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Apparatus and method for electrochemically depositing metal on a semiconductor workpiece

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-007/12
  • C25D-017/00
  • C25D-017/12
  • C25D-017/10
출원번호 US-0053050 (2005-02-07)
등록번호 US-7332066 (2008-02-19)
발명자 / 주소
  • Chen,Linlin
  • Wilson,Gregory J.
  • McHugh,Paul R.
  • Weaver,Robert A.
  • Ritzdorf,Thomas L.
출원인 / 주소
  • Semitool, Inc.
대리인 / 주소
    Klarquist Sparkman, LLP
인용정보 피인용 횟수 : 11  인용 특허 : 385

초록

A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has bee

대표청구항

The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows: 1. A process for applying a metallization interconnect structure, comprising: (a) providing a workpiece comprising a surface on which a copper metal seed layer is to be formed; (b) using

이 특허에 인용된 특허 (385)

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  183. Hugues Jean B. (Tempe AZ) Weber Lynn (Saratoga CA) Herlinger James E. (Palo Alto CA) Nishikawa Katsuhito (San Jose CA) Schuman Donald L. (Saratoga CA) Yee Gary W. (Santa Clara CA), Method and apparatus for transferring wafers between cassettes and a boat.
  184. Reid Jonathan David ; Taatjes Steve, Method and apparatus for treating surface including virtual anode.
  185. Steven T. Mayer ; Richard Hill ; Alain Harrus ; Evan Patton ; Robert Contolini ; Steve Taatjes ; Jon Reid, Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element.
  186. Mayer, Steven T.; Patton, Evan E.; Blackman, Brian Paul; Reid, Jonathan D.; Ponnuswamy, Thomas Anand; Perry, Harold D., Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources.
  187. Botts Robert R. ; Joshi Swati V. ; Nicholls Louis W., Method and apparatus using an anode basket for electroplating a workpiece.
  188. Gibbs Stephen R. (Escondido CA), Method for chemically treating a single side of a workpiece.
  189. Gevelber Michael A. ; Toledo-Quinones Manuel, Method for closed loop control of chemical vapor deposition process.
  190. Tisdale Stephen L. (Vestal NY) Viehbeck Alfred (Stormville NY), Method for conditioning a substrate for subsequent electroless metal deposition.
  191. Kwok Kurt (Mountain View CA) Robertson Robert (Palo Alto CA), Method for depositing ozone/TEOS silicon oxide films of reduced surface sensitivity.
  192. Freeman Dean W. (Plano TX) Luttmer Joseph D. (Richardson TX) Smith Patricia B. (Euless TX) Davis Cecil J. (Greenville TX), Method for deposition of silicon oxide on a wafer.
  193. Chen, Linlin; Wilson, Gregory J.; McHugh, Paul R.; Weaver, Robert A.; Ritzdorf, Thomas L., Method for electrochemically depositing metal on a semiconductor workpiece.
  194. Greenspan Alex, Method for electroforming an optical disk stamper.
  195. Chen Linlin, Method for electrolytically depositing copper on a semiconductor workpiece.
  196. Ang Jane, Method for electroplating metal films including use a cathode ring insulator ring and thief ring.
  197. Dubin Valery ; Ting Chiu, Method for fabricating copper-aluminum metallization.
  198. Sandhu Gurtej Sandhu (Boise ID) Yu Chris Chang (Aurora IL), Method for forming a metallization layer.
  199. Farooq Mukta S. (Hopewell Junction NY) Kaja Suryanarayana (Hopewell Junction NY) Perfecto Eric D. (Poughkeepsie NY) White George E. (Hoffman Estates IL), Method for forming capped copper electrical interconnects.
  200. Rugowski James S. (Appleton WI) Rekoske Michael J. (Appleton WI) Lin Philip S. (Tulsa OK) Gropp Ronald F. (St. Catharines CAX) Arnold Paul A. B. L. M. (Nancy FRX), Method for making uncreped throughdried tissue products without an open draw.
  201. Ross ; John P. ; Bernardi ; Carl E., Method for plating semiconductor chip headers.
  202. Akimoto Masami (Kumamoto JPX) Yoshioka Kazutoshi (Kumamoto JPX) Iida Naruaki (Kumamoto JPX), Method for processing wafer-shaped substrates.
