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Composite coating compositions, composite metallic coatings derived from these compositions, and methods of forming the composite coating compositions and composite metallic coatings, wherein the compositions and coatings comprise particles of at least one quasicrystalline metal alloy and at least o

Composite coating compositions, composite metallic coatings derived from these compositions, and methods of forming the composite coating compositions and composite metallic coatings, wherein the compositions and coatings comprise particles of at least one quasicrystalline metal alloy and at least one elemental metal. The methods include electrocodepositing suspended quasicrystalline metal alloy particles and dissolved metal ions onto a substrate. Preferably, the substrate is disposed in an aqueous bath containing at least one dissolved metal ion species and at least one suspended quasicrystalline metal alloy powder species. The compositions and coatings enhance the wear, friction, hardness, corrosion, and non-stick characteristics of the substrate.

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What is claimed is: 1. A method, comprising: electrocodepositing particles of at least one quasicrystalline metal alloy and at least one elemental metal onto a working electrode disposed in an electroplating bath using short-cycle ramping of a DC current, wherein the electroplating bath comprises a

What is claimed is: 1. A method, comprising: electrocodepositing particles of at least one quasicrystalline metal alloy and at least one elemental metal onto a working electrode disposed in an electroplating bath using short-cycle ramping of a DC current, wherein the electroplating bath comprises a solvent, ions of the at least one elemental metal dissolved in the solvent, and the particles of at least one quasicrystalline metal alloy suspended in the solvent. 2. The method of claim 1, wherein the working electrode has an electronically conducting surface. 3. The method of claim 2, wherein the electronically conducting surface comprises a material selected from metals, alloys, graphite, carbon-carbon composites, and combinations thereof. 4. The method of claim 2, further comprising: maintaining the electroplating bath at a pH between 2 and 7. 5. The method of claim 4, further comprising: adding aqueous K2CO3 or H2SO4 to the bath to maintain the pH. 6. The method of claim 2, further comprising: maintaining the temperature of the electroplating bath during electrocodeposition between 10 and 70째 C. 7. The method of claim 2, further comprising: agitating the electrolyte solution. 8. The method of claim 1, wherein the at least one elemental metal is selected from manganese, iron, cobalt, chromium, nickel, copper, zinc, and combinations thereof. 9. The method of claim 1, wherein the electroplating bath is selected from an electrolytic deposition bath, an electroless deposition bath, and mixtures thereof. 10. The method of claim 1, wherein the electroplating bath is suitable for plating the at least one elemental metal, wherein the at least one elemental metal is selected from nickel, copper, and combinations thereof. 11. The method of claim 1, wherein the temperature of the electroplating bath during the electrocodeposition does not exceed the melting point of the particles of the at least one quasicrystalline metal alloy or the melting point of the working electrode. 12. The method of claim 1, wherein the temperature of the electrocodeposition bath during the electrocodeposition does not exceed 100째 C. 13. The method of claim 1, wherein the at least one quasicrystalline metal alloys include aluminum-transition metal alloys. 14. The method of claim 13, wherein the aluminum-transition metal alloys are selected from Al--Cu-M, Al--Pd-M and combinations thereof, where M is a transition metal selected from Fe, Ru, Ni, Mn, Cr, Co and combinations thereof. 15. The method of claim 13, wherein the quasicrystals are ternary, quaternary and higher alloys. 16. The method of claim 15, further comprising: providing a counter electrode comprising iron, cobalt, nickel, copper, zinc, platinized titanium, or ruthenium/iridium oxide-coated titanium metal, or a combination thereof. 17. The method of claim 13, wherein the quasicrystals include up to about 10 atomic percent of a transition metal selected from Ti, V, Cr, Mn, Co, Ni, Ta, W, Nb, Mo, Zr and combinations thereof. 18. The method of claim 13, wherein the quasicrystals include B, Si or combinations thereof. 19. The method of claim 1, wherein the electroplating bath comprises between 25 and 150 grams of quasicrystalline metal alloy particles per liter of the electroplating bath. 20. The method of claim 1, wherein the working electrode is a substrate selected from copper, aluminum, an alloy of aluminum, carbon or graphite, cast iron, wrought iron, carbon steels, stainless steels, copper/tin alloys, copper/zinc alloys, copper/nickel alloys, doped or undoped semiconductors, polymer/carbon composites, polymer/graphite composites, polymer/metal composites, and metal/metal composites. 21. The method of claim 1, wherein the working electrode is selected from polymers and polymer composites. 22. The method of claim 21, wherein the working electrode is a polymer composite comprising carbon or metal. 23. The method of claim 1, further comprising: applying an electroless or electrolytic strike on the working electrode prior to the electrocodepositing step, wherein the strike comprises a metal selected from zinc, nickel, copper, platinum, cobalt, gold and combinations thereof. 24. The method of claim 23, wherein the working electrode is an aluminum alloy 3004 substrate, and the strike includes electroless zincate followed by electroless copper. 25. The method of claim 1, wherein the electroplating bath is aqueous. 26. The method of claim 25, wherein the at least one elemental metal is selected from chromium, manganese, iron, cobalt, nickel, copper, zinc, and combinations thereof. 