IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0229672
(2005-09-20)
|
등록번호 |
US-7312401
(2007-12-25)
|
우선권정보 |
JP-2004-273669(2004-09-21) |
발명자
/ 주소 |
- Tsukada,Kiyotaka
- Ninomaru,Terumasa
- Kizaki,Masaki
|
출원인 / 주소 |
|
대리인 / 주소 |
Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
|
인용정보 |
피인용 횟수 :
5 인용 특허 :
7 |
초록
▼
A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first condu
A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first conductor layer and the second conductor layer, wherein the first and third conductor layers extend through and beyond the bending part, and the second conductor layer is absent in the bending part.
대표청구항
▼
What is claimed is: 1. A flexible printed wiring board having three parts including an element mounting part, a folding part, and a board mounting part, which are laterally disposed in that order, the element mounting part being configured to mount circuit elements on both top and bottom surfaces o
What is claimed is: 1. A flexible printed wiring board having three parts including an element mounting part, a folding part, and a board mounting part, which are laterally disposed in that order, the element mounting part being configured to mount circuit elements on both top and bottom surfaces of the wiring board, the board mounting part being configured such that the top surface of the board mounting part can be mounted on an external circuit board, the flexible printed wiring board being configured to be folded over at the folding part around a virtual folding line that extends substantially in parallel with the wiring board such that the top surface of the wiring board faces an exterior when the flexible printed wiring board is bent, the flexible printed wiring board comprising: a bottom conductor pattern in the element mounting part, the bottom conductor pattern being configured to mount a first circuit element on the bottom surface of the wiring board through a first plurality of pads that are directly in contact with the bottom conductor pattern, the bottom conductor pattern being absent in the folding part: a lower insulating layer on the bottom conductor pattern in all of said three parts, the lower insulating layer having a first plurality of via holes in the element mounting part: a middle conductor pattern on the lower insulating layer in all of said three parts, portions of the middle conductor pattern being electrically in contact with portions of the bottom conductor pattern via said first plurality of via holes: an upper insulating layer on the middle conductor pattern in all of said three parts, the upper insulating layer having a second plurality of via holes in the element mounting part; and a top conductor pattern on the upper insulating layer in all of said three parts, the top conductor pattern in the element mounting part being configured to mount a second circuit element on the top surface of the wiring board through a second plurality of pads that are directly in contact with the top conductor pattern, the top conductor pattern in the board mounting part being configured to mount the flexible printed wiring board to an external circuit board through a plurality of pads that are directly in contact with the top conductor pattern, portions of the top conductor pattern being electrically in contact with portions of the middle conductor pattern via said second plurality of via holes, wherein the top conductor pattern includes a plurality of signal lines in the folding part that extends in parallel with each other in a direction that forms an angle of about 30째 to about 90째 with respect to the direction of the virtual folding line, wherein the middle conductor pattern includes a ground pattern configured to impart a ground potential, and the ground pattern has a solid pattern that covers substantially an entire area over which said plurality of signal lines are disposed in the folding part, wherein the upper and lower insulating layers are made of a fiber-reinforced resin having warps and wefis, and each have a thickness of about 25 μm to about 65 μm, and the warps or the wefts of said fiber-reinforced plastic extend in a direction that forms an angle of about 0째 to about 60째 with respect to the direction of the virtual folding line. 2. The flexible printed wiring board according to claim 1, wherein the top conductor pattern including a plurality of signal lines in the folding part, and wherein the middle conductor pattern includes a ground pattern configured to impart a ground potential, and the ground pattern has a solid pattern that covers substantially an entire area over which said plurality of signal lines are disposed in the folding part. 3. The flexible printed wiring board according to claim 2, wherein said plurality of signal lines of the top conductor pattern extends in parallel with each other in a direction that forms an angle of about 30 degree to about 90 degree with respect to the direction of the virtual folding line. 4. The flexible printed wiring board according to claim 1, wherein the upper and lower insulating layers are made of a fiber-reinforced resin. 5. The flexible printed wiring board according to claim 4, wherein said fiber-reinforced resin includes warps and wefts of fiber, and the warps or the wefts of said fiber-reinforced resin extend in a direction that forms an angle of about 0 degree to about 60 degree with respect to the direction of the virtual folding line. 6. The flexible printed wiring board according to claim 1, wherein the thickness of each of the upper and lower insulating layers is about 25 μm to about 65 μm. 7. The flexible printed wiring board according to claim 1, further comprising a first coverlay layer covering the bottom conductor pattern in the element mounting part, wherein the coverlay layer is absent in the folding part. 8. The flexible printed wiring board according to claim 7, further comprising a second coverlay layer covering the top conductor pattern in all of said three parts. 9. The flexible printed wiring board according to claim 1, wherein the bottom conductor pattern is further disposed under the lower insulating layer in the board mounting part, wherein the lower insulating layer has a third plurality of via holes in the board mounting part, and portions of the middle conductor pattern are electrically in contact with portions of the bottom conductor pattern in the board mounting part via said third plurality of via holes, wherein the upper insulating layer has a fourth plurality of via holes in the board mounting part, and portion of the top conductor pattern are electrically in contact with portions of the middle conductor pattern via said fourth plurality of via holes. 10. The flexible printed wiring board according to claim 1, wherein each of the first and second pluralities of pads has a multi-layered structure.
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