IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0236471
(2005-09-27)
|
등록번호 |
US-7324336
(2008-01-29)
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발명자
/ 주소 |
- Vos,David L.
- Stutzman,Randall J.
- Larcheveque,Jon
- Urda,Eugene J.
|
출원인 / 주소 |
- Lockheed Martin Corporation
|
대리인 / 주소 |
Wolf, Greenfield & Sacks, P.C.
|
인용정보 |
피인용 횟수 :
11 인용 특허 :
31 |
초록
▼
A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral
A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral with the chassis. The cooling assembly includes a housing having a first end and a second end and defining one or more fluid passages. The housing further includes a thermal contact surface to contact the conduction-cooled circuit module. The cooling assembly may be configured for air-flow-through or liquid-flow-through cooling of the conduction-cooled circuit module.
대표청구항
▼
What is claimed is: 1. A cooling adapter for operation with a conduction-cooled circuit module, comprising: an adapter housing having a first end and a second end and defining one or more fluid passages between the first and second end, said adapter housing further including a thermal contact surfa
What is claimed is: 1. A cooling adapter for operation with a conduction-cooled circuit module, comprising: an adapter housing having a first end and a second end and defining one or more fluid passages between the first and second end, said adapter housing further including a thermal contact surface to contact the conduction-cooled circuit module, wherein the adapter housing includes a first rib having a thermal contact surface at the first end and a second rib having a thermal contact surface at the second end; an inlet, located at the first end and coupled to the fluid passages, to receive a cooling fluid; and an outlet, located at the second end and coupled to the fluid passages, to exhaust the cooling fluid from the adapter. 2. A cooling adapter as defined in claim 1, wherein the adapter housing is configured for air-flow-through cooling. 3. A cooling adapter as defined in claim 2, wherein the inlet and the outlet are each configured to engage a chassis plenum for receiving and exhausting cooling air. 4. A cooling adapter as defined in claim 1, wherein the adapter housing is configured for liquid-flow-through cooling. 5. A cooling adapter as defined in claim 4, wherein the inlet and the outlet are configured to engage fluid connectors. 6. A cooling adapter as defined in claim 1, wherein the adapter housing includes heat exchanger fins to conduct thermal energy from the thermal contact surface to the cooling fluid. 7. A circuit module chassis assembly for operation with a conduction-cooled circuit module, comprising: a chassis including spaced-apart first and second sidewalls; a cooling assembly in the chassis, the cooling assembly comprising: a housing having a first end that engages the first sidewall of the chassis and a second end that engages the second sidewall of the chassis, the housing defining one or more fluid passages between the first and seconds ends, the housing further including a thermal contact surface to contact the conduction-cooled circuit module, wherein the housing is provided with ribs at the first and second ends, the ribs having thermal contact surfaces to contact the conduction-cooled circuit module; an inlet, located at the first end and coupled to the fluid passages, to receive a cooling fluid; and an outlet, located at the second end and coupled to the fluid passages, to exhaust the cooling fluid from the cooling assembly; and a cooling fluid source coupled to the inlet of the cooling assembly. 8. A circuit module chassis assembly as defined in claim 7, wherein the cooling fluid source is configured to supply air to the cooling assembly. 9. A circuit module chassis assembly as defined in claim 8, wherein the first sidewall of the chassis includes an air plenum coupled to the inlet of the cooling assembly and the second sidewall of the chassis includes an air plenum coupled to the outlet of the cooling assembly. 10. A circuit module chassis assembly as defined in claim 7, wherein the cooling fluid source is configured to supply a liquid to the cooling assembly. 11. A circuit module chassis assembly as defined in claim 10, wherein the cooling fluid source is coupled to the inlet of the cooling adapter by a first fluid connector and wherein the outlet of the cooling adapter is coupled by a second fluid connector to the cooling fluid source to form a closed-loop cooling fluid system. 12. A circuit module chassis assembly for operation with a conduction-cooled circuit module, comprising: a chassis including spaced-apart first and second sidewalls; a cooling assembly in the chassis, the cooling assembly comprising: a housing having a first end secured to the first sidewall of the chassis and a second end secured to the second sidewall of the chassis, the housing defining one or more fluid passages between the first and seconds ends, the housing further including a thermal contact surface to contact the conduction-cooled circuit module, wherein the housing is provided with ribs at the first and second ends, the ribs having thermal contact surfaces to contact the conduction-cooled circuit module; an inlet, located at the first end and coupled to the fluid passages, to receive a cooling fluid; and an outlet, located at the second end and coupled to the fluid passages, to exhaust the cooling fluid from the cooling assembly; and a cooling fluid source coupled to the inlet of the cooling assembly, wherein the cooling assembly is an integral part of the chassis. 13. A circuit module assembly as defined in claim 7, wherein the cooling assembly comprises a cooling adapter that is removable from the chassis. 14. A circuit module chassis assembly as defined in claim 7, wherein the housing includes thermal contact surfaces at the first and second ends to contact the conduction-cooled circuit module. 15. A circuit module chassis assembly as defined in claim 7, wherein the housing includes heat exchanger fins to conduct thermal energy from the thermal contact surface to the cooling fluid. 16. A circuit module chassis assembly as defined in claim 13, wherein the first and second sidewalls of the chassis each include spaced-apart rails and wherein the cooling adapter is pressed into thermal contact with the conduction-cooled circuit module between the rails of each of the sidewalls. 17. A circuit module chassis assembly as defined in claim 7, further comprising a conduction-cooled circuit module mounted in the chassis in thermal contact with the cooling assembly.
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