27. The method of claim 26, wherein the concentration of the metal ions in the electroplating bath is between 500 and 20,000 ppm. 28. The method of claim 1, wherein the dissolved metal ions are in the form of a metal sulfate, metal sulfamate, metal citrate, metal chloride, metal bromide, metal nitrate, or combinations thereof. 29. The method of claim 1, wherein the electroplating bath comprises aqueous nickel sulfate. 30. The method of claim 29, wherein the electroplating bath comprises between 2 and 12 grams of nickel sulfate per liter of the electroplating bath. 31. The method of claim 1, wherein the electroplating bath further comprises a reducing agent, a buffering agent, or a combination thereof. 32. The method of claim 1, wherein the electroplating bath further comprises a buffering agent selected from hypophosphite, formaldehyde, acetate, citrate, boric acid, and combinations thereof. 33. The method of claim 1, further comprising: agitating the electroplating bath to suspend the quasicrystalline metal alloy particles. 34. The method of claim 33, wherein the electroplating bath comprises between 25 and 150 grams of suspended quasicrystalline metal alloy particles per liter of electroplating bath. 35. The method of claim 1, wherein the quasicrystalline metal alloy particles have an average particle size less than 50 microns. 36. The method of claim 1, wherein the quasicrystalline metal alloy particles have an average particle size less than 20 microns. 37. The method of claim 1, wherein the at least one quasicrystalline metal alloy is selected from Al65Cu25Fe12, Al66Cu18Fe8Cr8, Al59Cu25.5Fe12.5B3, Al64Cu18Fe8Cr8, and combinations thereof. 38. The method of claim 1, wherein the working electrode is electronically conductive. 39. The method of claim 1, further comprising: moving at least one electrode during the electrocodeposition. 40. The method of claim 1, further comprising: electroplating a metal seal layer over a layer comprising the electrocodeposited quasicrystalline metal alloy particles. 41. The method of claim 40, wherein the metal seal layer is electroplated in a separate seal bath. 42. The method of claim 1, further comprising: repeatedly ramping the DC current between essentially zero current and a target current density. 43. The method of claim 42, wherein the target current density is between 2 and 100 mA/cm2. 44. The method of claim 42, wherein the target current density is about 40 mA/cm2. 45. The method of claim 42, wherein the ramping occurs in cycles between 10-2 and 105 Hertz. 46. The method of claim 1, wherein the at least one quasicrystalline metal alloy is Al65Cu23Fe12. 47. The method of claim 1, wherein the at least one quasicrystalline metal alloy is Al70Cu10Fe10Cr10. 48. The method of claim 1, wherein the ions of the at least one elemental metal include nickel ions. 49. The method of claim 48, wherein the nickel ion concentration is between 2 and 10 grams per liter of electroplating bath. 50. The method of claim 1, wherein the at least one elemental metal includes copper. 51. The method of claim 1, further comprising: simultaneously performing the electrocodepositing step on multiple working electrodes in the same electroplating bath. 52. The method of claim 1, further comprising: annealing the particles of the at least one quasicrystalline metal alloy. 53. The method of claim 52, wherein the at least one quasicrystalline metal alloy is converted from the beta-phase to the quasicrystalline phase. 54. The method of claim 52, wherein the annealing is performed prior to electrocodepositing the particles. 55. The method of claim 52, wherein the annealing is performed after electrocodepositing the particles. 56. The method of claim 52, wherein the annealing is performed before and after electrocodepositing the particles. 57. The method of claim 52, wherein the at least one quasicrystalline metal alloy is annealed at a temperature between 500 and 700째 C. 58. The method of claim 52, characterized in that the annealing increases the ratio of quasicrystalline phase in the particles. 59. The method of claim 52, wherein the annealing is performed under an inert gas atmosphere. 60. The method of claim 1, further comprising: masking a portion of the working electrode to prevent electrocodeposition. 61. The method of claim 1, wherein the electroplating bath contains copper sulfate. 62. The method of claim 61, wherein the copper sulfate has a concentration between 0.1 and 0.6 grams of copper per liter of the bath. 63. The method of claim 1, further comprising a preliminary step selected from bead blasting the surface of the substrate, degreasing the substrate prior to electrocodepositing, and combinations thereof. 64. The method of claim 1, wherein the electroplating bath further comprises other metal alloy particles. 65. The method of claim 64, wherein the electroplating bath further comprises other metal alloy particles that are not quasicrystalline metal alloys. 66. The method of claim 1, wherein the particles of at least one quasicrystalline metal alloy are provided as a mixture of quasicrystalline metal alloy particles with other metal alloy particles having different compositions. 67. The method of claim 66, further comprising: depositing a composite coating comprising the mixture of alloy particles suspended in the electroplating bath. 68. A method, comprising: electrocodepositing particles of at least one quasicrystalline metal alloy and at least one elemental metal onto a working electrode disposed in an electroplating bath, wherein the electroplating bath comprises a solvent, ions of the at least one elemental metal dissolved in the solvent, and the particles of at least one quasicrystalline metal alloy suspended in the solvent; electroplating a metal seal layer over a layer comprising the electrocodeposited quasicrystalline metal alloy particles, wherein the metal seal layer is electroplated in a separate seal bath; and alternating the use of the seal bath and the electroplating bath containing the suspended particles of a quasicrystalline metal alloy. 69. The method of claim 68, further comprising: repeating the alternating use of the baths until a desired coating thickness is obtained.