Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-001/18
출원번호
US-0944311
(2004-09-17)
등록번호
US-7319599
(2008-01-15)
우선권정보
JP-2003-343588(2003-10-01)
발명자
/ 주소
Hirano,Koichi
Yoshida,Tsunenori
Nakatani,Seiichi
출원인 / 주소
Matsushita Electric Industrial Co., Ltd.
대리인 / 주소
Hamre, Schumann, Mueller & Larson, P.C.
인용정보
피인용 횟수 :
22인용 특허 :
14
초록▼
A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The layer incorporating the capacitor
A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The layer incorporating the capacitor includes a ferromagnetic layer integrated with at least a portion of a surface of the capacitor, and in the circuit board or the layer incorporating the capacitor, a coil is wound around the capacitor, or an inductor component is disposed in parallel with the capacitor. Accordingly, a module incorporating a capacitor in which miniaturization, a higher density and a reduced thickness have been achieved, as well as a method for producing the module and a capacitor used for the module, are provided.
대표청구항▼
What is claimed is: 1. A module incorporating a capacitor, the module comprising a circuit board and a layer incorporating the capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor, wherein the
What is claimed is: 1. A module incorporating a capacitor, the module comprising a circuit board and a layer incorporating the capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor, wherein the layer incorporating the capacitor is formed of an inorganic filler and a cured thermosetting resin composition, and includes a ferromagnetic layer integrated with at least a portion of a surface of the capacitor, and wherein, in the circuit board or the layer incorporating the capacitor, a coil is wound around the capacitor, or an inductor component is disposed in parallel with the capacitor, wherein the coil is wound around the capacitor and is a longitudinal coil formed by wirings and via contacts of the circuit board that are disposed on both Sides of the layer incorporating the capacitor, and the ferromagnetic layer serves as a magnetic core of tile coil. 2. The module incorporating a capacitor according to claim 1, wherein a magnetic force diffused from the inductor component is returned to the inductor component with the ferromagnetic layer by disposing the ferromagnetic layer at least on the inductor component side when the capacitor and the inductor component are disposed in parallel. 3. The module incorporating a capacitor according to claim 1, wherein the capacitor is an electrolytic capacitor comprising: a valve metal including a capacitance forming portion and an electrode lead portion; a dielectric oxide film disposed on a surface of the valve metal; a solid electrolyte disposed on a surface of the capacitance forming portion, with the dielectric oxide film interposed between the solid electrolyte and the capacitance forming portion; and a current collector that is disposed on a surface of the solid electrolyte and is electrically insulated from the valve metal, and wherein the ferromagnetic layer is disposed on the current collector. 4. The module incorporating a capacitor according to claim 1, wherein the ferromagnetic layer is a ferromagnetic foil bonded onto the capacitor. 5. The module incorporating a capacitor according to claim 1, wherein the ferromagnetic layer is formed of a mixture containing ferromagnetic particles and a resin. 6. The module incorporating a capacitor according to claim 5, wherein the resin is a thermosetting resin. 7. The module incorporating a capacitor according to claim 5, wherein the mixture containing the ferromagnetic particles and the resin is exposed on a surface of the capacitor. 8. The module incorporating a capacitor according to claim 1. wherein the capacitor is an electrolytic capacitor comprising: a valve metal including a capacitance forming portion and an electrode lead portion; a dielectric oxide film disposed on a surface of the valve metal; a solid electrolyte disposed on a surface of the capacitance forming portion, with the dielectric oxide film interposed between the solid electrolyte and the capacitance forming portion; and a current collector that is disposed on a surface of the solid electrolyte and is electrically insulated from the valve metal, and wherein the current collector is formed of a mixture containing ferromagnetic particles and a resin. 9. The module incorporating a capacitor according to claim 1, wherein a surface of the ferromagnetic layer that is not in contact with the capacitor has a shape of a concave polygon. 10. The module incorporating a capacitor according to claim 9, wherein the concave polygon is a cross-shape, a T-shape or a U-shape. 11. The module incorporating a capacitor according to claim 1, wherein the wiring layer of the circuit board and the electrodes of the capacitor are electrically connected via a conductive adhesive containing a conductive powder and a thermosetting resin.
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