IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0307153
(2006-01-25)
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등록번호 |
US-7319588
(2008-01-15)
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발명자
/ 주소 |
|
출원인 / 주소 |
- Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
- Foxconn Technology Co., Ltd.
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대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
16 인용 특허 :
7 |
초록
▼
A heat dissipation assembly includes a printed circuit board, first and second heat dissipation units each defining a channel therein and a heat pipe. The printed circuit board has an electronic heat-generating component mounted thereon. The first heat dissipation unit is attached to a top surface o
A heat dissipation assembly includes a printed circuit board, first and second heat dissipation units each defining a channel therein and a heat pipe. The printed circuit board has an electronic heat-generating component mounted thereon. The first heat dissipation unit is attached to a top surface of the heat-generating component. The second heat dissipation unit has a main portion disposed beneath the printed circuit board and another portion extending from a level beneath the printed circuit board to another level above the printed circuit board. The heat pipe is wholly disposed above the printed circuit board and comprises an evaporating portion rotatably received in the channel of the first heat dissipation unit and a condensing portion rotatably received in the channel of the second heat dissipation unit.
대표청구항
▼
What is claimed is: 1. A heat dissipation assembly comprising: a printed circuit board having an electronic heat-generating component mounted thereon; a first heat dissipation unit attached to a top surface of the heat-generating component and defining a channel therein; a second heat dissipation u
What is claimed is: 1. A heat dissipation assembly comprising: a printed circuit board having an electronic heat-generating component mounted thereon; a first heat dissipation unit attached to a top surface of the heat-generating component and defining a channel therein; a second heat dissipation unit comprising a main portion disposed beneath the printed circuit board and another portion extending from a level beneath the printed circuit board to another level above the printed circuit board, the second heat dissipation unit defining a channel therein; a heat pipe wholly disposed above the printed circuit board and comprising an evaporating portion rotatably received in the channel of the first heat dissipation unit and a condensing portion rotatably received in the channel of the second heat dissipation unit. 2. The heat dissipation assembly as claimed in claim 1, further comprising two fasteners each having a nut and a bolt, the bolts extending through the first heat dissipation unit, the printed circuit board and the second heat dissipation unit and threadingly engaged in the nuts to have the first and second heat dissipation units installed to the printed circuit board. 3. The heat dissipation assembly as claimed in claim 1, wherein the first heat dissipation unit comprises a base member and a clamping member positioned on the base member. 4. The heat dissipation assembly as claimed in claim 3, wherein the base member defines a semicircular groove at a top side thereof, and wherein the clamping member defines a semicircular groove at a bottom side thereof, the semicircular groove of the base member and the semicircular groove of the clamping member commonly defining the channel of the first heat dissipation unit. 5. The heat dissipation assembly as claimed in claim 1, wherein the second heat dissipation unit comprises a base member and a clamping member positioned on the base member. 6. The heat dissipation assembly as claimed in 5, wherein the base member defines a semicircular groove at a top side thereof, and wherein the clamping member defines a semicircular groove at a bottom side thereof, the semicircular groove of the base member and the semicircular groove of the clamping member commonly define the channel of the second heat dissipation unit. 7. The heat dissipation assembly as claimed in claim 1, wherein the channel defined in the first heat dissipation unit is perpendicular to the channel defined in the second heat dissipation unit. 8. The heat dissipation assembly as claimed in claim 1, wherein the heat pipe further comprises an L-shaped connecting portion interconnecting the evaporating portion and the condensing portion. 9. The heat dissipation assembly as claimed in claim 1, wherein the heat pipe is L-shaped. 10. The heat dissipation assembly as claimed in claim 1, wherein the heat pipe is substantially U-shaped. 11. A heat dissipation assembly for dissipating heat of a heat-generating component mounted on a side of a printed circuit board, comprising: a heat pipe comprising an evaporating portion and a condensing portion, the heat pipe being adapted for being located on the side of the printed circuit board without extending to other side of the printed circuit board; a first heat dissipation unit comprising a base member defining screw holes therein, a clamping member defining through holes therein, and screws extending through the through holes and engagable in the screw holes at first position and second position, at the first position, the clamping member being loosely positioned to the base member to allow the first heat dissipation unit rotatable on the evaporating portion, at the second position, the clamping member securely connecting with the base member to allow the first heat dissipation unit securely engaged and thermally connected with the evaporating portion; and a second heat dissipation unit comprising a base member defining screws holes therein, a clamping member defining through holes therein and screws extending through the through holes and engagable in the screw holes of the base member of the second heat dissipation unit at third position and fourth position, at the third position, the clamping member of the second heat dissipation unit being loosely positioned to the base member of the second heat dissipation unit to allow the second heat dissipation unit rotatable on the condensing portion, at the fourth position, the clamping member of the second heat dissipation unit securely connecting with the base member of the second heat dissipation unit to allow the second heat dissipation unit securely engaged and thermally connected with the condensing portion. 12. The heat dissipation assembly as claimed in claim 11, wherein the first heat dissipation unit is adapted to be mounted on the side of the printed circuit board and the base member of the second heat dissipation unit comprises a substrate portion adapted to be mounted on a side of the printed circuit board opposite the side on which the heat-generating component is mounted and a support portion adapted to be extended from the opposite side of the printed circuit board to the side of the printed circuit board on which the heat-generating component is mounted. 13. The heat dissipation assembly as claimed in claim 12, wherein the substrate portion is adapted to be parallel to the printed circuit board and the support portion engages the clamping member of the second heat dissipation unit. 14. An electronic assembly comprising: a printed circuit board having a first side on which a heat-generating component is mounted and an opposite second side; a heat dissipation assembly having a first heat dissipation unit mounted on the first side of the printed circuit board and thermally connected with the heat-generating component and a second heat dissipation unit mounted on the second side of the printed circuit board, the second heat dissipation unit having a support portion extending from the second side to a place approximate the first side of the printed circuit board; and a heat pipe located on the first side of printed circuit board, having an evaporating portion thermally connected with the first heat dissipation unit and a condensing portion thermally connected with the support portion of the second heat dissipation unit; wherein the first heat dissipation unit has a base member thermally connecting with the heat-generating component, a first clamping member, and a first screw threadedly connecting the first clamping member and the base member together, the evaporating portion of the heat pipe being sandwiched between the first clamping member and the base member, the second heat dissipation unit has a second clamping member and a second screw threadedly connecting the second clamping member and the support portion together, the condensing portion of the heat pipe being sandwiched between the second clamping member and the support portion. 15. The electronic assembly as claimed in claim 14, wherein the first heat dissipation unit defines a first channel receiving the evaporating portion of the heat pipe and the second heat dissipation unit defines a second channel receiving the condensing portion of the heat pipe, the first channel being oriented perpendicular to the second channel. 16. The electronic assembly of claim 15, wherein the heat pipe has an L-shaped configuration. 17. The electronic assembly of claim 15, wherein the heat pipe has a middle portion interconnecting the evaporating portion and the condensing portion, the middle portion having an L-shaped configuration. 18. The electronic assembly of claim 15, wherein the first heat dissipation unit defines a first channel receiving the evaporating portion of the heat pipe and the second heat dissipation unit defines a second channel receiving the condensing portion of the heat pipe, the first channel being oriented parallel to the second channel. 19. The electronic assembly of claim 18, wherein the heat pipe has a U-shaped configuration. 20. The electronic assembly of claim 19 further comprising a fastener extending through the first heat dissipation unit, the printed circuit and the second heat dissipation unit to connect them together.
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