  203. Dubin Valery ; Nogami Takeshi, Method for reducing oxidation of electroplating chamber contacts and improving uniform electroplating of a substrate.
  204. Adams John A. ; Krulik Gerald A. ; Smith Everett D., Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly.
  205. Polichette Joseph (South Farmingdale NY) Leech Edward J. (Oyster Bay NY), Method for the production of radiant energy imaged printed circuit boards.
  206. Ward William R. (Columbus OH), Method of and apparatus for automatically grinding cathode ray tube faceplates.
  207. Kazama Kouichi (Yamanashi-ken JPX) Komino Mitsuaki (Tokyo JPX) Ishikawa Kenji (Sagamihara JPX) Ueda Yoichi (Yokohama JPX), Method of controlling temperature of susceptor.
  208. Raaijmakers Ivo, Method of cooling wafers.
  209. Patton Evan E. ; Fetters Wayne, Method of depositing metal layer.
  210. Weaver Charles A. (Indianapolis IN), Method of electroplating a conductive layer over an electrolytic capacitor.
  211. Nogami Takeshi ; Dubin Valery ; Cheung Robin, Method of electroplating a copper or copper alloy interconnect.
  212. Matsunami Takashi,JPX ; Ikeda Masahiko,JPX ; Oka Hiroyuki,JPX, Method of electroplating non-conductive materials.
  213. Reid Jonathan D. ; Contolini Robert J. ; Opocensky Edward C. ; Patton Evan E. ; Broadbent Eliot K., Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer.
  214. Reid Jonathan D. ; Contolini Robert J. ; Opocensky Edward C. ; Patton Evan E. ; Broadbent Eliot K., Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer.
  215. Reid Jonathan D. ; Contolini Robert J. ; Opocensky Edward C. ; Patton Evan E. ; Broadbent Eliot K., Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer.
  216. Cole ; Jr. Herbert Stanley ; Daum Wolfgang, Method of fabricating metallized vias with steep walls.
  217. Asano Takanobu (Yokohama JPX) Iwai Hiroyuki (Sagamihara JPX) Ono Yuji (Sagamihara JPX), Method of loading and unloading wafer boat.
  218. Andricacos, Panayotis Constantinou; Deligianni, Hariklia; Dukovic, John Owen; Edelstein, Daniel Charles; Horkans, Wilma Jean; Hu, Chao-Kun; Hurd, Jeffrey Louis; Rodbell, Kenneth Parker; Uzoh, Cyprian, Method of making electroplated interconnection structures on integrated circuit chips.
  219. Yamakawa Koji (Tokyo JPX) Koiwa Kaoru (Tokyo JPX) Iwase Nobuo (Kamakura JPX), Method of manufacturing semiconductor device and apparatus therefor.
  220. Arledge John K. (Ft. Lauderdale FL) Swirbel Thomas J. (Davie FL) Barreto Joaquin (Coral Springs FL), Method of metallizing high aspect ratio apertures.
  221. Nomura Takuji (Otsu JPX) Watanabe Hiroshi (Sagamihara JPX), Method of plating a bonded magnet and a bonded magnet carrying a metal coating.
  222. Beach Sidney C. (Parma OH) Fellman Jack D. (Brunswick OH), Method of plating plastics.
  223. Kubo Toyoshige (Hitachi JPX) Fujishima Katsuhiko (Hitachi JPX) Yamamoto Narito (Hitachi JPX), Method of producing electrolytic copper foil and apparatus for producing same.
  224. Christopher A. Hofmeister, Method of transferring substrates with two different substrate holding end effectors.
  225. Hermans Michael A. (Neenah WI) Makolin Robert J. (Neenah WI) Goerg Kristin A. (Appleton WI) Chen Fung-Jou (Appleton WI), Method of treating papermaking fibers for making tissue.
  226. Hermans Michael A. (Neenah WI) Makolin Robert J. (Neenah WI) Goerg-Wood Kristin A. (Appleton WI) Chen Fung-jou (Appleton WI), Method of treating papermaking fibers for making tissue.
