초록 ▼

A modular electronic device where (predominantly) sealed modules are aligned and attached/connected in pre-determined sequences, forming a robust block-like structure with extendable function: Control and/or inter-module communication are implemented without direct electrical interconnect, by non-co

A modular electronic device where (predominantly) sealed modules are aligned and attached/connected in pre-determined sequences, forming a robust block-like structure with extendable function: Control and/or inter-module communication are implemented without direct electrical interconnect, by non-contact means such as (magnetic, inductive, light, infrared, radio frequency, sound, ultrasound, or other non-contact means). This device's inter-module power transfer may be with or without direct electrical contact, or devices may be internally powered. Power transfer through inductive/transformer action where one or more alignment pins are used as transformer core is one potential implementation. Modules may be fluid filled to facilitate cooling and/or crush resistance to high-pressure environments.

대표청구항 ▼

The invention claimed is: 1. A modular electronic device, comprising: a first electronic module including a first communication mechanism configured to facilitate transmission and reception of high speed communication input/output signals; a second electronic module including a second communication

The invention claimed is: 1. A modular electronic device, comprising: a first electronic module including a first communication mechanism configured to facilitate transmission and reception of high speed communication input/output signals; a second electronic module including a second communication mechanism configured to facilitate transmission and reception of high speed communication input/output signals with the first electronic module without direct electrical contact; a third electronic module including a third communication mechanism configured to facilitate transmission and reception of high speed communication input/output signals with other first and second modules without direct electrical contact; an alignment attachment mechanism constructed to align and retain the modules relative together to one another; wherein the alignment attachment mechanism comprises a plurality of first protrusions and plurality of holes on each of the first, second and third electronic modules; and wherein the plurality of the protrusions physically engaging the holes; and wherein the high speed communication input/output signals are transmitting and receiving between the modules via the alignment attachment mechanism without electrical contact. 2. A modular electronic device as in claim 1, wherein the alignment attachment mechanism is constructed to rigidly retain the first, second and third electronic modules together. 3. A modular electronic device as in claim 1, wherein the alignment attachment mechanism comprises a magnet coupled the first, second and third electronic modules together. 4. A modular electronic device as in claim 1, wherein the alignment attachment mechanism comprises a metallic protrusion on one of the first, second and third electronic modules and a hole comprising magnet on the other of the first, second and third electronic modules.