Substrate holding apparatus and polishing apparatus
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0312571
(2005-12-21)
|
등록번호 |
US-7311585
(2007-12-25)
|
우선권정보 |
JP-2001-372771(2001-12-06); JP-2001-379337(2001-12-12) |
발명자
/ 주소 |
- Togawa,Tetsuji
- Nabeya,Osamu
- Fukushima,Makoto
- Sakurai,Kunihiko
- Yoshida,Hiroshi
- Ichimura,Teruhiko
|
출원인 / 주소 |
|
대리인 / 주소 |
Wenderoth, Lind & Ponack, L.L.P.
|
인용정보 |
피인용 횟수 :
8 인용 특허 :
6 |
초록
▼
The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving
The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
대표청구항
▼
The invention claimed is: 1. A substrate holding apparatus for holding and pressing a substrate to be polished against a polishing surface, said substrate holding apparatus comprising: a top ring body for holding a substrate; an edge bag to be brought into contact with a peripheral portion of the s
The invention claimed is: 1. A substrate holding apparatus for holding and pressing a substrate to be polished against a polishing surface, said substrate holding apparatus comprising: a top ring body for holding a substrate; an edge bag to be brought into contact with a peripheral portion of the substrate, with a first pressure chamber defined in said edge bag; and a torque transmitting annular bag to be brought into contact with the substrate radially inwardly of said edge bag, said torque transmitting annular bag having communication holes for forming a second pressure chamber which includes a first space in said torque transmitting annular bag, a second space disposed radially inwardly of said torque transmitting annular bag, and a third space between said torque transmitting annular bag and said edge bag, wherein a pressure of said first pressure chamber and a pressure of said second pressure chamber are to be independently controlled. 2. The substrate holding apparatus according to claim 1, wherein said torque transmitting annular bag has a flange projecting outwardly or inwardly for contacting the substrate. 3. The substrate holding apparatus according to claim 1, wherein said edge bag comprises a member having a radial width in a range of from 1 mm to 10 mm. 4. The substrate holding apparatus according to claim 1, further comprising: a retainer ring secured to or formed integrally with said top ring body for holding a side edge portion of the substrate, wherein a pressing force to press said retainer ring against a polishing surface is to be controlled independently of the pressures of said first pressure chamber and said second pressure chamber. 5. A polishing apparatus comprising: a polishing table having a polishing surface; and a substrate holding apparatus for holding and pressing a substrate to be polished against said polishing surface, said substrate holding apparatus including: (i) a top ring body for holding the substrate, (ii) an edge bag to be brought into contact with a peripheral portion of the substrate, with a first pressure chamber defined in said edge bag, and (iii) a torque transmitting annular bag to be brought into contact with the substrate radially inwardly of said edge bag, said torque transmitting annular bag having communication holes for forming a second pressure chamber which includes a first space in said torgue transmitting annular bag, a second space disposed radially inwardly of said torgue transmitting annular bag, and a third space between said torgue transmitting annular bag and said edge bag, wherein a pressure of said first pressure chamber and a pressure of said second pressure chamber are to be independently controlled. 6. The polishing apparatus according to claim 5, wherein said torque transmitting annular bag has a flange projecting outwardly or inwardly for contacting the substrate. 7. The polishing apparatus according to claim 5, wherein said edge bag comprises a member having a radial width in a range of from 1 mm to 10 mm. 8. The polishing apparatus according to claim 5, wherein said substrate holding apparatus further includes a retainer ring secured to or formed integrally with said top ring body for holding a side edge portion of the substrate, with a pressing force to press said retainer ring against said polishing surface to be controlled independently of the pressures of said first pressure chamber and said second pressure chamber. 9. A method of polishing a substrate while holding the substrate by a top ring, said method comprising: bringing an edge bag of said top ring into contact with a peripheral portion of said substrate, with a first pressure chamber defined in said edge bag; bringing a torque transmitting annular bag of said top ring into contact with said substrate radially inwardly of said edge bag, with said torque transmitting annular bag having communication holes for forming a second pressure chamber which includes a first space in said torque transmitting annular bag, a second space disposed radially inwardly of said torque transmitting annular bag, and a third space between said torque transmitting annular bag and said edge bag; independently controlling a pressure of a said first pressure chamber and a pressure of said second pressure chamber; and pressing said substrate against a polishing surface. 10. The method according to claim 9, wherein said torque transmitting annular bag has a flange projecting outwardly or inwardly for contacting the substrate. 11. The method according to claim 9, wherein said edge bag comprises a member having a radial width in a range of from 1 mm to 10 mm. 12. The method according to claim 9, further comprising: holding a side edge portion of said substrate by a retainer ring secured to or formed integrally with a top ring body; pressing said retainer ring against said polishing surface under a pressing force; and controlling said pressing force of said retainer ring independently of the pressures of said first pressure chamber and said second pressure chamber.
이 특허에 인용된 특허 (6)
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Zuniga Steven M. ; Chen Hung Chih, Carrier head for chemical mechanical polishing a substrate.
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Steven M. Zuniga, Carrier head with controllable pressure and loading area for chemical mechanical polishing.
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Allan Gleason ; Manoocher Birang ; John Prince ; Mohsen Salek ; Syed Askari, Retainers and non-abrasive liners used in chemical mechanical polishing.
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Togawa, Tetsuji; Noji, Ikutaro; Namiki, Keisuke; Yasuda, Hozumi; Kojima, Shunichiro; Sakurai, Kunihiko; Takada, Nobuyuki; Nabeya, Osamu; Fukushima, Makoto; Takayanagi, Hideki, Substrate holding apparatus.
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Togawa,Tetsuji; Nabeya,Osamu; Fukushima,Makoto; Sakurai,Kunihiko; Yoshida,Hiroshi; Ichimura,Teruhiko, Substrate holding device and polishing device.
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Kondo, Fumio; Mishima, Koji; Tanaka, Akira; Suzuki, Yoko; Togawa, Tetsuji; Inoue, Hiroaki, Substrate processing method.
이 특허를 인용한 특허 (8)
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Obweger, Rainer, Apparatus for treating surfaces of wafer-shaped articles.
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Liu, Zhen Qiang, Breast pad construction with improved nipple concealment.
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Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Togashi, Shingo, Elastic membrane and substrate holding apparatus.
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Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Watanabe, Katsuhide; Namiki, Keisuke, Elastic membrane for semiconductor wafer polishing.
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Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Watanabe, Katsuhide; Namiki, Keisuke, Elastic membrane for semiconductor wafer polishing.
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Moriya, Norihiko, Polishing head capable of continuously varying pressure distribution between pressure regions for uniform polishing.
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Togawa, Tetsuji; Yoshida, Hiroshi; Nabeya, Osamu; Fukushima, Makoto; Fukaya, Koichi, Substrate holding apparatus and polishing apparatus.
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Togawa, Tetsuji; Yoshida, Hiroshi; Nabeya, Osamu; Fukushima, Makoto; Fukaya, Koichi, Substrate holding apparatus and polishing apparatus.
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