  227. Uzoh Cyprian Emeka ; Edelstein Daniel C., Method to plate C4 to copper stud.
  228. Uzoh Cyprian Emeka ; Greco Stephen Edward, Method to selectively fill recesses with conductive metal.
  229. Woodruff Daniel J. ; Hanson Kyle M. ; Oberlitner Thomas H. ; Chen LinLin ; Pedersen John M. ; Zila Vladimir,CAX, Methods and apparatus for processing the surface of a microelectronic workpiece.
  230. Woodruff Daniel J. ; Hanson Kyle M. ; Oberlitner Thomas H. ; Chen LinLin ; Pedersen John M. ; Zila Vladimir,CAX, Methods and apparatus for processing the surface of a microelectronic workpiece.
  231. Woodruff Daniel J. ; Hanson Kyle M. ; Oberlitner Thomas H. ; Chen LinLin ; Pedersen John M. ; Zila Vladimir,CAX, Methods and apparatus for processing the surface of a microelectronic workpiece.
  232. Bacon Duane E. (Lee\s Summit MO) Hecox Spencer S. (Raytown MO), Methods of and apparatus for electroplating preselected surface regions of electrical articles.
  233. Bayne Christopher J. (Lightwater GB2), Methods of and apparatus for transferring articles between carrier members.
  234. Song Minkyu,KRX, Methods of designing and fabricating intergrated circuits which take into account capacitive loading by the intergrated circuit potting material.
  235. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multi-chamber integrated process system.
  236. Bergman Eric J. (Kalispell MT) Reardon Timothy J. (Kalispell MT) Thompson Raymon F. (Lakeside MT) Owczarz Aleksander (Kalispell MT), Multi-station semiconductor processor with volatilization.
  237. Shue Shau-Lin,TWX ; Tsai Ming-Hsing,TWX ; Tsai Wen-Jye,TWX ; Yu Chen-Hua,TWX, Multi-step electrochemical copper deposition process with improved filling capability.
  238. Moslehi Mehrdad M. ; Lee Yong Jin ; Kermani Ahmad ; Messner William J., Multi-zone illuminator for rapid thermal processing.
  239. Kobayashi Masahiko,JPX ; Ishihara Masahito,JPX ; Takahashi Nobuyuki,JPX, Multichamber sputtering apparatus.
  240. Arbach Gary V. (Mahopac NY) O\Toole Terrence R. (Hopewell Junction NY) Viehbeck Alfred (Stormville NY), Multilayer structures of different electroactive materials and methods of fabrication thereof.
  241. Schaper Charles D. ; El-Awady Khalid A. ; Kailath Thomas, Multizone bake/chill thermal cycling module.
  242. Hackler Ronald E. (Indianapolis IN) Johnson Peter L. (Indianapolis IN), N-(4-pyridyl) (substituted phenyl) acetamide pesticides.
  243. Cook Ronald F. (Marietta GA) Westbrook Daniel S. (Farragut TN), Non-creped hand or wiper towel.
  244. Lange, Bradley N., Object detection apparatus and method.
  245. Young ; Jr. David J. (Phoenix AZ) Randall Scott L. (Mesa AZ) Shaw Scott D. (Chandler AZ) Wylde Andrew F. (Tempe AZ), Oscillation device for plating system.
  246. Allum Andrew (Darwen GBX) Sayers Ian C. (Ribchester GBX) Saunders Thomas (Blackburn GBX), Papermachine clothing.
  247. Lee Henry J. (Summerville SC), Papermakers fabric having diverse flat machine direction yarn surfaces.
  248. Albert, Hans, Papermakers fabric of nonwoven layers in a laminated construction.
  249. Smurkoski John A. (Meshoppen PA) Leggitt Gary L. (Springville PA) Wilson Gregory L. (Cincinnati OH), Papermaking belt and method of making the same using a textured casting surface.
  250. Spara Paul Patrick (Fairport NY) Krishnamurthy Sundaram (Penfield NY) Cowan Stanley Wray (Rochester NY) McGarry Ruthann M. (Fairport NY), Photographic element containing a recrystallizable 5-pyrazolone photographic coupler.
