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Method for manufacturing microporous CMP materials having controlled pore size

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08J-009/28
  • C08J-009/00
출원번호 US-0265607 (2005-11-02)
등록번호 US-7311862 (2007-12-25)
발명자 / 주소
  • Prasad,Abaneshwar
출원인 / 주소
  • Cabot Microelectronics Corporation
인용정보 피인용 횟수 : 5  인용 특허 : 31

초록

A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to produce an interpenetrating polymeric

대표청구항

What is claimed is: 1. A method of manufacturing a chemical-mechanical polishing (CMP) pad comprising the steps of: (a) forming a layer of a polymer resin liquid solution; (b) inducing phase separation in the layer of polymer resin liquid solution to form an interconnected polymeric network compris

이 특허에 인용된 특허 (31)

  1. Hartfelt Jorgen (36 Berkeley Dr. Horsholm MA DKX) Hoehn Ralf (36 Berkeley Dr. Chelmsford MA 01824), Abrasive of a microporous polymer matrix with inorganic particles thereon.
  2. Kuramochi Hideto,JPX ; Kubota Yoshitaka,JPX, Abrasive shaped article, abrasive disc and polishing method.
  3. Birang Manoocher ; Pyatigorsky Grigory, Apparatus and method for in-situ monitoring of chemical mechanical polishing operations.
  4. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
  5. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
  6. Tupil Srinath P. ; Buchner Klaus,CHX ; Lahmann Patrick M., Lamination of microcellular articles.
  7. Burnham Theodore A. ; Cha Sung W. ; Walat Robert H. ; Kim Roland Y. ; Anderson Jere R. ; Stevenson James F. ; Suh Nam P. ; Pallaver Matthew, Method and apparatus for microcellular polymer extrusion.
  8. Blizard Kent ; Tupil Srinath ; Malavich William, Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby.
  9. Blizard Kent ; Okamoto Kelvin T. ; Anderson Jere R., Microcellular articles and methods of their production.
  10. Kuramochi Hideto,JPX ; Takato Shuji,JPX ; Kubota Yoshitaka,JPX, Molded abrasive product and polishing wheel using it.
  11. Roberts John V. H. ; Pinheiro Barry Scott ; James David B., Molded polishing pad having integral window.
  12. Treur Randolph E. ; Boyd John M. ; Wolf Stephan H., Optical view port for chemical mechanical planarization endpoint detection.
  13. Suzuki Kiyoshi,JPX ; Masumura Hisashi,JPX ; Fukami Teruaki,JPX, Polishing method for semiconductor wafer and polishing pad used therein.
  14. Otawa Kazuhiko,JPX ; Fukumoto Toshiyuki,JPX ; Kawakami Yasuaki,JPX, Polishing pad.
  15. Peter W. Freeman ; Stanley E. Eppert, Jr. ; Alan H. Saikin ; Marco A. Acevedo, Polishing pad.
  16. Anjur Sriram P. ; Downing William C., Polishing pad for a semiconductor substrate.
  17. Sevilla Roland K. ; Kaufman Frank B. ; Anjur Sriram P., Polishing pad for a semiconductor substrate.
  18. Yu Tat-Kwan (Austin TX) Yu Chris C. (Austin TX), Polishing pad for chemical-mechanical polishing of a semiconductor substrate.
  19. Takiyama Masahiro (Shiojiri JPX) Miyazaki Kunihiro (Shiojiri JPX) Shiozawa Kenichiro (Ashiya JPX), Polishing pad for semiconductor wafers.
  20. Pinheiro, Barry Scott; Naugler, Steven, Polishing pad having an advantageous micro-texture and methods relating thereto.
  21. Aiyer Arun A., Polishing pad thinning to optically access a semiconductor wafer surface.
  22. Roberts John V. H. (Newark DE), Polishing pads.
  23. Cook Lee M. (Steelville PA) Roberts John V. H. (Newark DE) Jenkins Charles W. (Newark DE) Pillai Raj R. (Newark DE), Polishing pads and methods for their use.
  24. Roberts John V. H. ; James David B. ; Cook Lee Melbourne, Polishing pads and methods relating thereto.
  25. David B. James ; Arun Vishwanathan ; Lee Melbourne Cook ; Peter A. Burke ; David Shidner, Polishing pads for chemical mechanical planarization.
  26. Sailesh Mansinh Merchant ; Sudhanshu Misra ; Pradip Kumar Roy, Polishing pads from closed-cell elastomer foam.
  27. Hsu, Oscar K.; Vangsness, Jean K.; Billings, Scott C.; Gilbride, David S., Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles.
  28. Kumar Vipin (Seattle WA), Polyethylene terephthalate foams with integral crystalline skins.
  29. Winings Richard H. (Berks County PA), Removably holding planar articles for polishing operations.
  30. Baker, III, Arthur Richard; Walls, Jr., Russell A.; Carter, Stephen P.; Hendron, Jeffrey J., Self-leveling pads and methods relating thereto.
  31. Kumar Vipin (Seattle WA) Schirmer Henry G. (Spartanburg SC), Semi-continuous production of solid state polymeric foams.

이 특허를 인용한 특허 (5)

  1. James, David B.; Sanford-Crane, Henry, Dual-pore structure polishing pad.
  2. Costeux, Stephane; Zhu, Lingbo; Jeon, Hyun; Bunker, Shana P.; Kalantar, Thomas H., Nanoporous polymeric foam having high cell density without nanofiller.
  3. Daubenspeck, Timothy H.; Gambino, Jeffrey P.; Misra, Ekta; Muzzy, Christopher D.; Sauter, Wolfgang, Plug via formation by patterned plating and polishing.
  4. Sargent, Elizabeth A.; Dow, David R.; Dunham, Grady A; Earl, Douglas E.; Lenzendorf, Jeffrey P., Polyurethane foam article.
  5. Luo, Shuiyuan; Jacob, George C.; Sanford-Crane, Henry; Yoshida, Koichi; Kawabata, Katsumasa; Kitawaki, Shusuke; Takahashi, Shogo; Takei, Yosuke, Thermoplastic poromeric polishing pad.
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