초록 ▼

A air shroud for dissipating heat from an electronic component is composed of a air shroud of a roughly U-shaped cross section, whose left and right sides are formed into a first and a second opening, respectively. A passage is formed between the first and second openings, enabling air to flow along

A air shroud for dissipating heat from an electronic component is composed of a air shroud of a roughly U-shaped cross section, whose left and right sides are formed into a first and a second opening, respectively. A passage is formed between the first and second openings, enabling air to flow along a specific direction. A flexible thin piece is fixed inside the air shroud which covers a specific electronic component on a circuit board, and the flexible thin piece is touched with a surface of the electronic component. The fast-flowing air flows quickly along the passage, so as to effectively cool down a working temperature of the specific electronic component, thereby increasing a lifetime of usage of the specific electronic component.

대표청구항 ▼

What is claimed is: 1. A air shroud for dissipating heat from an electronic component comprising a air shroud of a pre-determined length and a roughly U-shaped cross section, which is provided with a first opening and a second opening interconnected to form a passage for air flow; a modularized com

What is claimed is: 1. A air shroud for dissipating heat from an electronic component comprising a air shroud of a pre-determined length and a roughly U-shaped cross section, which is provided with a first opening and a second opening interconnected to form a passage for air flow; a modularized computer case whose interior space is provided with two vertical walls separated by a pre-determined distance, including a first wall and a second wall, respectively; a circuit board being installed on a base plate of the computer case; the air shroud being covered on the circuit board, such that a specific electronic component on the circuit board can be located in the passage; the second opening being corresponding to and connected on the second wall; the first opening being corresponding to and connected on the first wall; a flexible thin piece of an arc-shaped surface being fixed on an internal wall surface inside the air shroud; the arc-shaped surface being able to be deformed to a straight surface to be touched with a top surface of the electronic component; air in the passage flowing quickly in the passage from the first opening to the second opening, to blow toward the electronic component below the thin piece, thereby effectively reducing a working temperature of the electronic component. 2. The air shroud for dissipating heat from an electronic component according to claim 1, wherein air openings and a projection part at peripheries of side edges of the air openings are located on the second wall, at least more than one air hole is located on a surface of the first wall, the second opening can be latched and fixed to the projection part of the second wall such that the second opening can be corresponding to and interconnected with the air openings, and the first opening can be latched and fixed to the first wall such that the first opening can be corresponding to and interconnected with the air holes. 3. The air shroud for dissipating heat from an electronic component according to claim 1, wherein a roughly elastic hook is located on the air shroud at an upper edge of the second opening, a projection piece is located on a wall surface of the second wall and is provided with a latch slot at a lower part of the projection piece such that the hook can be latched into the latch slot, an insertion hole is located on a surface of the first wall, and a transversal and protruded insertion piece is located on the air shroud above the first opening; the insertion piece being inserted into the insertion hole, and the air shroud being firmly fixed on the first wall and the second wall. 4. The air shroud for dissipating heat from an electronic component according to claim 1, wherein lower edges of a left side wall and a right side wall of the air shroud are connected to a plurality of stands with thin connectors respectively, and the stands can be broken along the connectors, upon being subjected to force, to form a notch which can provide for a holding of protruded electronic components on a surface of the circuit board. 5. The air shroud for dissipating heat from an electronic component according to claim 1, wherein an inner wall surface of the air shroud is provided with screw holes, the thin piece is provided with a left connection member and a right connection member, and bolts are first screwed to through-holes at the left and right connection members and then further screwed to the screw holes. 6. The air shroud for dissipating heat from an electronic component according to claim 1, wherein a volume of space at a middle section of the passage of the air shroud is smaller than an opening space defined by the first and second openings. 7. The air shroud for dissipating heat from an electronic component according to claim 1, wherein the fast-flowing air can be flowing toward the second opening from the first opening selectively. 8. The air shroud for dissipating heat from an electronic component according to claim 1, wherein the first wall is installed with a first fan and the second wall is installed with a second fan.