  251. Boff Jane Sarah (St. Albans GB2) Singer Stephen Paul (Spencerport NY), Photographic element containing an azopyrazolone masking coupler exhibiting improved keeping.
  252. Ting Chiu ; Dubin Valery, Plated copper interconnect structure.
  253. Hui Wang, Plating apparatus and method.
  254. Reynolds H. Vincent (Marcellus NY), Plating cell and plating method with fluid wiper.
  255. Reynolds H. Vincent (Marcellus NY), Plating cell having laminar flow sparger.
  256. Reynolds H. Vincent, Plating cell with horizontal product load mechanism.
  257. Reynolds H. Vincent, Plating cell with rotary wiper and megasonic transducer.
  258. Ishida Hirofumi (Hiratsuka JPX), Plating device for wafer.
  259. Ishida Hirofumi (Kanagawa JPX), Plating device for wafer.
  260. Takeuchi Hiromitsu,JPX ; Okumiya Masahiro,JPX ; Tsunekawa Yoshiki,JPX ; Kawai Yutaka,JPX, Plating method and apparatus.
  261. Shimamura Kouichi (Yokohama JPX), Plating process.
  262. Yee Ian Y. K. (Austin TX) Wehrly ; Jr. James D. (Austin TX), Plating rack.
  263. Cook John H. (Plymouth MI) Grinbergs Egils (Farmington Hills MI), Polyurethane foam composite.
  264. Tzanavaras George (2674 Park Wilshire Dr. San Jose CA 95124) Cohen Uri (765 San Antonio Rd. ; #53 Palo Alto CA 94303), Precision high rate electroplating cell and method.
  265. Skrobak Lubomir (Mountain View CA), Precision robot apparatus.
  266. Wielonski Roy F. (Worthington OH) Beale Harry A. (Columbus OH), Preparation of colored polymeric film-like coating.
  267. Minagawa Eiji,JPX, Preparation system for automatically preparing and processing a CAD library model.
  268. Luce Betty M. (Willowick OH) Berdan Betty L. (Willowick OH), Process and apparatus for electroplating copper foil.
  269. Goffredo Daniel L. (Riverton NJ) Meyer Walter J. (Berlin DEX) Blising Horst (Berlin DEX), Process and apparatus for plating onto articles.
  270. Tamminen Pentti (Espoo FIX), Process and apparatus for separating metals from solutions.
  271. Blackwell Kim J. (Owego NY) Matienzo Luis J. (Endicott NY) Knoll Allan R. (Endicott NY), Process for creating organic polymeric substrate with copper.
  272. Simpson Cindy Reidsema ; Herrick Matthew T. ; Etherington Gregory S. ; Legg James Derek, Process for depositing a layer of material over a substrate.
  273. Makkaev Almaxud M. (ulitsa Zolotodolinskaya ; 29 ; kv. 308 Novosibirsk SUX) Lomovsky Oleg I. (ulitsa Ostrovskogo ; 101a ; kv. 22 Berdsk Novosibirskoi oblasti SUX) Mikhailov Jury I. (ulitsa Maltseva ;, Process for electrochemical metallization of dielectrics.
  274. Ohtani Hisashi,JPX ; Fukunaga Takeshi,JPX ; Miyanaga Akiharu,JPX, Process for fabricating semiconductor device.
  275. Gelatos Avgerinos V. (Austin TX) Fiordalice Robert W. (Austin TX), Process for forming copper interconnect structure.
  276. Gilton Terry L. (Boise ID) Tuttle Mark E. (Boise ID) Cathey David A (Boise ID), Process for metallizing integrated circuits with electrolytically-deposited copper.
  277. Carey David H. (Austin TX) Burger David J. (St. Paul MN), Process for producing electrical circuits with precision surface features.
  278. Lindsay Jeffrey Dean ; Burazin Mark Alan, Process for producing high-bulk tissue webs using nonwoven substrates.
  279. Gross Michal Edith ; Lingk Christoph, Process for semiconductor device fabrication having copper interconnects.
  280. Hirai Eiji (Tokyo JPX) Kurosawa Kazuyoshi (Tokyo JPX) Matsumura Yoshio (Tokyo JPX), Process for surface treatment titanium-containing metallic material.
