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A method of fabricating a photovoltaic solar cell is provided. A plurality of generally spherical semiconductor elements are provided. Each of the semiconductor elements has a core and an outer surface surface forming a p-n junction. An anti-reflection coating is deposited on the outer surface of ea

A method of fabricating a photovoltaic solar cell is provided. A plurality of generally spherical semiconductor elements are provided. Each of the semiconductor elements has a core and an outer surface surface forming a p-n junction. An anti-reflection coating is deposited on the outer surface of each of the semiconductor elements and each of the semiconductor elements is bonded into a perforated aluminum foil array thereby providing ohmic contact to a first side of the p-n junction. The anti-reflection coating is removed from a portion of each of the semiconductor elements and then the core is exposed, thereby allowing ohmic contact to be made to a second side of the p-n junction.

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What is claimed is: 1. A method of assembling a photovoltaic solar cell, said photovoltaic cell comprising a plurality of generally spherical semiconductor elements, each of said semiconductor elements having a core and an outer surface forming a p-n junction, said method comprising: depositing an

What is claimed is: 1. A method of assembling a photovoltaic solar cell, said photovoltaic cell comprising a plurality of generally spherical semiconductor elements, each of said semiconductor elements having a core and an outer surface forming a p-n junction, said method comprising: depositing an anti-reflection coating on the outer surface of each of said semiconductor elements; placing each of said semiconductor elements into a respective perforation formed in a reflective, conductive substrate and bonding said semiconductor elements to said substrate thereby resulting in ohmic contact between a first side of the p-n junction of each semiconductor element and said substrate; and exposing the core of each of said semiconductor elements. 2. The method of claim 1, wherein said depositing an anti-reflection coating comprises depositing a metal oxide on the outer surface of each of the semiconductor elements. 3. The method of claim 2, wherein said depositing an anti-reflection coating comprises depositing titanium dioxide on the outer surface of each of the semiconductor elements. 4. The method of claim 2, wherein depositing a metal oxide on the outer surface of each of the semiconductor elements comprises decomposing at least one metal alkoxide in a chemical vapor deposition reactor. 5. The method of claim 4, wherein decomposing at least one metal alkoxide comprises decomposing at least one of titanium isopropoxide, titanium ethoxide, and a mixture thereof in a chemical vapor deposition reactor. 6. The method of claim 2 wherein depositing a metal oxide on the outer surface of each of the semiconductor elements comprises sputter deposition of a metal coating from a target, followed by oxidation of said metal coating. 7. The method of claim 2 wherein depositing a metal oxide on the outer surface of each of the semiconductor elements comprises hydrolizing a metal alkoxide in a sol-gel process and condensing said metal alkoxide on the outer surface of each of the semiconductor elements during continuous moving. 8. The method of claim 1, wherein said depositing an anti-reflection coating comprises depositing a non-oxide composition on the outer surface of each of the semiconductor elements. 9. The method of claim 8, wherein said depositing an anti-reflection coating comprises depositing silicon nitride on the outer surface of each of the semiconductor elements. 10. The method of claim 8, wherein depositing the non-oxide composition on the outer surface of each of the semiconductor elements comprises decomposing source gases. 11. The method of claim 10, wherein said decomposing source gases includes decomposing ammonia with a gas selected from the group silane, chiorosilane, fluorosilane, and any combination thereof. 12. The method of claim 10, wherein said decomposing source gases includes using reactive plasma. 13. The method of claim 10, wherein depositing the non-oxide composition comprises decomposing source gas using reactive plasma. 14. The method of claim 1, wherein said bonding comprises thermo-compression bonding each of said semiconductor elements to said substrate, dissolving said anti-reflection coating at a bond line of each of said semiconductor elements and forming a bond between the substrate and each of said semiconductor elements. 15. The method of claim 14 wherein said substrate is an aluminum foil and wherein thermo-compression bonding comprises thermo-compression bonding at a temperature less than the eutectic temperature for aluminum silicide formation. 16. The method of claim 14 wherein said thermo-compression bonding comprises thermo-compression bonding at a temperature less than 577째 C. 17. The method of claim 1, wherein said exposing comprises subjecting each of said semiconductor elements to hydrofluoric acid. 18. The method of claim 17, wherein subjecting each of said semiconductor elements to hydrofluoric acid comprises at least one of spraying said semiconductor elements with a hydrofluoric acid, immersing said semiconductor elements in hydrofluoric acid, and applying a paste comprising hydrofluoric acid and an inert carrier to said semiconductor elements. 19. The method of claim 17, wherein said exposing comprises, prior to said subjecting, one of mechanical polishing and chemical-mechanical polishing. 20. The method of claim 1, wherein depositing said anti-reflection coating on the outer surface of each of the semiconductor elements further comprises continuous moving of said semiconductor elements by at least one of vibrating in trays, vibratory bowl tumbling, bowl tumbling, fluidized bed reacting, mechanical stirring, and a combination thereof to deposit a substantially uniform anti-reflection coating thickness of from about 600 to about 900 angstroms. 