slab into each ridge. 19. The system of claim 1, wherein the light transmitting medium extends continuously from the waveguides to the light sensors such that the light signals travel exclusively through the light transmitting medium when traveling from the waveguides to the light sensors. 20. The system of claim 1, wherein the light sensor array is immobilized relative to the optical component. 21. The system of claim 1, wherein: the light barrier is electrically conductive; the light barrier is positioned so as to surround an optical path that the first light signal travels from the waveguide from which the first light signal exited to the associated light sensor; a bonding medium is positioned adjacent to the light barrier, the bonding medium bonding the optical component to the light sensor array and being different from the light transmitting medium; the light sensor array is positioned over the optical component such that the ports are between the substrate and the light sensor array; and the ports are configured to re-direct the light signals from the waveguides to a region over the optical component such that the waveguides are positioned between the substrate and the region over the optical component. 22. The system of claim 21, wherein the bonding medium is electrically conductive. 23. The system of claim 1, wherein the light barrier contacts the optical component and also contacts the light sensor array. 24. An optical system, comprising: an optical component having a plurality of waveguides that each has a length, the waveguide positioned on a substrate such that each waveguide is immobilized relative to the substrate along the length of the waveguide, the optical component also having ports through which light signals guided through the waveguides exit the optical component; a light sensor array including a plurality of light sensors, the array being coupled to the optical component such that different light sensors receive light signals that exit the optical component through different ports; a light transmitting medium between the optical component and the light sensor array, the light transmitting medium positioned such that the light signals travel through the light transmitting medium when traveling from the waveguides to the light sensors; and a light barrier between an electrical contact pad on the optical component and an electrical contact pad on the light sensor array, the electrical contact pad on the optical component being positioned over a region of the optical component that is between ports and the electrical contact pad on the light sensor array being positioned over a region of the light sensor array that is between light sensors, the light barrier also being positioned between different regions of the light transmitting medium, and the light barrier also being positioned over a region of the optical component that is located between adjacent ports. 25. The system of claim 24, wherein the light barrier is electrically conductive. 26. The system of claim 24, wherein the light barrier includes a metal. 27. The system of claim 24, wherein a bonding medium is positioned adjacent to the light barrier, the bonding medium bonding the optical component to the light sensor array. 28. The system of claim 27, wherein the bonding medium is electrically conductive. 29. The system of claim 24, wherein the light sensor array is positioned over the optical component such that the ports are between the substrate and the light sensor array. 30. The system of claim 24, wherein the ports are configured to re-direct the light signals from the waveguides to a region over the optical component such that the waveguides are positioned between the substrate and the region over the optical component. 31. The system of claim 24, wherein the light barrier is one of a plurality of light barriers between the optical component and the light sensor array, more than one of the light barriers positioned over a region of the optical component between adjacent ports and also positioned between different regions of the light transmitting medium. 32. The system of claim 24, wherein the light barrier contacts the optical component and also contacts the light sensor array. 33. A method of forming an optical component system, comprising: obtaining an optical component having a plurality of waveguides that each has a length, the waveguides being positioned on a substrate such that each waveguide is immobilized relative to the substrate along the length of the waveguide, the optical component also having ports through which light signals guided through the waveguides exit the optical component; obtaining a light sensor array including a plurality of light sensors; and bonding the light sensor array and the optical component such that different light sensors are configured to receive light signals from different waveguides, each waveguide being associated with the light sensor that receives the light signals from that waveguide, wherein the light sensor array is bonded to the optical component such that a light transmitting medium is positioned between the optical component and the light sensor array, the light transmitting medium positioned such that the light signals travel through the light transmitting medium when traveling from the waveguides to the light sensors, and wherein the light sensor array is bonded to the optical component such that a light barrier is positioned between an electrical contact pad on the optical component and an electrical contact pad on the light sensor array, the electrical contact pad on the optical component being positioned over a region of the optical component that is between ports and the electrical contact pad on the light sensor array being positioned over a region of the light sensor array that is between light sensors, and the light barrier configured to prevent a first light signal traveling through the light transmitting medium from being received at one or more of the light sensors that are not associated with the waveguide from which the first light signal exited. 34. The method of claim 33, wherein the light sensor array and the optical component are bonded such that the light barrier is between an electrical contact pad on the optical component and an electrical contact pad on the light sensor array. 35. The method of claim 33, further comprising: positioning the light barrier on a region of the optical component between adjacent ports before bonding the light sensor array and the optical component. 36. The method of claim 35, further comprising: compressing the light barrier before bonding the light sensor array and the optical component. 37. The method of claim 36, wherein bonding the light sensor array and the optical component includes depositing a liquid bonding medium precursor on the light barrier, the liquid bonding medium being convertible to a solid bonding medium. 38. The method of claim 37, wherein the solid bonding medium is electrically conductive. 39. The method of claim 33, further comprising: forming a solid medium between the light sensor array and the optical component after bonding the light sensor array and the optical component. 40. The method of claim 33, further comprising: encapsulating at least a portion of the light sensor array in a sealing medium after bonding the light sensor array and the optical component. 41. The method of claim 33, wherein the light barrier contacts the optical component and also contacts the light sensor array.

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Coupling a light sensor array with an optical component

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Coupling a light sensor array with an optical component

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