  281. Larson Gary B., Process for the manufacture of printed circuit boards.
  282. Peeters Joris Antonia Franciscus,BEX ; Vandam Louis Joseph,BEX ; Allaert Koenraad Juliaan Georges,BEX ; Ackaert Ann Marie,BEX ; Van Calster Andre Michel,BEX ; Vereeken Maria Eugenie Andre,BEX ; Zhang, Process to create metallic stand-offs on an electronic circuit.
  283. Davis Cecil J. (Greenville TX) Matthews Robert T. (Plano TX) York Rudy L. (Plano TX) Luttmer Joseph D. (Richardson TX) Jakubik Dwain R. (Palmer TX) Hunter James B. (Dallas TX), Processing apparatus and method.
  284. Zila Vladimir,CAX ; Berner Robert W. ; Woodruff Daniel J., Processing head for semiconductor processing machines.
  285. Anderson Roger N. (San Jose CA), Profiled substrate heating.
  286. Schacham-Diamand Yosef ; Dubin Valery M. ; Ting Chiu H. ; Zhao Bin ; Vasudev Prahalad K. ; Desilva Melvin, Protected encapsulation of catalytic layer for electroless copper interconnect.
  287. Dubin Valery ; Ting Chiu ; Cheung Robin W., Pulse electroplating copper or copper alloys.
  288. Herko Joseph Michael (Boca Raton FL) Joyce James Maurice (Boca Raton FL), Pulse width modulated voltage regulator-converter/power converter having push-push regulator-converter means.
  289. Giras Theo C. (Allegheny County PA) Profeta Joseph A. (Allegheny County PA) Romano Dario (Salerno ITX) Elm Joseph P. (Allegheny County PA), Railway car retarder system.
  290. Gronet Christian M. (Palo Alto CA) Gibbons James F. (Palo Alto CA), Rapid thermal heating apparatus and method.
  291. Subrahmanyan Suchitra ; Chen Liang-Yuh ; Mosely Roderick Craig, Reactive preclean prior to metallization for sub-quarter micron application.
  292. Woodruff Daniel J. ; Hanson Kyle M., Reactor assembly and method of assembly.
  293. Woodruff Daniel J. ; Hanson Kyle M., Reactor vessel having improved cup anode and conductor assembly.
  294. Daniel J. Woodruff ; Kyle M. Hanson, Reactor vessel having improved cup, anode and conductor assembly.
  295. Daniel J. Woodruff ; Kyle M. Hanson, Reactor vessel having improved cup, anode and conductor assembly.
  296. Woodruff Daniel J. ; Hanson Kyle M., Reactor vessel having improved cup, anode and conductor assembly.
  297. Daniel J. Woodruff ; Kyle M. Hanson, Reactor vessel having improved cup, anode, and conductor assembly.
  298. Lowery Kenneth J. (San Dimas CA), Reciprocating anode electrolytic plating apparatus and method.
  299. Akimoto Masami (Kikuyo JPX) Kimura Yoshio (Kumamoto JPX) Hirakawa Osamu (Kumamoto JPX) Anai Noriyuki (Kumamoto JPX) Tateyama Masanori (Kumamoto JPX) Sakamoto Yasuhiro (Kumamoto JPX), Resist process apparatus.
  300. Tateyama Kiyohisa (Kumamoto JPX) Akimoto Masami (Kumamoto JPX) Ushijima Mitsuru (Tama JPX), Resist processing method.
  301. Early Stephen R. (Beaverton OR) Grogan Daniel (Portland OR), Rhodium capped gold IC metallization.
  302. Tepolt Gary B., Robotic wafer handler.
  303. Schmidt Wayne J. ; Oberlitner Thomas H., Robots for microelectronic workpiece handling.
  304. Grandia Johannes (San Jose CA) O\Kane Daniel F. (Morgan Hill CA) Santini Hugo A. E. (San Jose CA), Rotary electroplating cell with controlled current distribution.
  305. Arken David M. ; Chiu Andrew ; Fatula ; Jr. Joseph John ; Hitzfield Robert William ; Hsiao Wen-Chien David ; Hsiao Yiping, Rotary plater with radially distributed plating solution.