21. The method of claim 1, wherein depositing said anti-reflection coating on the outer surface of each of the semiconductor elements further comprises packing said semiconductor elements in a column and feeding source gases to said column to deposit a substantially uniform anti-reflection coating thickness of from about 600 to about 900 angstroms. 22. A method of assembling a photovoltaic solar cell comprising a plurality of generally spherical semiconductor elements, each of said semiconductor elements including p and n type semiconductor materials forming a p-n junction, said method comprising: depositing an anti-reflection coating on an outer surface of each of the semiconductor elements; bonding each of said semiconductor elements to a perforated aluminum foil such that a portion of each of said semiconductor elements extends through said perforated aluminum foil and ohmic contact is provided between said aluminum foil and one of said p and n type semiconductor materials; and on one side of said aluminum foil, for each semiconductor element, exposing the other of said p and n type semiconductor materials. 23. The method of claim 22, wherein said depositing comprises depositing a metal oxide on the outer surface of each of the semiconductor elements. 24. The method of claim 23, wherein said depositing comprises depositing titanium dioxide on the outer surface of each of the semiconductor elements. 25. The method of claim 23, wherein said depositing comprises sputter deposition of a metal coating from a target, followed by oxidation of said metal coating. 26. The method of claim 23, wherein said depositing comprises hydrolizing a metal alkoxide in a sol-gel process and condensing said metal alkoxide on the outer surface of each of the semiconductor elements during continuous moving. 27. The method of claim 22, wherein said depositing comprises depositing a non-oxide composition on the outer surface of each of the semiconductor elements. 28. The method of claim 27, wherein said depositing comprises depositing silicon nitride on the outer surface of each of the semiconductor elements. 29. The method of claim 27, wherein depositing the non-oxide composition on the outer surface of each of the semiconductor elements comprises decomposing a source gas selected from the group consisting of at least one of silane, chiorosilane, fluorosilane, and any combination thereof, with a nitrogen source. 30. The method of claim 29, wherein the nitrogen source is selected from the group consisting of ammonia and nitrogen. 31. The method of claim 22, wherein said bonding comprises thermo-compression bonding each of said semiconductor elements to said perforated aluminum foil, dissolving said anti-reflection coating at a bond line of each of said semiconductor elements and forming an aluminum-silicon bond between the foil and each of said semiconductor elements. 32. The method of claim 31 wherein said thermo-compression bonding comprises thermo-compression bonding at a temperature less than the eutectic temperature for aluminum silicide formation. 33. The method of claim 22, wherein said exposing comprises at least one of subjecting each of said semiconductor elements to a mixture of hydrofluoric acid and nitric acid, subjecting each of said semiconductor elements to a caustic etchant, mechanical polishing each of said semiconductor elements, and chemical-mechanical polishing each of said semiconductor elements. 34. The method of claim 22, wherein depositing an anti-reflection coating comprises continuous moving of said semiconductor elements by at least one of vibrating in trays, vibratory bowl tumbling, bowl tumbling, fluidized bed reacting, mechanical stirring, and a combination thereof to deposit a substantially uniform anti-reflection coating thickness of from about 600 to about 900 angstroms. 35. The method of claim 22 wherein depositing an anti-reflection coating comprises packing said semiconductor elements in a column and feeding source gases to said column to deposit a substantially uniform anti-reflection coating thickness of from about 600 to about 900 angstroms. 36. A method of assembling a photovoltaic solar cell comprising a reflective, conductive substrate having an array of hexagonal depressions therein and a plurality of generally spherical semiconductor elements, each of said semiconductor elements including p and n type semiconductor materials forming a p-n junction, and an anti-reflection coating on an outer surface thereof, said method comprising: bonding each semiconductor element to said substrate in a respective one of said depressions such that a portion of said semiconductor element extends through said substrate and ohmic contact is provided between the substrate and one of the p and n type semiconductor materials; and exposing, on one side of said substrate, the other of said p and n type semiconductor materials of each of said semiconductor elements. 37. The method of claim 36, wherein said bonding comprises thermo-compression bonding said semiconductor element to said substrate dissolving said anti-reflection coating at a bond line of each of said semiconductor elements and forming a bond between the substrate and each of said semiconductor elements. 38. The method of claim 37 wherein said substrate is an aluminum foil and wherein said thermo-compression bonding comprises thermo-compression bonding at a temperature less than the eutectic temperature for aluminum silicide formation. 39. The method of claim 36, wherein said exposing comprises at least one of subjecting each of said semiconductor elements to a mixture of hydrofluoric acid and nitric acid, subjecting each of said semiconductor elements to a caustic etchant, mechanical polishing each of said semiconductor elements, and chemical-mechanical polishing each of said semiconductor elements.