초록 ▼

A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally coupled to the active electronic components and that has a tubing therewithin. The radiator includes a pipe a

A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally coupled to the active electronic components and that has a tubing therewithin. The radiator includes a pipe and baffles attached to the pipe, where one end of the pipe is connected to one end of the tubing. A pump, connected to the other ends of the tubing and pipe, circulates coolant through the pipe and tubing to transfer thermal energy from the metal block to the radiator. The mechanism also includes a heat sink that is thermally coupled to the metal block via a thermal transfer plate. A fan unit of the mechanism generates and directs an air flow toward the radiator, metal block and heat sink, where the air flow removes the thermal energy therefrom.

대표청구항 ▼

What is claimed is: 1. A graphics card apparatus with improved heat dissipation, comprising: a metal block thermally coupled to one or more electronic components of said graphics card apparatus and including a tubing forming a tortuous passage for fluid therewithin, said tubing having an inlet end

What is claimed is: 1. A graphics card apparatus with improved heat dissipation, comprising: a metal block thermally coupled to one or more electronic components of said graphics card apparatus and including a tubing forming a tortuous passage for fluid therewithin, said tubing having an inlet end and an exit end; a radiator including a pipe having an inlet end and an exit end and baffles thermally coupled to said pipe, the inlet end of said pipe being connected to the exit end of said tubing; a pump having first and second ports respectively connected to the inlet end of said tubing and the exit end of said pipe, said pump being operative to circulate coolant through said pipe and said tubing and thereby to transfer thermal energy from said metal block to said radiator; a fan for generating an air flow and a carrier for said fan; and an enclosure surrounding said radiator and metal block, and forming an air passage from said fan to said metal block and thence to said radiator, said enclosure including a generally planar cover plate and a flow director that includes two generally elongated strips and is positioned beneath said cover plate; whereby thermal energy generated by the electronic components is transferred to said metal block and thence to said radiator via said coolant and is ultimately removed from said radiator by an air flow drawn into said air passage. 2. A graphics card apparatus as recited in claim 1, wherein said cover plate is made of heat conducting material and is operative to sink a portion of thermal energy generated by the electronic components. 3. A graphics card apparatus as recited in claim 1, wherein said fan carrier includes a base plate having an opening for accommodating said fan and carries a plurality of vanes that are formed on said base plate and are configured to direct an air flow generated by said fan toward said air passage. 4. A graphics card apparatus as recited in claim 1, further including: a thermal transfer plate thermally coupled to said metal block; a heat sink having one or more radiators that are thermally coupled to said thermal transfer plate; and one or more thermal transfer means for affixation to said electronic components and adapted to be thermally coupled to said heat sink; whereby thermal energy generated by said electronic components is transferred to said heat sink and thermal transfer plate and is removed from said heat sink and thermal transfer plate by an air flow generated by said fan. 5. A graphics card apparatus as recited in claim 4, further including one or more thermal transfer blocks of heat conductive material having a plurality of passageways extending therethrough for receiving an air flow generated by said fan, each said thermal transfer block being adapted to transfer thermal energy from one of the electronic components to said thermal transfer plate. 6. A graphics card apparatus as recited in claim 5, wherein each said thermal transfer block includes a generally planar bottom surface for engaging the top surface of one of the electronic components and a top surface adapted to transfer thermal energy to said thermal transfer plate. 7. A graphics card apparatus as recited in claim 6, further comprising a thermally conductive compound disposed between said thermal transfer plate and said thermal transfer blocks. 8. A graphics card apparatus as recited in claim 4, further comprising a thermally conductive compound disposed between said thermal transfer plate and said metal block. 9. A graphics card apparatus as recited in claim 4, further including an insulating plate that prevents an air flow dissipating thermal energy of said heat sink from heating said radiator. 10. A graphics card apparatus as recited in claim 9, wherein said enclosure includes a generally planar cover plate and a flow director that includes two generally elongated strips and is positioned beneath said cover plate, further including a first plurality of risers disposed proximate at least some of the corners of said insulating plate and adapted to secure said insulating plate in spaced apart relationship to said cover plate. 11. A graphics card apparatus as recited in claim 10, further including a printed circuit board for mounting said electronic components thereto and a second plurality of risers that are disposed proximate at least some of the corners of said insulating plate and that are adapted to secure said insulating plate in spaced apart relationship to said printed circuit board. 12. A graphics card apparatus as recited in claim 11, further including a third plurality of risers disposed proximate at least some of the corners of said cover plate and adapted to secure said cover plate in spaced apart relationship to said printed circuit board. 13. In a graphics card assembly including a printed circuit board with a plurality of heat generating components affixed thereto, and a heat dissipating mechanism also affixed to said printed circuit board for removing thermal energy from the heat generating components, an improved heat dissipating mechanism comprising: a metal block thermally coupled to said components and including a tubing forming a tortuous passage for fluid therewithin, said tubing having an inlet end and an exit end; a radiator including a pipe having an inlet end and an exit end and baffles thermally coupled to said pipe, the inlet end of said pipe being connected to the exit end of said tubing; a pump having a first and second ports respectively connected to the inlet end of said tubing and the exit end of said pipe, said pump being operative to circulate coolant through said pipe and said tubing and thereby to transfer thermal energy from said metal block to said radiator; a fan for generating an air flow and a carrier for said fan; and an enclosure surrounding said radiator and metal block, and forming an air passage from said first fan to said metal block and thence to said radiator, said enclosure including a generally planar cover plate and a flow director that includes two generally elongated strips and is positioned beneath said cover plate; whereby thermal energy generated by the components is transferred to said metal block and thence to said radiator via said coolant and ultimately removed from said radiator by an air flow drawn into said air passage. 14. In a graphics card assembly as recited in claim 13, further comprising an end plate having a plurality of apertures through which said fan draws air. 15. In a graphics card assembly as recited in claim 13, wherein said fan carrier includes a base plate having an opening for accommodating said fan and carries a plurality of vanes that are formed on said base plate and are configured to direct an air flow generated by said fan toward said air passage. 16. In a graphics card assembly as recited in claim 13, further comprising: a thermal transfer plate thermally coupled to said metal block; a heat sink having one or more radiators that are thermally coupled to said thermal transfer plate; and one or more thermal transfer means for affixation to said electronic components and adapted to be thermally coupled to said heat sink; wherein thermal energy generated by said electronic components is transferred to said heat sink and thermal transfer plate and is removed from said heat sink and thermal transfer plate by an air flow generated by said fan. 17. In a graphics card assembly as recited in claim 16, further including one or more thermal transfer blocks of heat conductive material having a plurality of passageways extending therethrough for receiving an air flow generated by said fan, each said thermal transfer block being adapted to transfer thermal energy from one of the electronic components to said thermal transfer plate. 18. In a graphics card assembly as recited in claim 17, wherein each said thermal transfer block includes a generally planar bottom surface for engaging the top surface of one of the electronic components and a top surface adapted to transfer thermal energy to said thermal transfer plate.