  306. Johnson Lanny L., Rotatable retractor.
  307. Schumann Frank (Machern DDX), Rotational switching apparatus with separately driven stitching head.
  308. Morrissey, Denis; Merricks, David; Barstad, Leon R.; Step, Eugene N.; Calvert, Jeffrey M.; Schetty, III, Robert A.; Shelnut, James G.; Lefebvre, Mark; Bayes, Martin W.; Storjohann, Donald E., Seed layer repair method.
  309. Zhao Bin (Austin TX) Vasudev Prahalad K. (Austin TX) Dubin Valery M. (Cupertino CA) Shacham-Diamand Yosef (Ithaca NY) Ting Chiu H. (Saratoga CA), Selective electroless copper deposited interconnect plugs for ULSI applications.
  310. Poris Jaime (409 Capitola Ave. Capitola CA 95010), Selective metal electrodeposition process.
  311. Poris Jaime (21955 Bear Creek Way Los Gatos CA 95030), Selective metal electrodeposition process and apparatus.
  312. Ahmad Umar M. (Hopewell Junction NY) Berger Daniel G. (Poughkeepsie NY) Kumar Ananda (Hopewell Junction NY) LaMaire Susan J. (Yorktown Heights NY) Prasad Keshav B. (New Paltz NY) Ray Sudipta K. (Wapp, Selective plating method for forming integral via and wiring layers.
  313. Bacon Duane E. (Lee\s Summit MO) Gattermeir J. David (Lee\s Summit MO) Hrivnak Bonnie J. (Kansas City MO), Selectively treating an article.
  314. Stone W. Porter (Walpole NH), Self-calibrating thermometer.
  315. Takagi Hideo,JPX ; Futo Wataru,JPX, Semiconductor device manufacturing method.
  316. Ritzdorf Thomas L. ; Turner Jeffrey I. ; Graham Lyndon W., Semiconductor plating bowl and method using anode shield.
  317. Bleck Martin C. ; Graham Lyndon W. ; Hanson Kyle M., Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielect.
  318. Hanson Kyle ; Dix Mark ; Zila Vladimir,CAX ; Woodruff Daniel J., Semiconductor processing apparatus having lift and tilt mechanism.
  319. Hanson, Kyle; Dix, Mark; Zila, Vladimir; Woodruff, Daniel J., Semiconductor processing apparatus having lift and tilt mechanism.
  320. Hanson, Kyle; Dix, Mark; Woodruff, Daniel J.; Schmidt, Wayne J.; Coyle, Kevin W., Semiconductor processing apparatus having linear conveyer system.
  321. Reardon Timothy J. (Kalispell MT) Meuchel Craig P. (Kalispell MT) Oberlitner Thomas H. (Kalispell MT), Semiconductor processing spray coating apparatus.
  322. Thompson Raymon F. (Kalispell MT) Berner Robert W. (Kalispell MT) Curtis Gary L. (Kalispell MT) Culliton Stephen P. (Bozeman MT) Wright Blaine G. (Kalispell MT) Byle Darryl S. (Kalispell MT) Pedersen, Semiconductor processing system with wafer container docking and loading station.
  323. Thompson Raymon F. (Kalispell MT) Berner Robert W. (Kalispell MT) Curtis Gary L. (Kalispell MT) Culliton Stephen P. (Bozeman MT) Wright Blaine G. (Kalispell MT), Semiconductor processing systems.
  324. Bergman Eric J. (Kalispell MT) Oberlitner Thomas H. (Whitefish MT), Semiconductor processing with non-jetting fluid stream discharge array.
  325. Bergman Eric J. (Kalispell MT) Oberlitner Thomas H. (Whitefish MT), Semiconductor processing with non-jetting fluid stream discharge array.
  326. Hanson Kyle M., Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces.
  327. Bergman Eric J. (Kalispell MT) Reardon Timothy J. (Kalispell MT) Thompson Raymon F. (Lakeside MT) Owczarz Aleksander (Kalispell MT), Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization.
  328. Thompson Raymon F. (Kalispell MT) Owczarz Aleksander (Kalispell MT), Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers.
