초록 ▼

A semiconductor device having a semiconductor element (a thin film transistor, a thin film diode, a photoelectric conversion element of silicon PIN junction, or a silicon resistor element) which is light-weight, flexible (bendable), and thin as a whole is provided as well as a method of manufacturin

A semiconductor device having a semiconductor element (a thin film transistor, a thin film diode, a photoelectric conversion element of silicon PIN junction, or a silicon resistor element) which is light-weight, flexible (bendable), and thin as a whole is provided as well as a method of manufacturing the semiconductor device. In the present invention, the element is not formed on a plastic film. Instead, a flat board such as a substrate is used as a form, the space between the substrate (third substrate (17)) and a layer including the element (peeled layer (13)) is filled with coagulant (typically an adhesive) that serves as a second bonding member (16), and the substrate used as a form (third substrate (17)) is peeled off after the adhesive is coagulated to hold the layer including the element (peeled layer (13)) by the coagulated adhesive (second bonding member (16)) alone. In this way, the present invention achieves thinning of the film and reduction in weight.

대표청구항 ▼

What is claimed is: 1. A method of manufacturing a semiconductor device, comprising steps of: forming a first layer comprising a first material over a first substrate; forming a second layer comprising a second material on the first layer; forming an element layer that includes a semiconductor elem

What is claimed is: 1. A method of manufacturing a semiconductor device, comprising steps of: forming a first layer comprising a first material over a first substrate; forming a second layer comprising a second material on the first layer; forming an element layer that includes a semiconductor element over the second layer; bonding a second substrate to the element layer using a first bonding member to sandwich the element layer between the first substrate and the second substrate; separating the first substrate and the first layer from the second layer; bonding a third substrate to the second layer using a second bonding member to sandwich the element layer between the second substrate and the third substrate; separating at least the second from the element layer; and separating at least the entire third substrate from the element layer. 2. A method according to claim 1, wherein the second substrate is separated from the element layer by dissolving the first bonding member with a solvent. 3. A method according to claim 1, wherein the second bonding member adheres to the element layer at a stronger adhesion than its adhesion to the third substrate. 4. A method according to claim 1, wherein the first bonding member is a photosensitive bonding member and the second substrate is separated from the element layer by irradiating the first bonding member with light. 5. A method according to claim 1, wherein the second bonding member is a photosensitive bonding member. 6. A method according to claim 1, wherein one of a glass substrate, a quartz substrate, and a metal substrate is used for the first substrate and the second substrate whereas the third substrate is a plastic substrate. 7. A method according to claim 1, wherein the third substrate is a plastic film with a film that contains aluminum, oxygen and nitrogen formed on its surface. 8. A method of manufacturing a semiconductor device, comprising steps of: forming a first layer comprising a first material over a first substrate; forming a second layer comprising a second material on the first layer; forming an element layer that includes a semiconductor element over the second layer; bonding a second substrate to the second layer with a first bonding member interposed therebetween so as to sandwich the element layer between the first substrate and the second substrate; separating the first substrate and the first layer from the second layer; bonding a third substrate to the element layer with a second bonding member interposed therebetween so as to sandwich the element layer between the second substrate and the third substrate; separating at least the second substrate front element layer; and separating at least the entire third substrate from the element layer. 9. A method according to claim 8, wherein the first bonding member adheres to the element layer at a stronger adhesion than its adhesion to the second substrate. 10. A method according to claim 8, wherein the second bonding member is a photosensitive bonding member and the third substrate is separated from the second bonding member by irradiating the member with light. 11. A method according to claim 8, wherein the first bonding member is a photosensitive bonding member and the second substrate is separated from the first bonding member by irradiating the first bonding member with light. 12. A method according to claim 8, wherein one of a glass substrate and a quartz substrate is used for the first substrate. 13. A method according to claim 8, wherein the second substrate is a plastic film with a film that contains aluminum, oxygen and nitrogen formed on its surface. 14. A method according to claim 8, wherein the third substrate is a plastic film with a film that contains aluminum, oxygen and nitrogen on its surface. 15. A method of manufacturing a semiconductor device, comprising: forming a first layer comprising a first material over a first substrate; forming a second layer comprising a second material on the first layer; forming a peeled layer that includes a semiconductor element over the second layer; bonding a second substrate to the peeled layer using a first bonding member to sandwich the peeled layer between the first substrate and the second substrate; separating the first substrate and the first layer from the second layer: bonding a third substrate to the second layer using a second bonding member to sandwich the peeled layer between the second substrate and the third substrate; separating the second substrate from the peeled layer to form the peeled layer that uses the second bonding member as a supporter; and separating at least the entire third substrate from the peeled layer. 16. A method according to claim 15, wherein the material of the first substrate and second substrate has a rigidity higher than the rigidity of the third substrate. 17. A method according to claim 15, wherein the second substrate is separated from the peeled layer by dissolving the first bonding member with a solvent to remove the member. 18. A method according to claim 15, wherein the first bonding member is a photosensitive bonding member and the second substrate is separated from the peeled layer by irradiating the first bonding member with light. 19. A method according to claim 1, further comprising forming a protective film on the second bonding member. 20. A method according to claim 1, further comprising forming a protective film on the second bonding member, wherein the protective film is one of silicon nitride film and a silicon oxynitride film. 21. A method of manufacturing a semiconductor device, comprising steps of: forming a first layer comprising a first material over a first substrate; forming a second layer comprising a second material on the first layer; forming an element layer that includes a semiconductor element over the second layer; bonding a second substrate to the element layer using a first bonding member to sandwich the element layer between the first substrate and the second substrate; separating the first substrate and the first layer from the second layer; bonding a third substrate to the second layer using a second bonding member to sandwich the element layer between the second substrate and the third substrate; separating the element layer from the second substrate by removing the first bonding member; and separating at least the entire third substrate from the element layer. 22. A method according to claim 21 wherein the first bonding member is attached to the separated element layer. 23. A method according to claim 21 wherein the third substrate is attached to the separated element layer with the second bonding member. 24. A method according to claim 21 further comprising a step of forming a protective film between the third substrate and the second bonding member. 25. A method according to claim 21 wherein a protective film is attached to the separated element layer with the second bonding member. 26. A method of manufacturing a semiconductor device, comprising steps of: forming a first layer comprising a first material over a first substrate; forming a second layer comprising a second material on the first layer; forming an element layer that includes a semiconductor element over the second layer; bonding a second substrate to the element layer with a first bonding member interposed therebetween so as to sandwich the element layer between the first substrate and the second substrate; separating the first substrate and the first layer from the second layer; bonding a third substrate to the second layer with a second bonding member interposed therebetween to sandwich the element layer between the second substrate and the third substrate; separating at least the second substrate and the first bonding member from the element layer; and separating at least the entire third substrate from the element layer. 27. A method according to claim 26, wherein in the material of the first substrate and second substrate has a rigidity higher than the rigidity of the third substrate. 28. A method according to claim 26, wherein the second substrate is separated from the element layer by dissolving the first bonding member with a solvent to remove the member. 29. A method according claim 26, wherein the first bonding member is a photosensitive bonding member and the second substrate separated from the peeled layer by irradiating the first bonding member with light.