  329. Bleck Martin C. ; Reardon Timothy J. ; Bergman Eric J., Semiconductor processor with wafer face protection.
  330. Taniguchi Takao (Fukuoka JPX) Sato Hiroshi (Fukuoka JPX), Semiconductor substrate transport arm for semiconductor substrate processing apparatus.
  331. Miyamoto Saburo,JPX ; Ametani Minoru,JPX, Semiconductor wafer loading and unloading apparatus, and semiconductor wafer transport containers for use therewith.
  332. Thompson Raymon F. (Lakeside MT) Berner Robert W. (Kalispell MT) Curtis Gary L. (Kila MT) Culliton Stephen P. (Kalispell MT) Wright Blaine G. (Whitefish MT), Semiconductor wafer processing system.
  333. Whitehurst Marshal L. (Indianapolis IN), Shield for plating substrate.
  334. Kuriyama Atsushi (Tokyo JPX), Silicon oxide film growing apparatus.
  335. Kato Kazuo (Hino JPX) Watanabe Yoshikazu (Hino JPX) Kumashiro Kenji (Hino JPX) Shimba Satoru (Hino JPX), Silver halide color photographic light-sensitive material.
  336. Tanaka Shinri,JPX ; Nagato Michiko,JPX, Silver halide light-sensitive color photographic material.
  337. Thompson Raymon F. (Kalispell MT) Gordon Robert W. (Seattle WA) Durado Daniel (Kalispell MT), Single wafer processor.
  338. Thompson Raymon F. (Kalispell MT) Owczarz Aleksander (Kalispell MT), Single wafer processor apparatus.
  339. Thompson Raymon F. (Kalispell MT) Owczarz Aleksander (Kalispell MT), Single wafer processor with a bowl.
  340. Thompson Raymon F. (Kalispell MT) Owczarz Aleksander (Kalispell MT), Single wafer processor with a frame.
  341. Miles Rodney (P.O. Box 38-3462 Waikoloa HI 96738-3462), Sport fishing tackle box.
  342. Schilling Donald L. (Sands Point NY), Spread spectrum CDMA communications system microwave overlay.
  343. Messer Mark G. (Los Gatos CA) Stark Lawrence R. (San Jose CA), Sputter module for modular wafer processing system.
  344. Sandhu Gurtej S. (Boise ID) Kim Sung C. (Boise ID) Kubista David J. (Nampa ID), Sputtering with collinator cleaning within the sputtering chamber.
  345. Rathore Hazara S. ; Dalal Hormazdyar M. ; McLaughlin Paul S. ; Nguyen Du B. ; Smith Richard G. ; Swinton Alexander J. ; Wachnik Richard A., Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity.
  346. Matsunaga Minobu (Kyoto JPX) Mizohata Yasuhiro (Kyoto JPX), Substrate cooling device and substrate heat-treating apparatus.
  347. Brinket Oscar J. (3816 Montego Dr. Huntington Beach CA 92649) Brinket Brian C. (3816 Montego Dr. Huntington Beach CA 92649), Substrate plating device having laminar flow.
  348. Harada Junji (Kumamoto JPX) Harada Ichiro (Kumamoto JPX) Nakamura Koji (Kumamoto JPX), Substrate processing method and substrate processing apparatus.
  349. Mayur Abhilash ; Stern Lewis A. ; White Anthony, Substrate support for a thermal processing chamber.
  350. Ueda Issei,JPX ; Akimoto Masami,JPX ; Kudou Hiroyuki,JPX, Substrate transfer apparatus.
  351. Ueyama Tsutomu (Kyoto JPX) Adachi Hideki (Kyoto JPX) Matsumura Yoshio (Hikone JPX) Tanaka Yasuhide (Kyoto JPX), Subtrate processing apparatus and device for and method of exchanging substrate in substrate processing apparatus.
  352. Tateyama Kiyohisa (Kumamoto JPX) Hasebe Keizo (Kofu JPX), System and method for applying a liquid.
  353. Blomsterberg Karl-Ingemar (Nansensgatan 38 S-417 19 Gothenburg SEX), System and method for electrolytic deburring.
  354. Inaba Hajimu (Hino JPX) Sakakibara Shinsuke (Komae JPX) Inagaki Shigemi (Musashino JPX) Torii Nobutoshi (Hachioji JPX), System for controlling an industrial robot.
  355. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.
  356. Schwartz Vladimir ; Schwartz Michael ; Dagan Doron ; Bierwagen Klaus M. ; Blazo Ronald E., System for forming nickel stampers utilized in optical disc production.
  357. Olbrich Herbert (Rutesheim DEX) Gentischer Joseph (Remshalden DEX) Fruhauf Wolfgang (Gerlingen DEX) Dorner Johann (Deizizau DEX) Breitschwerdt Gnther (Stuttgart DEX) Kunze-Concewitz Horst (Wiernsheim, System for manufacturing semiconductor substrates.
  358. Litteral Mary O. (Kokomo IN), System for performing work on workpieces.
  359. Woodruff, Daniel J.; Harris, Randy, TRANSFER DEVICES FOR HANDLING MICROELECTRONIC WORKPIECES WITHIN AN ENVIRONMENT OF A PROCESSING MACHINE AND METHODS OF MANUFACTURING AND USING SUCH DEVICES IN THE PROCESSING OF MICROELECTRONIC WORKPIE.
  360. Cabral ; Jr. Cyril (Ossining NY) Colgan Evan George (Suffern NY) Grill Alfred (White Plains NY), Thin film multi-layer oxygen diffusion barrier consisting of aluminum on refractory metal.
  361. Kimata Kazuo,JPX ; Kato Katsuhiko,JPX, Thin substrate transferring apparatus.
  362. Michiya Arakawa (Nagoya JPX) Toshikatsu Takada (Nagoya JPX), Thin-film condenser.
  363. Shimauchi Hidenori (Takatsuki JPX) Suzuki Keijiro (Tokyo JPX), Tin whisker-free tin or tin alloy plated article and coating technique thereof.
  364. Trokhan Paul D. (Hamilton OH), Tissue paper.
  365. Oda Yoshimasa (Narashino JPX) Koyano Shinji (Narashino JPX) Harada Akinobu (Narashino JPX), Transferring device.
  366. Komino Mitsuaki (Tokyo JPX), Treatment apparatus control method.
  367. Ono Yuji (Sagamihara JPX) Mihara Katsuhiko (Hachioji JPX), Treatment system including a plurality of treatment apparatus.
  368. Hawes John M. (Appleton WI), Triple layer papermaking fabric including top and bottom weft yarns interwoven with a warp yarn system.
  369. Dubin Valery M. (Cupertino CA) Schacham-Diamand Yosi (Ithaca NY) Zhao Bin (Irvine CA) Vasudev Prahalad K. (Austin TX) Ting Chiu H. (Saratoga CA), Use of cobalt tungsten phosphide as a barrier material for copper metallization.
  370. Shieh Chan-Long (Paradise Valley AZ) Lungo John (Mesa AZ) Lebby Michael S. (Apache Junction AZ), VCSEL with an intergrated heat sink and method of making.
  371. Kato Shigekazu (Kudamatsu JPX) Tamura Naoyuki (Kudamatsu JPX) Nishihata Kouji (Tokuyama JPX) Tsubone Tsunehiko (Hikari JPX) Itou Atsushi (Kudamatsu JPX), Vacuum processing system.
  372. Reed Ronald G. (Colorado Springs CO), Variable size segmented anode array for electroplating.
  373. Nishi Hironobu (Sagamihara JPX), Vertical heat-treating apparatus.
  374. Asano Takanobu (Yokohama JPX) Kitayama Hirofumi (Aikawa JPX) Iwai Hiroyuki (Sagamihara JPX) Ono Yuuji (Sagamihara JPX), Vertical heat-treatment apparatus having a wafer transfer mechanism.
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  384. Hsieh Ming-Hsun (Taichung TWX) Chang Chung-Shu (Hsinchu TWX), Workpiece holder apparatus.
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  6. Ho, Andrew; Chan, Bryan; Lin, Craig; Sprague, Robert A., Display devices with grooved luminance enhancement film.
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